Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
1. Measured with minimum pad spacing on an FR4 board, using 10 mm−by−1 inch, 2−ounce copper trace with no air flow.
2. Tested to EIA/JESD22−A114−A.
3. Tested to EIA/JESD22−A115−A.
4. Tested to JESD22−C101−A.
RECOMMENDED OPERATING CONDITIONS
Symbol
V
CC
Supply Voltage
Operating
Data Retention Only
Input Voltage (Note 5)
Output Voltage (HIGH or LOW State)
Operating Free−Air Temperature
Input Transition Rise or Fall Rate
V
CC
= 2.5 V
±0.2
V
V
CC
= 3.0 V
±0.3
V
V
CC
= 5.0 V
±0.5
V
Parameter
Min
1.65
1.5
0
0
−55
0
0
0
Max
5.5
5.5
5.5
5.5
+125
20
10
5
Units
V
V
I
V
O
T
A
Dt/DV
V
V
°C
ns/V
5. Unused inputs may not be left open. All inputs must be tied to a high− or low−logic input voltage level.
DEVICE ORDERING INFORMATION
Device Order Number
NL27WZ125USG
Package Type
US8
(Pb−Free)
Shipping
†
3000 / Tape & Reel
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
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2
NL27WZ125
DC ELECTRICAL CHARACTERISTICS
Symbol
V
IH
V
IL
V
OH
Parameter
High−Level Input Voltage
Low−Level Input Voltage
High−Level Output Voltage
V
IN
= V
IL
or V
IH
I
OH
= 100
mA
I
OH
=
−3
mA
I
OH
=
−8
mA
I
OH
=
−12
mA
I
OH
=
−16
mA
I
OH
=
−24
mA
I
OH
=
−32
mA
I
OL
= 100
mA
I
OL
= 3 mA
I
OL
= 8 mA
I
OL
= 12 mA
I
OL
= 16 mA
I
OL
= 24 mA
I
OL
= 32 mA
V
IN
= 5.5V or GND
V
IN
= 5.5 V or
V
OUT
= 5.5 V
V
IN
= 5.5V or GND
V
IN
= V
IL
or V
IH
0V
≤
V
OUT
≤
5.5 V
Condition
V
CC
(V)
1.65
2.3 to 5.5
1.65
2.3 to 5.5
1.65 to 5.5
1.65
2.3
2.7
3.0
3.0
4.5
1.65 to 5.5
2.3
2.7
3.0
3.0
4.5
0 to 5.5
0
5.5
2.3 to 5.5
V
CC
−
0.1
1.29
1.9
2.2
2.4
2.3
3.8
V
CC
1.52
2.1
2.4
2.7
2.5
4.0
0.08
0.20
0.22
0.28
0.38
0.42
0.1
0.24
0.3
0.4
0.4
0.55
0.55
±0.1
1.0
1.0
±0.5
T
A
= 255C
Min
0.75 V
CC
0.7 V
CC
0.25 V
CC
0.3 V
CC
V
CC
−0.1
1.29
1.9
2.2
2.4
2.3
3.8
0.1
0.24
0.3
0.4
0.4
0.55
0.55
±1.0
10
10
±5
Typ
Max
−555C
3
T
A
3
1255C
Min
0.75 V
CC
0.7 V
CC
0.25 V
CC
0.3 V
CC
Max
Units
V
V
V
V
OL
Low−Level Output Voltage
V
IN
= V
IL
V
I
IN
I
OFF
I
CC
I
OZ
Input Leakage Current
Power Off
Leakage Current
Quiescent Supply Current
3−State Output Leakage
mA
mA
mA
mA
AC ELECTRICAL CHARACTERISTICS
(t
R
= t
F
= 3.0 ns)
Symbol
t
PLH
t
PHL
Parameter
Propagation Delay
AN to YN
(Figures 3 and 4)
Condition
R
L
= 1 MW, C
L
= 15 pF
R
L
= 1 MW, C
L
= 15 pF
R
L
= 500
W,
C
L
= 50 pF
R
L
= 1 MW, C
L
= 15 pF
R
L
= 500
W,
C
L
= 50 pF
t
OSLH
t
OSHL
t
PZH
t
PZL
Output to Output Skew
(Note 6)
Output Enable Time
(Figures 5, 6 and 7)
R
L
= 500
W,
C
L
= 50 pF
R
L
= 500
W,
C
L
= 50 pF
V
CC
(V)
1.8
±
0.15
2.5
±
0.2
3.3
±
0.3
5.0
±
0.5
3.3
±
0.3
5.0
±
0.5
1.8
±
0.15
2.5
±
0.2
3.3
±
0.3
5.0
±
0.5
t
PHZ
t
PLZ
Output Enable Time
(Figures 5, 6 and 7)
1.8
±
0.15
2.5
±
0.2
3.3
±
0.3
5.0
±
0.5
3.0
1.8
1.2
0.8
2.5
1.5
0.8
0.3
T
A
= 255C
Min
2.0
1.0
0.8
1.2
0.5
0.8
Typ
Max
12
7.5
5.2
5.7
4.5
5.0
1.0
0.8
14
8.5
6.2
5.5
12
8.0
5.7
4.7
3.0
1.8
1.2
0.8
2.5
1.5
0.8
0.3
−555C
3
T
A
3
1255C
Min
2.0
1.0
0.8
1.2
0.5
0.8
Max
13
8
5.5
6.0
4.8
5.3
1.0
0.8
15
9.0
6.5
5.8
13
8.5
6.0
5.0
ns
ns
ns
Units
ns
6. Skew is defined as the absolute value of the difference between the actual propagation delay for any two separate outputs of the same device.
This specification applies to any outputs switching in the same direction, either HIGH−to−LOW (t
OSHL
) or LOW−to−HIGH (t
OSLH
); parameter
guaranteed by design.
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3
NL27WZ125
CAPACITIVE CHARACTERISTICS
Symbol
C
IN
C
OUT
C
PD
Input Capacitance
Output Capacitance
Power Dissipation Capacitance (Note 7)
Parameter
Condition
V
CC
= 5.5 V, V
I
= 0 V or V
CC
V
CC
= 5.5 V, V
I
= 0 V or V
CC
10 MHz, V
CC
= 3.3 V, V
I
= 0 V or V
CC
10 MHz, V
CC
= 5.5 V, V
I
= 0 V or V
CC
Typical
7.0
7.0
18
27
Units
pF
pF
pF
7. C
PD
is defined as the value of the internal equivalent capacitance which is calculated from the operating current consumption without load.
Average operating current can be obtained by the equation: I
CC(OPR
)
= C
PD
V
CC
f
in
+ I
CC
. C
PD
is used to determine the no−load dynamic
power consumption; P
D
= C
PD
V
CC2
f
in
+ I
CC
V
CC
.
t
f
= 3 ns
90%
50%
10%
90%
50%
t
f
= 3 ns
V
CC
INPUT
10%
OE = GND
OUTPUT
C
L
*
R
L
INPUT
A and B
GND
t
PHL
t
PLH
V
OH
*Includes all probe and jig capacitance.
A 1 MHz square input wave is recommended for
propagation delay tests.
OUTPUT Y
50%
50%
V
OL
Figure 3. Switching Waveform
Figure 4. T
PLH
or T
PHL
V
CC
OE
t
PZH
On
50%
50%
0V
t
PHZ
50%
V
CC
V
OH
−
10%
≈
0V
t
PZL
On
50%
t
PLZ
≈
V
CC
V
OL
+ 10%
GND
Figure 5. AC Output Enable and Disable Waveform
2
INPUT
V
CC
INPUT
OUTPUT
C
L
= 50 pF
R
L
= 250
W
R
1
= 500
W
OUTPUT
C
L
= 50 pF
R
L
= 500
W
V
CC
A 1 MHz square input wave is recommended for
propagation delay tests.
A 1 MHz square input wave is recommended for
propagation delay tests.
Figure 6. T
PZL
or T
PL
Figure 7. T
PZH
or T
PHZ
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4
NL27WZ125
PACKAGE DIMENSIONS
US8
CASE 493−02
ISSUE B
A
8
5
−X−
−Y−
J
DETAIL E
B
L
1
4
R
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION “A” DOES NOT INCLUDE MOLD
FLASH, PROTRUSION OR GATE BURR. MOLD
FLASH. PROTRUSION AND GATE BURR SHALL
NOT EXCEED 0.140 MM (0.0055”) PER SIDE.
4. DIMENSION “B” DOES NOT INCLUDE INTER−
LEAD FLASH OR PROTRUSION. INTER−LEAD
FLASH AND PROTRUSION SHALL NOT E3XCEED
0.140 (0.0055”) PER SIDE.
5. LEAD FINISH IS SOLDER PLATING WITH
THICKNESS OF 0.0076−0.0203 MM. (300−800 “).
6. ALL TOLERANCE UNLESS OTHERWISE
SPECIFIED
±0.0508
(0.0002 “).
DIM
A
B
C
D
F
G
H
J
K
L
M
N
P
R
S
U
V
MILLIMETERS
MIN
MAX
1.90
2.10
2.20
2.40
0.60
0.90
0.17
0.25
0.20
0.35
0.50 BSC
0.40 REF
0.10
0.18
0.00
0.10
3.00
3.20
0
_
6
_
5
_
10
_
0.23
0.34
0.23
0.33
0.37
0.47
0.60
0.80
0.12 BSC
INCHES
MIN
MAX
0.075
0.083
0.087
0.094
0.024
0.035
0.007
0.010
0.008
0.014
0.020 BSC
0.016 REF
0.004
0.007
0.000
0.004
0.118
0.126
0
_
6
_
5
_
10
_
0.010
0.013
0.009
0.013
0.015
0.019
0.024
0.031
0.005 BSC
P
G
S
U
C
−T−
SEATING
PLANE
H
0.10 (0.004) T
N
R 0.10 TYP
V
D
0.10 (0.004)
K
M
T X Y
M
DETAIL E
F
SOLDERING FOOTPRINT*
3.8
0.15
0.50
0.0197
1.8
0.07
0.30
0.012
1.0
0.0394
SCALE 8:1
mm
inches
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
ON Semiconductor
and
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.
“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All
operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights
nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications
intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should
Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates,
and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death
associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal
Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.
PUBLICATION ORDERING INFORMATION
LITERATURE FULFILLMENT:
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