IC 8-BIT FLASH METHOD ADC, PARALLEL ACCESS, PDIP20, 0.300 INCH, PLASTIC, DIP-20, Analog to Digital Converter
| 参数名称 | 属性值 |
| 厂商名称 | NXP(恩智浦) |
| 零件包装代码 | DIP |
| 包装说明 | DIP, |
| 针数 | 20 |
| Reach Compliance Code | unknown |
| ECCN代码 | EAR99 |
| 最大模拟输入电压 | 5.1 V |
| 最小模拟输入电压 | -0.1 V |
| 最长转换时间 | 2.5 µs |
| 转换器类型 | ADC, FLASH METHOD |
| JESD-30 代码 | R-PDIP-T20 |
| 长度 | 26.695 mm |
| 最大线性误差 (EL) | 0.39% |
| 模拟输入通道数量 | 1 |
| 位数 | 8 |
| 功能数量 | 1 |
| 端子数量 | 20 |
| 最高工作温度 | 85 °C |
| 最低工作温度 | -40 °C |
| 输出位码 | OFFSET BINARY |
| 输出格式 | PARALLEL, 8 BITS |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | DIP |
| 封装形状 | RECTANGULAR |
| 封装形式 | IN-LINE |
| 认证状态 | Not Qualified |
| 座面最大高度 | 4.06 mm |
| 最大压摆率 | 15 mA |
| 标称供电电压 | 5 V |
| 表面贴装 | NO |
| 技术 | CMOS |
| 温度等级 | INDUSTRIAL |
| 端子形式 | THROUGH-HOLE |
| 端子节距 | 2.54 mm |
| 端子位置 | DUAL |
| 宽度 | 7.62 mm |
| ADC0820CSAN | ADC0820BNED | ADC0820BNEN | ADC0820BSAD | ADC0820BSAN | ADC0820CNED-T | ADC0820CSEF | ADC0820CSAD | ADC0820BSEF | |
|---|---|---|---|---|---|---|---|---|---|
| 描述 | IC 8-BIT FLASH METHOD ADC, PARALLEL ACCESS, PDIP20, 0.300 INCH, PLASTIC, DIP-20, Analog to Digital Converter | IC 8-BIT FLASH METHOD ADC, PARALLEL ACCESS, PDSO20, 0.300 INCH, PLASTIC, SOL-20, Analog to Digital Converter | IC 8-BIT FLASH METHOD ADC, PARALLEL ACCESS, PDIP20, 0.300 INCH, PLASTIC, DIP-20, Analog to Digital Converter | IC 8-BIT FLASH METHOD ADC, PARALLEL ACCESS, PDSO20, 0.300 INCH, PLASTIC, SOL-20, Analog to Digital Converter | IC 8-BIT FLASH METHOD ADC, PARALLEL ACCESS, PDIP20, 0.300 INCH, PLASTIC, DIP-20, Analog to Digital Converter | IC 1-CH 8-BIT FLASH METHOD ADC, PARALLEL ACCESS, PDSO20, 0.300 INCH, PLASTIC, SOL-20, Analog to Digital Converter | IC 8-BIT FLASH METHOD ADC, PARALLEL ACCESS, CDIP20, 0.300 INCH, CERAMIC, DIP-20, Analog to Digital Converter | IC 8-BIT FLASH METHOD ADC, PARALLEL ACCESS, PDSO20, 0.300 INCH, PLASTIC, SOL-20, Analog to Digital Converter | IC 8-BIT FLASH METHOD ADC, PARALLEL ACCESS, CDIP20, 0.300 INCH, CERAMIC, DIP-20, Analog to Digital Converter |
| 厂商名称 | NXP(恩智浦) | NXP(恩智浦) | NXP(恩智浦) | NXP(恩智浦) | NXP(恩智浦) | NXP(恩智浦) | NXP(恩智浦) | NXP(恩智浦) | NXP(恩智浦) |
| 零件包装代码 | DIP | SOIC | DIP | SOIC | DIP | SOIC | DIP | SOIC | DIP |
| 包装说明 | DIP, | SOP, | DIP, | SOP, | DIP, | 0.300 INCH, PLASTIC, SOL-20 | WDIP, | SOP, | WDIP, |
| 针数 | 20 | 20 | 20 | 20 | 20 | 20 | 20 | 20 | 20 |
| Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown | unknown | unknown | unknown |
| ECCN代码 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | 3A001.A.2.C | EAR99 | 3A001.A.2.C |
| 最大模拟输入电压 | 5.1 V | 5.1 V | 5.1 V | 5.1 V | 5.1 V | 5.1 V | 5.1 V | 5.1 V | 5.1 V |
| 最小模拟输入电压 | -0.1 V | -0.1 V | -0.1 V | -0.1 V | -0.1 V | -0.1 V | -0.1 V | -0.1 V | -0.1 V |
| 最长转换时间 | 2.5 µs | 2.5 µs | 2.5 µs | 2.5 µs | 2.5 µs | 2.5 µs | 2.5 µs | 2.5 µs | 2.5 µs |
| 转换器类型 | ADC, FLASH METHOD | ADC, FLASH METHOD | ADC, FLASH METHOD | ADC, FLASH METHOD | ADC, FLASH METHOD | ADC, FLASH METHOD | ADC, FLASH METHOD | ADC, FLASH METHOD | ADC, FLASH METHOD |
| JESD-30 代码 | R-PDIP-T20 | R-PDSO-G20 | R-PDIP-T20 | R-PDSO-G20 | R-PDIP-T20 | R-PDSO-G20 | R-GDIP-T20 | R-PDSO-G20 | R-GDIP-T20 |
| 长度 | 26.695 mm | 12.8 mm | 26.695 mm | 12.8 mm | 26.695 mm | 12.5 mm | 24.305 mm | 12.8 mm | 24.305 mm |
| 最大线性误差 (EL) | 0.39% | 0.195% | 0.195% | 0.195% | 0.195% | 0.39% | 0.39% | 0.39% | 0.195% |
| 位数 | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 |
| 功能数量 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| 端子数量 | 20 | 20 | 20 | 20 | 20 | 20 | 20 | 20 | 20 |
| 最高工作温度 | 85 °C | 70 °C | 70 °C | 85 °C | 85 °C | 70 °C | 125 °C | 85 °C | 125 °C |
| 最低工作温度 | -40 °C | - | - | -40 °C | -40 °C | - | -55 °C | -40 °C | -55 °C |
| 输出位码 | OFFSET BINARY | OFFSET BINARY | OFFSET BINARY | OFFSET BINARY | OFFSET BINARY | BINARY | OFFSET BINARY | OFFSET BINARY | OFFSET BINARY |
| 输出格式 | PARALLEL, 8 BITS | PARALLEL, 8 BITS | PARALLEL, 8 BITS | PARALLEL, 8 BITS | PARALLEL, 8 BITS | PARALLEL, 8 BITS | PARALLEL, 8 BITS | PARALLEL, 8 BITS | PARALLEL, 8 BITS |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | CERAMIC, GLASS-SEALED | PLASTIC/EPOXY | CERAMIC, GLASS-SEALED |
| 封装代码 | DIP | SOP | DIP | SOP | DIP | SOP | WDIP | SOP | WDIP |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | IN-LINE | SMALL OUTLINE | IN-LINE | SMALL OUTLINE | IN-LINE | SMALL OUTLINE | IN-LINE, WINDOW | SMALL OUTLINE | IN-LINE, WINDOW |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 座面最大高度 | 4.06 mm | 2.65 mm | 4.06 mm | 2.65 mm | 4.06 mm | 2.1 mm | 5.08 mm | 2.65 mm | 5.08 mm |
| 标称供电电压 | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| 表面贴装 | NO | YES | NO | YES | NO | YES | NO | YES | NO |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | INDUSTRIAL | COMMERCIAL | COMMERCIAL | INDUSTRIAL | INDUSTRIAL | COMMERCIAL | MILITARY | INDUSTRIAL | MILITARY |
| 端子形式 | THROUGH-HOLE | GULL WING | THROUGH-HOLE | GULL WING | THROUGH-HOLE | GULL WING | THROUGH-HOLE | GULL WING | THROUGH-HOLE |
| 端子节距 | 2.54 mm | 1.27 mm | 2.54 mm | 1.27 mm | 2.54 mm | 1.27 mm | 2.54 mm | 1.27 mm | 2.54 mm |
| 端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
| 宽度 | 7.62 mm | 7.5 mm | 7.62 mm | 7.5 mm | 7.62 mm | 5.4 mm | 7.62 mm | 7.5 mm | 7.62 mm |
| 最大压摆率 | 15 mA | 15 mA | 15 mA | 15 mA | 15 mA | - | 15 mA | 15 mA | 15 mA |
| Is Samacsys | - | N | N | N | N | N | - | - | - |
| Base Number Matches | - | 1 | 1 | 1 | 1 | 1 | 1 | - | - |
FPGA/CPLD
FPGA/CPLD
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