HI-SINCERITY
MICROELECTRONICS CORP.
Spec. No. : HE200802
Issued Date : 2008.08.19
Revised Date :2009.11.06
Page No. : 1/5
HSBR20100CT Series to
HSBR20150CT Series
Schottky Barrier Rectifiers
(Reverse Voltage 100V to150V, Forward Current 20A)
Features
•
Low Forward Voltage Drop
•
High Current Capability
•
High Reliability
•
High Surge Current Capability
•
High ESD capability;
TO-220AB
Mechanical Data
•
Cases: TO-220 molded plastic body
•
Epoxy: UL 94V-0 rate flame retardant
•
Lead: Axial leads, solderable per MIL-STD-750, Method 2026 guaranteed
TO-220FP
•
High temperature soldering guaranteed: 250°C/10seconds/.375”(9.5mm) lead lengths at 5lbs.(2.3kg) tension
•
Weight: 2.05gram
Maximum Ratings & Electrical Characteristics
Ratings at 25°C ambient temperature unless otherwise specified.
Single phase, half wave, 60 Hz, resistive or inductive load. For capacitive load. Derate current by 20%.
Ratings
Repetitive Peak Reverse Voltage
Surge Peak Reverse Voltage
DC Blocking Voltage
Average Forward Rectified Current (T
A
=75 C)
Peak Forward Surge Current, 50Hz Half
o
Sine-wave (T
A
=25 C)
Repetitive Peak Forward C (f>15Hz)
Instantaneous Forward Voltage@5.0A
Leakage Current (T
J
=25 C, V
R
=V
RRM
)
Leakage Current (T
J
=100 C, V
R
=V
RRM
)
Typical thermal resistance
o
o
o
Symbol
V
RRM
V
RSM
V
DC
I
FAV
I
FSM
I
FRM
V
F
I
R
R
θ
JC
T
J
T
STG
HSBR
20100CTE
100
70
100
20
250
10
0.85
0.2
20
2.4
HSBR
20100CTF
HSBR
20150CTE
150
105
150
20
250
10
0.90
0.2
20
HSBR
20150CTF
Unit
V
V
V
A
A
A
V
mA
mA
3.5
-65 to +150
-65 to +150
2.4
3.5
°C/W
°C
°C
Operating Junction Temperature Range
Storage Temperature Range
HSBR20100CT Series ~HSBR20150CT Series
HSMC Product Specification
HI-SINCERITY
MICROELECTRONICS CORP.
Characteristics Curve
Typical Instantaneous Forward Characteristics
100
10
100V
1
0.1
0.01
Ta=25
℃
0.001
0
0.2
0.4
0.6
VF,Forward Voltage(V)
0.8
1
150V
Spec. No. : HE200802
Issued Date : 2008.08.19
Revised Date :2009.11.06
Page No. : 2/5
280
240
Maximum Non-repet itive Peak
Forward Surge Current
IF,Forward Current
Peak Forward
Surge Current(
200
160
120
80
40
0
1
T j=T jmax.8.3ms single half
sine-wave(JEDEC Method)
`
10
100
Number of Cy cles at 50Hz
Typical Reverse Characteristics
10
Tj=150
℃
Instantaneous Reverse Curren
1
Tj=125
℃
Tj=100
℃
0.1
Tj=75
℃
0.01
Tj=25
℃
100V
Instantaneous Reverse Curren
10
150V
Tj=150
℃
1
Tj=125
℃
0.1
Tj=100
℃
0.01
Tj=75
℃
0.001
Tj=25
℃
Typical Reverse Characteristics
0.001
0.0001
0
20
40
60
80
100
Percent of Rated Peak Reverse Voltage(V)
120
0.0001
0
50
100
150
Percent of Rated Peak Reverse Voltage(V)
200
Forward Current Derat ing Curve
25
Average Forward Recti
20
Current(A)
15
10
5
0
0
25
50
75
100
125
150
175
Resist ive or Induct ive Load
0.375"(9.5mm)lead lengt h
Lead Temp erature(
℃
)
HSBR20100CT Series ~HSBR20150CT Series
HSMC Product Specification
HI-SINCERITY
MICROELECTRONICS CORP.
Spec. No. : HE200802
Issued Date : 2008.08.19
Revised Date :2009.11.06
Page No. : 3/5
TO-220AB Dimension
Marking:
A
D
B
E
C
F
H
I
G
Tab
P
L
J
M
3
2
1
O
N
K
Note: Green label is used for pb-free packing
Pin Style: 1.Anode 2.Cathode 3.Anode
Material:
•
Lead solder plating: Sn60/Pb40 (Normal),
Sn/3.0Ag/0.5Cu or Pure-Tin (Pb-free)
•
Mold Compound: Epoxy resin family,
flammability solid burning class: UL94V-0
DIM
A
B
C
D
E
F
G
H
I
J
K
L
M
N
O
P
Min.
5.58
8.38
4.40
1.15
0.35
2.03
9.66
-
-
3.00
0.75
2.54
1.14
-
12.70
14.48
Max.
7.49
8.90
4.70
1.39
0.60
2.92
10.28
*16.25
*3.83
4.00
0.95
3.42
1.40
*2.54
14.27
15.87
*: Typical, Unit: mm
3-Lead TO-220AB
Plastic Package
HSMC Package Code: E
Marking:
A
D
B
E
C
F
H
I
G
Tab
P
L
J
M
3
2
1
O
N
K
Note: Green label is used for pb-free packing
Pin Style: 1.Anode 2.Cathode 3.Anode
Material:
•
Lead solder plating: Sn60/Pb40 (Normal),
Sn/3.0Ag/0.5Cu or Pure-Tin (Pb-free)
•
Mold Compound: Epoxy resin family,
flammability solid burning class: UL94V-0
DIM
A
B
C
D
E
F
G
H
I
J
K
L
M
N
O
P
Min.
5.58
8.38
4.40
1.15
0.35
2.03
9.66
-
-
3.00
0.75
2.54
1.14
-
12.70
14.48
Max.
7.49
8.90
4.70
1.39
0.60
2.92
10.28
*16.25
*3.83
4.00
0.95
3.42
1.40
*2.54
14.27
15.87
*: Typical, Unit: mm
3-Lead TO-220AB
Plastic Package
HSMC Package Code: E
HSBR20100CT Series ~HSBR20150CT Series
HSMC Product Specification
HI-SINCERITY
MICROELECTRONICS CORP.
Spec. No. : HE200802
Issued Date : 2008.08.19
Revised Date :2009.11.06
Page No. : 4/5
TO-220FP Dimension
Marking:
A
B
α
1
D
α
4
E O
C
α
2
α
3
α
5
G
H
3
I
N
J
F
2
K
1
3-Lead TO-220FP Plastic Package
HSMC Package Code: F
M
L
Style: 1.Anode 2.Cathode 3.Anode
DIM
A
B
C
D
E
F
G
H
I
J
Inches
Min.
Max.
0.2480
0.2520
0.3386
0.3425
0.1673
0.1870
0.1043
0.1083
0.0230
0.0242
0.3980
0.4039
0.1083
0.1122
0.3386
0.3425
-
*0.1496
-
*0.0236
Millimeters
Min.
Max.
6.30
6.40
8.60
8.70
4.25
4.75
2.65
2.75
0.58
0.61
10.11
10.26
2.75
2.85
8.60
8.70
-
*3.80
-
*0.60
DIM
K
L
M
N
O
α1
α2
α3
α4
α5
Inches
Min.
Max.
-
*0.1004
0.5118
0.5906
0.5886
0.5925
-
*0.0669
0.1098
0.1114
-
-2°
-
*5°
-
*15°
-
*5°
-
*5°
Millimeters
Min.
Max.
-
*2.55
13.00
15.00
14.95
15.05
-
*1.70
2.79
2.83
-
*2°
-
*5°
-
*15°
-
*5°
-
*5°
Notes:
1.Dimension and tolerance based on our Spec. dated Sep. 07,1997.
2.Controlling dimension: millimeters.
3.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material.
4.If there is any question with packing specification or packing method, please contact your local HSMC sales office.
Material:
•
Lead: 42 Alloy; solder plating
•
Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0
Important Notice:
•
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of HSMC.
•
HSMC reserves the right to make changes to its products without notice.
•
HSMC semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems.
•
HSMC assumes no liability for any consequence of customer product design, infringement of patents, or application assistance.
Head Office And Factory:
•
Head Office
(Hi-Sincerity Microelectronics Corp.): 10F.,No. 61, Sec. 2, Chung-Shan N. Rd. Taipei Taiwan R.O.C.
Tel: 886-2-25212056 Fax: 886-2-25632712
HSBR20100CT Series ~HSBR20150CT Series
HSMC Product Specification
HI-SINCERITY
MICROELECTRONICS CORP.
Spec. No. : HE200802
Issued Date : 2008.08.19
Revised Date :2009.11.06
Page No. : 5/5
HSBR20100CT Series ~HSBR20150CT Series
HSMC Product Specification
FPGA/CPLD
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