bypass capacitor connected between pins 8 and 5 is recommended.
CAUTION: It is advised that normal static precautions be taken in handling and assembly of this component to prevent
damage and/or degradation which may be induced by ESD.
The HCPL-070L and HCPL-073L
are surface mount devices
packaged in an industry standard
SOIC-8 footprint.
The SOIC-8 does not require
"through holes" in a PCB. This
package occupies approximately
one-third the footprint area of the
standard dual-in-line package.
The lead profile is designed to be
compatible with standard surface
mount processes.
Ordering Information
Specify Part Number followed by Option Number (if desired).
Example:
HCPL-270L #XXX
060 = VDE 0884 V
IORM
= 630 V
peak
Option
500 = Tape and Reel Packaging Option
Option data sheets available. Contact your Agilent sales representative
or authorized distributor for information.
Selection Guide
8-Pin DIP (300 Mil)
Single Channel
Dual Channel
Package HCPL-
Package HCPL-
270L
273L
Small Outline SO-8
Single Channel
Dual Channel
Package HCPL-
Package HCPL-
070L
073L
Minimum Input
ON Current (I
F
)
0.5 mA
1.6 mA
Minimum CTR
400%
300%
Schematic
1
+
V
F1
I
F1
I
CC
8
V
CC
V
CC
8
I
CC
2
ANODE
+
V
F
CATHODE
–
3
I
O
6
V
O
I
F
–
2
I
O1
V
O1
7
3
–
V
F2
I
F2
I
O2
6
V
O2
+
4
5
SHIELD
GND
SHIELD
GND
5
I
B
7
VB
USE OF A 0.1 µF BYPASS CAPACITOR CONNECTED
BETWEEN PINS 5 AND 8 IS RECOMMENDED
HCPL-270L/HCPL-070L
HCPL-273L/HCPL-073L
2
Package Outline Drawings
8-Pin DIP Package
9.65 ± 0.25
(0.380 ± 0.010)
TYPE NUMBER
8
7
6
5
7.62 ± 0.25
(0.300 ± 0.010)
6.35 ± 0.25
(0.250 ± 0.010)
OPTION CODE*
DATE CODE
A XXXXZ
YYWW RU
1
1.19 (0.047) MAX.
2
3
4
UL
RECOGNITION
1.78 (0.070) MAX.
+ 0.076
0.254 - 0.051
+ 0.003)
(0.010 - 0.002)
5° TYP.
4.70 (0.185) MAX.
0.51 (0.020) MIN.
2.92 (0.115) MIN.
DIMENSIONS IN MILLIMETERS AND (INCHES).
*MARKING CODE LETTER FOR OPTION NUMBERS
"L" = OPTION 020
OPTION NUMBERS 300 AND 500 NOT MARKED.
1.080 ± 0.320
(0.043 ± 0.013)
0.65 (0.025) MAX.
2.54 ± 0.25
(0.100 ± 0.010)
3
Small Outline SO-8 Package
8
7
6
5
3.937 ± 0.127
(0.155 ± 0.005)
XXX
YWW
5.994 ± 0.203
(0.236 ± 0.008)
TYPE NUMBER
(LAST 3 DIGITS)
DATE CODE
4
PIN ONE
1
0.406 ± 0.076
(0.016 ± 0.003)
2
3
1.270 BSG
(0.050)
*
5.080 ± 0.127
(0.200 ± 0.005)
7°
45° X
0.432
(0.017)
3.175 ± 0.127
(0.125 ± 0.005)
0 ~ 7°
1.524
(0.060)
0.203 ± 0.102
(0.008 ± 0.004)
0.228 ± 0.025
(0.009 ± 0.001)
*
TOTAL PACKAGE LENGTH (INCLUSIVE OF MOLD FLASH)
5.207 ± 0.254 (0.205 ± 0.010)
DIMENSIONS IN MILLIMETERS (INCHES).
LEAD COPLANARITY = 0.10 mm (0.004 INCHES) MAX.
0.305 MIN.
(0.012)
Solder Reflow Temperature Profile (Surface Mount Option Parts)
260
240
220
200
180
160
140
120
100
80
60
40
20
0
0
Regulatory Information
The devices contained in this
data sheet are pending by the
following organizations:
UL
∆T
= 145°C, 1°C/SEC
∆T
= 115°C, 0.3°C/SEC
TEMPERATURE – °C
Approval (pending) under UL
1577, Component Recognition
Program, File E55361.
∆T
= 100°C, 1.5°C/SEC
CSA
1
2
3
4
5
6
7
8
9
10
11
12
Approval (pending) under CSA
Component Acceptance
Notice #5, File CA 88324.
VDE
TIME – MINUTES
(NOTE: USE OF NON-CHLORINE ACTIVATED FLUXES IS HIGHLY RECOMMENDED.)
Approval (pending) according to
VDE 0884/06.92.
4
Insulation and Safety Related Specifications
8-Pin DIP
(300 Mil)
Value
7.1
7.4
0.08
SO-8
Value
4.9
4.8
0.08
Parameter
Minimum External Air
Gap (External Clearance)
Minimum External Tracking
(External Creepage)
Minimum Internal Plastic
Gap (Internal Clearance)
Symbol
L (101)
L (102)
Units
mm
mm
mm
Minimum Internal Tracking
(Internal Creepage)
Tracking Resistance
(Comparative Tracking
Index)
Isolation Group
NA
CTI
200
NA
200
mm
Volts
Conditions
Measured from input terminals to output
terminals, shortest distance through air.
Measured from input terminals to output
terminals, shortest distance path along body.
Through insulation distance, conductor to
conductor, usually the direct distance
between the photoemitter and photodetector
inside the optocoupler cavity.
Measured from input terminals to output
terminals, along internal cavity.
DIN IEC 112/VDE 0303 Part 1.
IIIa
IIIa
Material Group (DIN VDE 0110, 1/89, Table 1).
VDE 0884 Insulation Related Characteristics
Description
Installation classification per DIN VDE 0110/1.89, Table 1
for rated mains voltage
≤
300 V rms
for rated mains voltage
≤
450 V rms
Climatic Classification
Pollution Degree (DIN VDE 0110/1.89)
Maximum Working Insulation Voltage
Input to Output Test Voltage, Method b*
V
PR
= 1.875 x V
IORM
, 100% Production Test with t
P
= 1 sec,
Partial Discharge < 5 pC
Input to Output Test Voltage, Method a*
V
PR
= 1.5 x V
IORM
, Type and Sample Test,
t
P
= 60 sec, Partial Discharge < 5 pC
Highest Allowable Overvoltage*
(Transient Overvoltage, t
ini
= 10 sec)
Safety Limiting Values
(Maximum values allowed in the event of a failure,
also see Figure 11, Thermal Derating curve.)
Case Temperature
Current (Input Current I
F
, P
S
= 0)
Output Power
Insulation Resistance at T
S
, V
IO
= 500 V
Symbol
Characteristic
I-IV
I-III
55/100/21
2
630
1181
Units
V
IORM
V
PR
V
peak
V
peak
V
PR
V
IOTM
945
6000
V
peak
V
peak
T
S
I
S,INPUT
P
S,OUTPUT
R
S
175
400
600
≥
10
9
˚C
mA
mW
Ω
*Refer to the front of the optocoupler section of the current catalog, under Product Safety Regulations section, (VDE 0884), for a detailed description.
Note: Isolation characteristics are guaranteed only within the safety maximum ratings which must be ensured by protective circuits in application.
Definition of interactive projection system:
Interactive projection systems, also known as multimedia interactive projection, are available in floor, wall, and tabletop interactive projection....[详细]
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