8-BIT, MROM, 8MHz, MICROCONTROLLER, PQFP64, 14 X 14 MM, LEAD FREE, QFP-64
| 参数名称 | 属性值 |
| 厂商名称 | NXP(恩智浦) |
| 零件包装代码 | QFP |
| 包装说明 | QFP, |
| 针数 | 64 |
| Reach Compliance Code | unknown |
| ECCN代码 | 3A991.A.2 |
| 具有ADC | YES |
| 其他特性 | ALSO OPERATES AT 3.3V SUPPLY @ 4MHZ |
| 地址总线宽度 | |
| 位大小 | 8 |
| 最大时钟频率 | 32 MHz |
| DAC 通道 | NO |
| DMA 通道 | NO |
| 外部数据总线宽度 | |
| JESD-30 代码 | S-PQFP-G64 |
| 长度 | 14 mm |
| I/O 线路数量 | 53 |
| 端子数量 | 64 |
| 最高工作温度 | 105 °C |
| 最低工作温度 | -40 °C |
| PWM 通道 | YES |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | QFP |
| 封装形状 | SQUARE |
| 封装形式 | FLATPACK |
| 认证状态 | Not Qualified |
| ROM可编程性 | MROM |
| 座面最大高度 | 2.45 mm |
| 速度 | 8 MHz |
| 最大供电电压 | 5.5 V |
| 最小供电电压 | 4.5 V |
| 标称供电电压 | 5 V |
| 表面贴装 | YES |
| 技术 | CMOS |
| 温度等级 | INDUSTRIAL |
| 端子形式 | GULL WING |
| 端子节距 | 0.8 mm |
| 端子位置 | QUAD |
| 宽度 | 14 mm |
| uPs/uCs/外围集成电路类型 | MICROCONTROLLER |
| MC68HC08GR32AVFUE | MC68HC08GR32ACFJE | MC68HC08GR32ACFUE | |
|---|---|---|---|
| 描述 | 8-BIT, MROM, 8MHz, MICROCONTROLLER, PQFP64, 14 X 14 MM, LEAD FREE, QFP-64 | 8-BIT, MROM, 8MHz, MICROCONTROLLER, PQFP32, 7 X 7 MM, 1.40 MM HEIGHT, 0.80 MM PITCH, LEAD FREE, MS-026BBA, LQFP-32 | 8-BIT, MROM, 8MHz, MICROCONTROLLER, PQFP64, 14 X 14 MM, LEAD FREE, QFP-64 |
| 厂商名称 | NXP(恩智浦) | NXP(恩智浦) | NXP(恩智浦) |
| 零件包装代码 | QFP | QFP | QFP |
| 包装说明 | QFP, | LQFP, | QFP, |
| 针数 | 64 | 32 | 64 |
| Reach Compliance Code | unknown | unknown | unknown |
| ECCN代码 | 3A991.A.2 | 3A991.A.2 | 3A991.A.2 |
| 具有ADC | YES | YES | YES |
| 其他特性 | ALSO OPERATES AT 3.3V SUPPLY @ 4MHZ | ALSO OPERATES AT 3.3V SUPPLY @ 4MHZ | ALSO OPERATES AT 3.3V SUPPLY @ 4MHZ |
| 位大小 | 8 | 8 | 8 |
| 最大时钟频率 | 32 MHz | 32 MHz | 32 MHz |
| DAC 通道 | NO | NO | NO |
| DMA 通道 | NO | NO | NO |
| JESD-30 代码 | S-PQFP-G64 | S-PQFP-G32 | S-PQFP-G64 |
| 长度 | 14 mm | 7 mm | 14 mm |
| I/O 线路数量 | 53 | 21 | 53 |
| 端子数量 | 64 | 32 | 64 |
| 最高工作温度 | 105 °C | 85 °C | 85 °C |
| 最低工作温度 | -40 °C | -40 °C | -40 °C |
| PWM 通道 | YES | YES | YES |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | QFP | LQFP | QFP |
| 封装形状 | SQUARE | SQUARE | SQUARE |
| 封装形式 | FLATPACK | FLATPACK, LOW PROFILE | FLATPACK |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified |
| ROM可编程性 | MROM | MROM | MROM |
| 座面最大高度 | 2.45 mm | 1.6 mm | 2.45 mm |
| 速度 | 8 MHz | 8 MHz | 8 MHz |
| 最大供电电压 | 5.5 V | 5.5 V | 5.5 V |
| 最小供电电压 | 4.5 V | 4.5 V | 4.5 V |
| 标称供电电压 | 5 V | 5 V | 5 V |
| 表面贴装 | YES | YES | YES |
| 技术 | CMOS | CMOS | CMOS |
| 温度等级 | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL |
| 端子形式 | GULL WING | GULL WING | GULL WING |
| 端子节距 | 0.8 mm | 0.8 mm | 0.8 mm |
| 端子位置 | QUAD | QUAD | QUAD |
| 宽度 | 14 mm | 7 mm | 14 mm |
| uPs/uCs/外围集成电路类型 | MICROCONTROLLER | MICROCONTROLLER | MICROCONTROLLER |
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