Consumer Circuit, ROHS COMPLIANT, QFN-48
参数名称 | 属性值 |
是否无铅 | 不含铅 |
是否Rohs认证 | 符合 |
厂商名称 | IDT (Integrated Device Technology) |
零件包装代码 | QFN |
包装说明 | ROHS COMPLIANT, QFN-48 |
针数 | 48 |
Reach Compliance Code | compliant |
商用集成电路类型 | CONSUMER CIRCUIT |
JESD-30 代码 | S-XQCC-N48 |
JESD-609代码 | e3 |
长度 | 7 mm |
湿度敏感等级 | 3 |
功能数量 | 1 |
端子数量 | 48 |
最高工作温度 | 70 °C |
最低工作温度 | |
封装主体材料 | UNSPECIFIED |
封装代码 | HVQCCN |
封装形状 | SQUARE |
封装形式 | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
峰值回流温度(摄氏度) | 260 |
认证状态 | Not Qualified |
座面最大高度 | 1 mm |
最大供电电压 (Vsup) | 5.25 V |
最小供电电压 (Vsup) | 4.75 V |
表面贴装 | YES |
温度等级 | COMMERCIAL |
端子面层 | MATTE TIN |
端子形式 | NO LEAD |
端子节距 | 0.5 mm |
端子位置 | QUAD |
处于峰值回流温度下的最长时间 | 30 |
宽度 | 7 mm |
92HD91B1X5NLGXYYX | 92HD91B1X5NLGXYYX8 | 92HD91B2X5NLGXYYX8 | 92HD91B2X5NLGXYYX | |
---|---|---|---|---|
描述 | Consumer Circuit, ROHS COMPLIANT, QFN-48 | Consumer Circuit, ROHS COMPLIANT, QFN-48 | Consumer Circuit, ROHS COMPLIANT, QFN-48 | Consumer Circuit, ROHS COMPLIANT, QFN-48 |
是否无铅 | 不含铅 | 不含铅 | 不含铅 | 不含铅 |
是否Rohs认证 | 符合 | 符合 | 符合 | 符合 |
厂商名称 | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) |
零件包装代码 | QFN | QFN | QFN | QFN |
包装说明 | ROHS COMPLIANT, QFN-48 | ROHS COMPLIANT, QFN-48 | ROHS COMPLIANT, QFN-48 | ROHS COMPLIANT, QFN-48 |
针数 | 48 | 48 | 48 | 48 |
Reach Compliance Code | compliant | compliant | compliant | compliant |
商用集成电路类型 | CONSUMER CIRCUIT | CONSUMER CIRCUIT | CONSUMER CIRCUIT | CONSUMER CIRCUIT |
JESD-30 代码 | S-XQCC-N48 | S-XQCC-N48 | S-XQCC-N48 | S-XQCC-N48 |
JESD-609代码 | e3 | e3 | e3 | e3 |
长度 | 7 mm | 7 mm | 7 mm | 7 mm |
湿度敏感等级 | 3 | 3 | 3 | 3 |
功能数量 | 1 | 1 | 1 | 1 |
端子数量 | 48 | 48 | 48 | 48 |
最高工作温度 | 70 °C | 70 °C | 70 °C | 70 °C |
封装主体材料 | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED |
封装代码 | HVQCCN | HVQCCN | HVQCCN | HVQCCN |
封装形状 | SQUARE | SQUARE | SQUARE | SQUARE |
封装形式 | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
峰值回流温度(摄氏度) | 260 | 260 | 260 | 260 |
认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
座面最大高度 | 1 mm | 1 mm | 1 mm | 1 mm |
最大供电电压 (Vsup) | 5.25 V | 5.25 V | 5.25 V | 5.25 V |
最小供电电压 (Vsup) | 4.75 V | 4.75 V | 4.75 V | 4.75 V |
表面贴装 | YES | YES | YES | YES |
温度等级 | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL |
端子面层 | MATTE TIN | MATTE TIN | MATTE TIN | MATTE TIN |
端子形式 | NO LEAD | NO LEAD | NO LEAD | NO LEAD |
端子节距 | 0.5 mm | 0.5 mm | 0.5 mm | 0.5 mm |
端子位置 | QUAD | QUAD | QUAD | QUAD |
处于峰值回流温度下的最长时间 | 30 | 30 | 30 | 30 |
宽度 | 7 mm | 7 mm | 7 mm | 7 mm |
电子工程世界版权所有 京B2-20211791 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号 Copyright © 2005-2024 EEWORLD.com.cn, Inc. All rights reserved