QUAD MICROPOWER RAIL-TO-RAIL CMOS OPERATIONAL AMPLIFIER
ALD4701_10 | ALD4701APBL | ALD4701ASBL | ALD4701BPBL | 74LVC2245A_15 | ALD4701PBL | ALD4701SBL | |
---|---|---|---|---|---|---|---|
描述 | QUAD MICROPOWER RAIL-TO-RAIL CMOS OPERATIONAL AMPLIFIER | QUAD MICROPOWER RAIL-TO-RAIL CMOS OPERATIONAL AMPLIFIER | QUAD MICROPOWER RAIL-TO-RAIL CMOS OPERATIONAL AMPLIFIER | QUAD MICROPOWER RAIL-TO-RAIL CMOS OPERATIONAL AMPLIFIER | Octal transceiver with direction pin, 30 series termination resistors; 5 V tolerant input/output; 3-state | QUAD MICROPOWER RAIL-TO-RAIL CMOS OPERATIONAL AMPLIFIER | QUAD MICROPOWER RAIL-TO-RAIL CMOS OPERATIONAL AMPLIFIER |
是否无铅 | - | 不含铅 | 不含铅 | 不含铅 | - | 不含铅 | 不含铅 |
是否Rohs认证 | - | 符合 | 符合 | 符合 | - | 符合 | 符合 |
厂商名称 | - | ALD [Advanced Linear Devices] | ALD [Advanced Linear Devices] | ALD [Advanced Linear Devices] | - | ALD [Advanced Linear Devices] | ALD [Advanced Linear Devices] |
零件包装代码 | - | DIP | SOIC | DIP | - | DIP | SOIC |
包装说明 | - | ROHS COMPLIANT, PLASTIC, DIP-14 | ROHS COMPLIANT, PLASTIC, SOIC-14 | ROHS COMPLIANT, PLASTIC, DIP-14 | - | DIP, | SOP, |
针数 | - | 14 | 14 | 14 | - | 14 | 14 |
Reach Compliance Code | - | unknow | unknow | unknow | - | unknow | unknow |
Is Samacsys | - | N | N | N | - | N | N |
放大器类型 | - | OPERATIONAL AMPLIFIER | OPERATIONAL AMPLIFIER | OPERATIONAL AMPLIFIER | - | OPERATIONAL AMPLIFIER | OPERATIONAL AMPLIFIER |
最大平均偏置电流 (IIB) | - | 0.0003 µA | 0.0003 µA | 0.0003 µA | - | 0.0003 µA | 0.0003 µA |
标称共模抑制比 | - | 83 dB | 83 dB | 83 dB | - | 83 dB | 83 dB |
最大输入失调电压 | - | 2800 µV | 2800 µV | 5800 µV | - | 11000 µV | 11000 µV |
JESD-30 代码 | - | R-PDIP-T14 | R-PDSO-G14 | R-PDIP-T14 | - | R-PDIP-T14 | R-PDSO-G14 |
JESD-609代码 | - | e3 | e3 | e3 | - | e3 | e3 |
长度 | - | 18.285 mm | 8.65 mm | 18.285 mm | - | 18.285 mm | 8.65 mm |
湿度敏感等级 | - | 1 | 1 | 1 | - | 1 | 1 |
负供电电压上限 | - | -5.3 V | -5.3 V | -5.3 V | - | -5.3 V | -5.3 V |
标称负供电电压 (Vsup) | - | -2.5 V | -2.5 V | -2.5 V | - | -2.5 V | -2.5 V |
功能数量 | - | 4 | 4 | 4 | - | 4 | 4 |
端子数量 | - | 14 | 14 | 14 | - | 14 | 14 |
最高工作温度 | - | 70 °C | 70 °C | 70 °C | - | 70 °C | 70 °C |
封装主体材料 | - | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | - | PLASTIC/EPOXY | PLASTIC/EPOXY |
封装代码 | - | DIP | SOP | DIP | - | DIP | SOP |
封装形状 | - | RECTANGULAR | RECTANGULAR | RECTANGULAR | - | RECTANGULAR | RECTANGULAR |
封装形式 | - | IN-LINE | SMALL OUTLINE | IN-LINE | - | IN-LINE | SMALL OUTLINE |
峰值回流温度(摄氏度) | - | 260 | 260 | 260 | - | 260 | 260 |
座面最大高度 | - | 5.08 mm | 1.75 mm | 5.08 mm | - | 5.08 mm | 1.75 mm |
标称压摆率 | - | 0.7 V/us | 0.7 V/us | 0.7 V/us | - | 0.7 V/us | 0.7 V/us |
供电电压上限 | - | 5.3 V | 5.3 V | 5.3 V | - | 5.3 V | 5.3 V |
标称供电电压 (Vsup) | - | 2.5 V | 2.5 V | 2.5 V | - | 2.5 V | 2.5 V |
表面贴装 | - | NO | YES | NO | - | NO | YES |
技术 | - | CMOS | CMOS | CMOS | - | CMOS | CMOS |
温度等级 | - | COMMERCIAL | COMMERCIAL | COMMERCIAL | - | COMMERCIAL | COMMERCIAL |
端子面层 | - | MATTE TIN | MATTE TIN | MATTE TIN | - | MATTE TIN | MATTE TIN |
端子形式 | - | THROUGH-HOLE | GULL WING | THROUGH-HOLE | - | THROUGH-HOLE | GULL WING |
端子节距 | - | 2.54 mm | 1.27 mm | 2.54 mm | - | 2.54 mm | 1.27 mm |
端子位置 | - | DUAL | DUAL | DUAL | - | DUAL | DUAL |
处于峰值回流温度下的最长时间 | - | 10 | 10 | 10 | - | 10 | 10 |
标称均一增益带宽 | - | 700 kHz | 700 kHz | 700 kHz | - | 700 kHz | 700 kHz |
宽度 | - | 7.62 mm | 3.775 mm | 7.62 mm | - | 7.62 mm | 3.775 mm |
Base Number Matches | - | 1 | 1 | 1 | - | 1 | 1 |
电子工程世界版权所有 京B2-20211791 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号 Copyright © 2005-2024 EEWORLD.com.cn, Inc. All rights reserved