TLCS-870 Series
| 参数名称 | 属性值 |
| 厂商名称 | Toshiba(东芝) |
| 零件包装代码 | QFP |
| 包装说明 | LFQFP, |
| 针数 | 64 |
| Reach Compliance Code | unknow |
| 具有ADC | YES |
| 其他特性 | ALSO OPERATES AT 2.7V MINIMUM SUPPLY AT 4.2 MHZ |
| 地址总线宽度 | |
| 位大小 | 8 |
| 最大时钟频率 | 8 MHz |
| DAC 通道 | NO |
| DMA 通道 | NO |
| 外部数据总线宽度 | |
| JESD-30 代码 | S-PQFP-G64 |
| 长度 | 10 mm |
| I/O 线路数量 | 56 |
| 端子数量 | 64 |
| 最高工作温度 | 85 °C |
| 最低工作温度 | -40 °C |
| PWM 通道 | YES |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | LFQFP |
| 封装形状 | SQUARE |
| 封装形式 | FLATPACK, LOW PROFILE, FINE PITCH |
| 认证状态 | Not Qualified |
| ROM可编程性 | OTPROM |
| 座面最大高度 | 1.6 mm |
| 速度 | 8 MHz |
| 最大供电电压 | 5.5 V |
| 最小供电电压 | 4.5 V |
| 标称供电电压 | 5 V |
| 表面贴装 | YES |
| 技术 | CMOS |
| 温度等级 | INDUSTRIAL |
| 端子形式 | GULL WING |
| 端子节距 | 0.5 mm |
| 端子位置 | QUAD |
| 宽度 | 10 mm |
| uPs/uCs/外围集成电路类型 | MICROCONTROLLER |

| TMP87PM48UG | TMP87PH48DFG | TMP87PH48UG | TMP87PM48DFG | |
|---|---|---|---|---|
| 描述 | TLCS-870 Series | TLCS-870 Series | TLCS-870 Series | TLCS-870 Series |
| 厂商名称 | Toshiba(东芝) | Toshiba(东芝) | Toshiba(东芝) | Toshiba(东芝) |
| 零件包装代码 | QFP | QFP | QFP | QFP |
| 包装说明 | LFQFP, | QFP, | LFQFP, | QFP, |
| 针数 | 64 | 64 | 64 | 64 |
| Reach Compliance Code | unknow | unknow | unknow | unknow |
| 具有ADC | YES | YES | YES | YES |
| 其他特性 | ALSO OPERATES AT 2.7V MINIMUM SUPPLY AT 4.2 MHZ | ALSO OPERATES AT 2.7V MINIMUM SUPPLY AT 4.2 MHZ | ALSO OPERATES AT 2.7V MINIMUM SUPPLY AT 4.2 MHZ | ALSO OPERATES AT 2.7V MINIMUM SUPPLY AT 4.2 MHZ |
| 位大小 | 8 | 8 | 8 | 8 |
| 最大时钟频率 | 8 MHz | 8 MHz | 8 MHz | 8 MHz |
| DAC 通道 | NO | NO | NO | NO |
| DMA 通道 | NO | NO | NO | NO |
| JESD-30 代码 | S-PQFP-G64 | S-PQFP-G64 | S-PQFP-G64 | S-PQFP-G64 |
| 长度 | 10 mm | 14 mm | 10 mm | 14 mm |
| I/O 线路数量 | 56 | 56 | 56 | 56 |
| 端子数量 | 64 | 64 | 64 | 64 |
| 最高工作温度 | 85 °C | 85 °C | 85 °C | 85 °C |
| 最低工作温度 | -40 °C | -40 °C | -40 °C | -40 °C |
| PWM 通道 | YES | YES | YES | YES |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | LFQFP | QFP | LFQFP | QFP |
| 封装形状 | SQUARE | SQUARE | SQUARE | SQUARE |
| 封装形式 | FLATPACK, LOW PROFILE, FINE PITCH | FLATPACK | FLATPACK, LOW PROFILE, FINE PITCH | FLATPACK |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| ROM可编程性 | OTPROM | OTPROM | OTPROM | OTPROM |
| 座面最大高度 | 1.6 mm | 3.15 mm | 1.6 mm | 3.15 mm |
| 速度 | 8 MHz | 8 MHz | 8 MHz | 8 MHz |
| 最大供电电压 | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
| 最小供电电压 | 4.5 V | 4.5 V | 4.5 V | 4.5 V |
| 标称供电电压 | 5 V | 5 V | 5 V | 5 V |
| 表面贴装 | YES | YES | YES | YES |
| 技术 | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL |
| 端子形式 | GULL WING | GULL WING | GULL WING | GULL WING |
| 端子节距 | 0.5 mm | 0.8 mm | 0.5 mm | 0.8 mm |
| 端子位置 | QUAD | QUAD | QUAD | QUAD |
| 宽度 | 10 mm | 14 mm | 10 mm | 14 mm |
| uPs/uCs/外围集成电路类型 | MICROCONTROLLER | MICROCONTROLLER | MICROCONTROLLER | MICROCONTROLLER |
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