NL17SZ16
Single Input Buffer
The NL17SZ16 is a single input Buffer in two tiny footprint
packages. The device performs much as LCX multi−gate products in
speed and drive.
Features
•
•
•
•
•
•
Tiny SOT−353 and SOT−553 Packages
Source/Sink 24 mA at 3.0 Volts
Over−V
oltage Tolerant Inputs and Outputs
Chip Complexity: FETs = 20
Designed for 1.65 V to 5.5 V V
CC
Operation
These Devices are Pb−Free and are RoHS Compliant
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MARKING
DIAGRAMS
5
1
SC−88A
(SC−70−5/SOT−353)
DF SUFFIX
CASE 419A
5
LR MG
G
5
LR M
G
G
1
NC
1
5
V
CC
1
SOT−553
XV5 SUFFIX
CASE 463B
A
2
LR = Device Code
M = Date Code*
G
= Pb−Free Package
(Note: Microdot may be in either location)
*Date Code orientation and/or position may vary
depending upon manufacturing location.
GND
3
4
Y
Figure 1. Pinout
(Top View)
PIN ASSIGNMENT
A
1
Y
Pin
1
2
3
4
5
Function
NC
IN A
GND
OUT Y
V
CC
Figure 2. Logic Symbol
FUNCTION TABLE
A Input
L
H
Y Output
L
H
ORDERING INFORMATION
See detailed ordering and shipping information in the package
dimensions section on page 4 of this data sheet.
©
Semiconductor Components Industries, LLC, 2012
April, 2012
−
Rev. 10
1
Publication Order Number:
NL17SZ16/D
NL17SZ16
MAXIMUM RATINGS
Symbol
V
CC
V
I
V
O
I
IK
I
OK
I
OUT
I
CC
I
GND
T
STG
T
L
T
J
q
JA
P
D
MSL
F
R
ESD
DC Supply Voltage
DC Input Voltage
DC Output Voltage
DC Input Diode Current
DC Output Diode Current
DC Output Sink Current
DC Supply Current per Supply Pin
DC Ground per Supply Pin
Storage Temperature Range
Lead Temperature, 1 mm from Case for 10 Seconds
Junction Temperature Under Bias
Thermal Resistance
Power Dissipation in Still Air at 85°C
Moisture Sensitivity
Flammability Rating
ESD Classification
Oxygen Index: 28 to 34
Human Body Model (Note 3)
Machine Model (Note 4)
Charged Device Model (Note 5)
Above V
CC
and Below GND at 85°C (Note 6)
SOT−353
SOT−553
SOT−353
SOT−553
Output in High or Low State (Note 2)
V
I
< GND
V
O
< GND
Parameter
Value
−0.5
to +7.0
−0.5
≤
V
I
≤
+7.0
−0.5
≤
V
O
≤
+7.0
−50
−50
±50
±100
±100
−65
to +150
260
+150
350
360
150
180
Level 1
UL 94 V−0 @ 0.125 in
Class IC
Class A
N/A
$500
V
Units
V
V
V
mA
mA
mA
mA
mA
°C
°C
°C
°C/W
mW
I
Latchup
Latchup Performance
mA
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
1. Measured with minimum pad spacing on an FR4 board, using 10 mm−by−1 inch, 2−ounce copper trace with no air flow.
2. I
O
Absolute Maximum Rating Must be Obtained.
3. Tested to EIA/JESD22−A114−A, rated to EIA/JESD22−A114−B.
4. Tested to EIA/JESD22−A115−A, rated to EIA/JESD22−A115−A.
5. Tested to JESD22−C101−A.
6. Tested to EIA/JESD78.
RECOMMENDED OPERATING CONDITIONS
Symbol
V
CC
V
IN
V
OUT
T
A
t
r
, t
f
DC Supply Voltage
DC Input Voltage
DC Output Voltage
Operating Temperature Range
Input Rise and Fall Time
V
CC
= 2.5 V
±0.2
V
V
CC
= 3.0 V
±0.3
V
V
CC
= 5.0 V
±0.5
V
Parameter
Operations Only
Data Retention
Min
1.65
1.5
0
0
−55
0
0
0
Max
5.5
5.5
5.5
5.5
+125
20
10
5
Units
V
V
V
°C
ns/V
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2
NL17SZ16
NORMALIZED FAILURE RATE
DEVICE JUNCTION TEMPERATURE VERSUS
TIME TO 0.1% BOND FAILURES
Junction
Temperature
°C
80
90
100
110
120
130
140
Time, Hours
1,032,200
419,300
178,700
79,600
37,000
17,800
8,900
Time, Years
117.8
47.9
20.4
9.4
4.2
2.0
1.0
FAILURE RATE OF PLASTIC = CERAMIC
UNTIL INTERMETALLICS OCCUR
T
J
= 130°C
T
J
= 120°C
T
J
= 100°C
T
J
= 110°C
T
J
= 90°C
T
J
= 80°C
100
TIME, YEARS
1
1
10
1000
Figure 3. Failure Rate vs. Time Junction Temperature
DC ELECTRICAL CHARACTERISTICS
Symbol
V
IH
V
IL
V
OH
Parameter
High−Level Input Voltage
Low−Level Input Voltage
High−Level Output Voltage
V
IN
= V
IL
or V
IH
I
OH
=
−100
mA
I
OH
=
−3
mA
I
OH
=
−8
mA
I
OH
=
−12
mA
I
OH
=
−16
mA
I
OH
=
−24
mA
I
OH
=
−32
mA
I
OL
= 100
mA
I
OL
= 4 mA
I
OL
= 8 mA
I
OL
= 12 mA
I
OL
= 16 mA
I
OL
= 24 mA
I
OL
= 32 mA
V
IN
= 5.5 V or GND
V
IN
= 5.5 V or
V
OUT
= 5.5 V
V
IN
= 5.5 V or GND
Condition
V
CC
(V)
1.65 to 1.95
2.3 to 5.5
1.65 to 1.95
2.3 to 5.5
1.65 to 5.5
1.65
2.3
2.7
3.0
3.0
4.5
1.65 to 5.5
1.65
2.3
2.7
3.0
3.0
4.5
0 to 5.5
0
5.5
V
CC
−
0.1
1.29
1.9
2.2
2.4
2.3
3.8
V
CC
1.52
2.1
2.4
2.7
2.5
4.0
0.0
0.08
0.20
0.22
0.28
0.38
0.42
0.1
0.24
0.3
0.4
0.4
0.55
0.55
±0.1
1
1
T
A
= 255C
Min
0.75 V
CC
0.7 V
CC
0.25 V
CC
0.3 V
CC
V
CC
−
0.1
1.29
1.9
2.2
2.4
2.3
3.8
0.1
0.24
0.3
0.4
0.4
0.55
0.55
±1.0
10
10
Typ
Max
−555C
3
T
A
3
1255C
Min
0.75 V
CC
0.7 V
CC
0.25 V
CC
0.3 V
CC
Max
Units
V
V
V
V
OL
Low−Level Output Voltage
V
IN
= V
IH
or V
OH
V
I
IN
I
OFF
I
CC
Input Leakage Current
Power Off Leakage
Current
Quiescent Supply Current
mA
mA
mA
AC ELECTRICAL CHARACTERISTICS
t
R
= t
F
= 3.0 ns
Symbol
t
PLH
t
PHL
Parameter
Propagation Delay
(Figure 4 and 5)
Condition
R
L
= 1 MW, C
L
= 15 pF
V
CC
(V)
1.65
1.8
2.5
±
0.2
3.3
±
0.3
5.0
±
0.5
3.3
±
0.3
5.0
±
0.5
T
A
= 255C
Min
2.0
2.0
0.8
0.5
0.5
1.5
0.8
Typ
5.3
4.4
2.9
2.1
1.8
2.9
2.4
Max
11.4
9.5
6.5
4.5
3.9
5.0
4.3
−555C
3
T
A
3
1255C
Min
2.0
2.0
0.8
0.5
0.5
1.5
0.8
Max
12
10
7.0
4.7
4.1
5.2
4.5
Units
ns
R
L
= 500
W,
C
L
= 50 pF
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3
NL17SZ16
CAPACITIVE CHARACTERISTICS
Symbol
C
IN
C
PD
Input Capacitance
Power Dissipation Capacitance
(Note 7)
Parameter
Condition
V
CC
= 5.5 V, V
I
= 0 V or V
CC
10 MHz, V
CC
= 3.3 V, V
I
= 0 V or V
CC
10 MHz, V
CC
= 5.5 V, V
I
= 0 V or V
CC
Typical
u4
25
30
Units
pF
pF
7. C
PD
is defined as the value of the internal equivalent capacitance which is calculated from the operating current consumption without load.
Average operating current can be obtained by the equation: I
CC(OPR
)
= C
PD
V
CC
f
in
+ I
CC
. C
PD
is used to determine the no−load dynamic
power consumption; P
D
= C
PD
V
CC2
f
in
+ I
CC
V
CC
.
t
f
= 3 ns
90%
50%
10%
90%
50%
t
f
= 3 ns
V
CC
INPUT
10%
INPUT
A and B
OUTPUT
R
L
C
L
GND
t
PHL
t
PLH
V
OL
OUTPUT Y
50%
50%
V
OH
A 1−MHz square input wave is recommended for
propagation delay tests.
Figure 4. Switching Waveform
Figure 5. Test Circuit
ORDERING INFORMATION
Device
NL17SZ16DFT2G
NL17SZ16XV5T2G
Package
SC−88A/SC−70−5/SOT−353
(Pb−Free)
SOT−553
(Pb−Free)
Shipping
†
3000/Tape & Reel
4000/Tape & Reel
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
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4
NL17SZ16
PACKAGE DIMENSIONS
SC−88A
(SC−70−5/SOT−353)
DF SUFFIX
CASE 419A−02
ISSUE K
A
G
NOTES:
1. DIMENSIONING AND TOLERANCING
PER ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. 419A−01 OBSOLETE. NEW STANDARD
419A−02.
4. DIMENSIONS A AND B DO NOT INCLUDE
MOLD FLASH, PROTRUSIONS, OR GATE
BURRS.
INCHES
MIN
MAX
0.071
0.087
0.045
0.053
0.031
0.043
0.004
0.012
0.026 BSC
---
0.004
0.004
0.010
0.004
0.012
0.008 REF
0.079
0.087
MILLIMETERS
MIN
MAX
1.80
2.20
1.15
1.35
0.80
1.10
0.10
0.30
0.65 BSC
---
0.10
0.10
0.25
0.10
0.30
0.20 REF
2.00
2.20
5
4
S
1
2
3
−B−
D
5 PL
0.2 (0.008)
M
B
M
N
J
C
DIM
A
B
C
D
G
H
J
K
N
S
H
K
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