MULTILAYER CERAMIC CHIP INDUCTORS
1005(0402) GC / 1608(0603) GC Series
Features
1.
2.
3.
4.
Designed for high frequency RF application.
High self resonant frequency(SRF)and excellent Q.
Multilayered ceramic construction provides high reliability.
Miniature size : 1005(0402) / 1608(0603)
Applications
For high frequency RF and wireless equipments, automotive electronics and computer communications, etc.
- Cellular, PCS, Pager, CT-2, TRS
- Cordless Phone
- GSM, PDA, DECT, PHS
- Wireless CATV, Wireless LAN
- GMPCS
- Portable Hand Held PC.
Ordering Information
CODE : 1608
(1)
GC
(2)
2
T
(3) (4)
1N2
(5)
S
(6)
00
(7)
(3) Termination
2
3
Ag
Ag
Ni
Ni
Sn
Sn
Pb
-
(1) Series Dimensions
(4) Packaging Type
B : Bulk
T : Tape & Reel
(6) Inductance Tolerance Code
S : ±0.3nH
J : ±5%
(2) Material Code
(5) Inductance Value
1N2 : 1.2nH
12N : 12nH
R10 : 100nH
(7) Internal Code
Shape and Dimensions
unit:mm[inch]
Dimension
Series
1005 GC2
1608 GC2
L
1.0[0.040]
±0.10[0.004]
1.6[0.063]
±0.15[0.005]
W
0.5[0.020]
±0.10[0.004]
0.8[0.031]
±0.15[0.005]
T
0.5[0.020]
±0.10[0.004]
0.8[0.032]
±0.15[0.005]
B
0.25[0.010]
±0.10[0.004]
0.3[0.012]
±0.20[0.005]
5
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PILKOR ELECTRONICS CO., LTD.
Electrical Characteristics Table for 1005 GC Series
(Reel & Taping)
Ordering Code
1005GC2T1N0S00
1005GC2T1N2S00
1005GC2T1N5S00
1005GC2T1N8S00
1005GC2T1N9S00
1005GC2T2N0S00
1005GC2T2N2S00
1005GC2T2N4S00
1005GC2T2N7S00
1005GC2T3N0S00
1005GC2T3N3S00
1005GC2T3N6S00
1005GC2T3N9#00
1005GC2T4N7#00
1005GC2T5N6#00
1005GC2T6N8#00
1005GC2T8N2#00
1005GC2T10N#00
1005GC2T12N#00
1005GC2T15N#00
1005GC2T18N#00
1005GC2T20N#00
1005GC2T22N#00
1005GC2T27N#00
1005GC2T33N#00
1005GC2T39N#00
1005GC2T43N#00
1005GC2T47N#00
1005GC2T56N#00
1005GC2T68N#00
1005GC2T82N#00
1005GC2TR10#00
* at 500MHz ** at 1000MHz
●Inductance
Tolerance Code(S=±0.3nH, J=±5%)
●The
tolerance of C(=±0.2nH) and T(=±3%) are available upon
customer’s reguest.
●Test
Instruments - L, Q : HP4291B (Test Fixture:HP16192A)
SRF : Anritsu 37247B
R
DC
: HP4263B
I
DC
: HP6612C
L
(nH)
1.0
1.2
1.5
1.8
1.9
2.0
2.2
2.4
2.7
3.0
3.3
3.6
3.9
4.7
5.6
6.8
8.2
10
12
15
18
20
22
27
33
39
43
47
56
68
82
100
Tol
S
S
S
S
S
S
S
S
S
S
S
S
S.K
S.K
S.K
J.K
J.K
J.K
J.K
J.K
J.K
J.K
J.K
J.K
J.K
J.K
J.K
J.K
J.K
J.K
J.K
J.K
Q Min
100(MHz)
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
100(MHz)
9
9
9
9
9
9
9
9
9
9
9
9
9
9
10
10
10
10
11
10
11
10
10
10
10
10
10
12
12
11
12
11
Q Typical
800(MHz)
27
25
23
24
24
26
26
26
26
26
26
26
26
27
28
28
28
27
31
27
29
26
26
21
*22
*19
*22
*22
*22
*18
*20
*18
1800(MHz)
44
45
43
43
43
45
45
42
42
42
42
40
40
46
40
36
36
33
41
33
31
15
15
27
**24
**20
**20
**20
**18
**10
**7
-
SRF(MHz)
Typical
13000
12000
10000
9000
9000
9000
9000
9000
8000
8000
6500
6000
6000
5000
4700
4500
4000
3500
3000
2900
2200
2100
2100
1700
1900
1800
1500
1500
1400
1200
1100
930
Ω
RDC(Ω
)
Max
0.12
0.12
0.13
0.14
0.14
0.16
0.16
0.17
0.17
0.19
0.19
0.22
0.22
0.23
0.27
0.32
0.37
0.42
0.48
0.53
0.65
0.80
0.80
0.90
1.00
1.20
1.30
1.30
1.60
1.90
2.10
2.30
IDC(mA)
Max
300
300
300
300
300
300
300
300
300
300
300
300
300
300
300
250
250
250
250
250
200
200
200
200
200
200
200
200
200
180
150
100
Ⅰ
Typical Electrical Characteristics Graph
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6
MULTILAYER CERAMIC CHIP INDUCTORS
Electrical Characteristics Table for 1608 GC Series
(Reel & Taping)
Ordering Code
1608GC2T1N0S00
1608GC2T1N2S00
1608GC2T1N5S00
1608GC2T1N8S00
1608GC2T2N2S00
1608GC2T2N7S00
1608GC2T3N3S00
1608GC2T3N9#00
1608GC2T4N7#00
1608GC2T5N6#00
1608GC2T6N8#00
1608GC2T8N2#00
1608GC2T10N#00
1608GC2T12N#00
1608GC2T15N#00
1608GC2T18N#00
1608GC2T22N#00
1608GC2T27N#00
1608GC2T33N#00
1608GC2T39N#00
1608GC2T47N#00
1608GC2T56N#00
1608GC2T68N#00
1608GC2T82N#00
1608GC2TR10#00
1608GC2TR12#00
1608GC2TR15#00
1608GC2TR18#00
1608GC2TR22#00
1608GC2TR27#00
L
(nH)
1.0
1.2
1.5
1.8
2.2
2.7
3.3
3.9
4.7
5.6
6.8
8.2
10
12
15
18
22
27
33
39
47
56
68
82
100
120
150
180
220
270
Tol
S
S
S
S
S
S
S
S
S
S
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
Q Min
100(MHz)
8
8
8
8
8
8
8
8
8
8
8
8
12
12
12
12
12
12
12
12
12
12
12
12
12
12
12
12
12
12
100(MHz)
13
13
14
12
12
13
12
14
15
15
15
15
17
15
17
16
16
16
19
19
17
18
18
19
19
19
19
19
18
20
Q Typical
800(MHz)
44
44
37
37
38
38
37
44
43
45
43
44
49
41
45
45
43
41
41
42
35
31
26
21
20
16
-
-
-
-
1800(MHz)
60
60
56
55
54
53
49
62
63
59
58
52
50
37
35
39
21
11
11
17
-
-
-
-
-
-
-
-
-
-
SRF(MHz)
Typical
8100
8100
8100
8300
8000
7600
5800
5100
4600
4200
3700
3600
3500
2500
2600
2000
1800
1600
1500
1400
1300
1300
1150
1000
1000
950
800
750
680
600
Ω
RDC(Ω
)
Max
0.10
0.10
0.10
0.10
0.10
0.10
0.12
0.14
0.16
0.18
0.22
0.24
0.26
0.28
0.32
0.35
0.40
0.45
0.55
0.60
0.70
0.75
0.85
0.95
1.00
1.20
1.50
1.90
2.20
2.50
IDC(mA)
Max
300
300
300
300
300
300
300
300
300
300
300
300
300
300
300
300
300
300
300
300
300
300
300
300
300
300
300
300
300
300
●Inductance
Tolerance Code(S=±0.3nH, J=±5%)
●The
tolerance of C(=±0.2nH) and T(=±3%) are available
upon customer’s reguest.
●Test
Instruments - L, Q : HP4291B (Test Fixture:HP16192A)
SRF : Anritsu 37247B
R
DC
: HP4263B
I
DC
: HP6612C
Typical Electrical Characteristics Graph
7
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PILKOR ELECTRONICS CO., LTD.
Mechanical Characteristics
Item
Flexure Resistance
Solderability
Test Condition
Bent down to 2mm(3point)
Preheating at 160℃, 2~3min.
Solder Temperature : 230±5℃
Dipping Time : 4±1sec
Preheating at 160℃, 2~3min.
Solder Temperature : 260±5℃
Dipping Time : 10±0.5sec
Frequency : 10~55Hz
Amplitude : 1.52mm
Time & Direction : 2hours & each X, Y, Z
Height : 1m high
10times
Requirements
No mechanical damage
No mechanical damage
Terminal electrode is covered
by new solder : 75%
No mechanical damage
Remaining terminal electrode :
No mechanical damage
Inductance
±10%
Q factor
±20%
No mechanical damage
Inductance
±10%
Q factor
±20%
Ⅰ
Solder Heat Resistance
70%
Vibration
Drop Shock Resistance
Reliability Test
Item
Humidity Resistance
Test Condition
Humidity : 90~95%RH
Temperature : 60℃
Time : 500±12hours
Temperature : 1005 GC2 : 125±2℃
1608 GC2 : 125±2℃
Time : 1000±12hours
Temperature : -40±2℃
Time : 1000±12hours
Humidity : 85±5%RH
Temperature : 85±2℃
Time : 100±12hours
Temperature : -40~125℃,
Conditions for 1 cycle
Step 1 : -40±2℃, 30min.
Step 2 : Room Temp. 5min
Step 3 : 1005 GC2 / 125±2℃,
1608 GC2 / 125±2℃,30min.
Step 4
:Room
Temp. 5min
Number of cycle : 100
Requirements
No mechanical damage
Inductance
±10%
Q factor
±20%
No mechanical damage
Inductance
±10%
Q factor
±20%
No mechanical damage
Inductance
±10%
Q factor
±20%
No mechanical damage
Inductance
±10%
Q factor
±20%
No mechanical damage
Inductance
±10%
High Temperature Resistance
under Unloading
Low Temperature Resistance
under Unloading
8585 Test
Temperature Coefficient
(TCL)
Temperature Cycle
(TC)
No mechanical damage
Inductance
±10%
Q factor
±20%
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8
MULTILAYER CERAMIC CHIP INDUCTORS
Packing Specification
1. Carrier Tape Dimensions
- Carrier Tape Material : Paper
- Dimension in Millimeters
Series
1005 GC2
1608 GC2
Chip cavity
A
0.65±0.1
1.0±0.1
B
1.15±0.1
1.8±0.1
Insertion pitch
C
2.0±0.1
4.0±0.1
Tape thickness
D
0.8 max
1.2 max
2. Dimension of Taping
2.1 Leader and Blank section
9
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