PCB DRILLING DETAILS
ORDERING INFORMATION
TECHNICAL SPECIFICATIONS
MATERIAL
SHELL
INSULATORS
:
:
STEEL TIN /Zinc Cr 3 PLATED.
SELF EXTINGUISHING BLACK POLYESTER UL CLASS 94V0
THE HOUSING WILL WITHSTAND EXPOSURE TO 260-265°C
IF WE USE PROTECTIVE ADHESIVE (type Kapton or Teflon)
OR PROTECTIVE METALLIC DEVICE
CONTACTS
:
COPPER ALLOY
I
SERIES
D
2
5
P
3
3
E
4
G
X
0
0
L
F
LEAD FREE
NO.OF CONTACTS
09,15,25 & 37
TYPE OF CONTACTS
P-PIN
SPECIAL CODE
00->STANDARD
PLATING
ACTIVE ZONE
TERMINATION ZONE
METAL BRACKET
FOR LEAD FREE PLATING
:
:
:
:
GOLD OVER NICKEL
TIN LEAD OVER NICKEL
BRASS,TIN/Zinc Cr 3 PLATED.
2
µ
MIN.MATTE TIN TOP OVER
1.27
µ
MIN.NICKEL UNDER PLATE(ON TERMINATION ZONE)
HARPOON
CLINCH NUT
:
:
BRASS,TIN PLATED.
BRASS,TIN/Zinc Cr 3 PLATED.
TYPE OF TERMINATION
33-ANGLED SPILL
PITCH 2.84 USA
FOOT PRINT 8.08 USA
MOUNTING OPTIONS
GX->HARPOON+INSERT UNC 4 40+METAL BRACKET
GL->HARPOON+INSERTM3+METAL BRACKET
GV->HARPOON+FEMALE SCREW LOCK UNC 4 40+METAL BRACKET
PLATING
GV VERSION
4->FLASH Au+Sn/SnPb
6->0.76
µ
Au+Sn/SnPb
ELECTRICAL DATA
MAX.CURRENT RATING
TEST VOLTAGE
RATED VOLTAGE
CONTACT RESISTANCE
SHELL RESISTANCE
INSULATION RESISTANCE
:
:
:
:
:
:
5A
1000V
300V
< 25m
Ω
< 5m
Ω
> 5000M
Ω
HEIGHT OF TERMINATION
"This LF product meets European Union Directives and other country
regulations as described in GS-22-008"
The housing will withstand exposure to 260°C peak temperature for 3.5 seconds
in a wave solder application with a 1.6mm minimum thick circuit board.
Packaging as per GS-14-920
E-3.18 US STANDARD
ENVIRONMENTAL CHARACTERISTICS.
OPERATING TEMPERATURE RANGE
:
-55°C +125°C
GX/GL VERSION
DELTA-D
D
I06-0074
I09-0039
GVJ
AS
E
2006/06/08
2009/03/16
0°±1°
GEORGE.V.JOSEPH
GEORGE.V.JOSEPH
ANISH.SALAM
ANISH.SALAM
E
1
.00±0.1
.000±.00X
1998/12/16
1998/12/16
2009/03/16
2009/03/16
MECHANICAL CHARACTERISTICS
MATING/UNMATING CYCLES (MIN)
INSERTION/EXTRACTION FORCE PER CONTACT
:
:
:
200 (FLASH Au);
500 (0.76µ Au)
5 N Max./ 0.3 N Min.
C-DD-0027
6
PDM: Rev:E
STATUS:
Released
Printed: Jan 18, 2011
.
京公网安备 11010802033920号
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved
电子工程世界
