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TMP87CH21CDFG: 产品描述TLCS-870 Series; 产品类别嵌入式处理器和控制器微控制器和处理器; 文件大小6MB，共118页; 制造商Toshiba(东芝); 官网地址http://toshiba-semicon-storage.com/

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TMP87CH21CDFG概述

TLCS-870 Series

TMP87CH21CDFG规格参数

参数名称	属性值
厂商名称	Toshiba(东芝)
零件包装代码	QFP
包装说明	FQFP,
针数	80
Reach Compliance Code	unknow
具有ADC	YES
其他特性	OPERATES AT 2.7V MIN SUPPLY @ 4.2 MHZ
地址总线宽度
位大小	8
最大时钟频率	8 MHz
DAC 通道	NO
DMA 通道	NO
外部数据总线宽度
JESD-30 代码	S-PQFP-G80
长度	12 mm
I/O 线路数量	52
端子数量	80
最高工作温度	70 °C
最低工作温度	-30 °C
PWM 通道	YES
封装主体材料	PLASTIC/EPOXY
封装代码	FQFP
封装形状	SQUARE
封装形式	FLATPACK, FINE PITCH
认证状态	Not Qualified
ROM可编程性	MROM
座面最大高度	1.85 mm
速度	8 MHz
最大供电电压	5.5 V
最小供电电压	4.5 V
标称供电电压	5 V
表面贴装	YES
技术	CMOS
温度等级	OTHER
端子形式	GULL WING
端子节距	0.5 mm
端子位置	QUAD
宽度	12 mm
uPs/uCs/外围集成电路类型	MICROCONTROLLER

文档解析

TOSHIBA TLCS-870系列是一款8位CMOS微控制器，基于先进的原生架构设计，适用于嵌入式系统和一般电子设备。该系列包括多种型号如TMP87CH21CFG、TMP87CM21CFG和TMP87CP21CFG，提供高效的计算能力和低功耗特性。这些微控制器采用标准CMOS工艺，支持多种外围接口，便于集成到各类应用场景中。在技术规格方面，该产品提供OTP（一次性可编程）选项，封装形式包括QFP80和LQFP80，具体封装代码如QFP80-P-1420-0.80M，尺寸细节可参考附带文档。无铅版本已推出，部件号添加G后缀，焊接性测试在245°C下进行5秒浸渍，确保95%以上焊料覆盖率。变更部分涉及封装代码更新，但不影响核心功能参数。产品适用于计算机、办公设备和工业自动化等通用电子领域。使用时需遵守安全设计原则，避免高风险应用如医疗或交通控制。可靠性方面，建议参考TOSHIBA半导体可靠性手册进行预测和验证，确保系统级安全。

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TOSHIBA Original CMOS 8-Bit Microcontroller

TLCS-870 Series

TMP87CH21CFG, TMP87CM21CFG

TMP87CP21CFG, TMP87CH21CDFG

TMP87CM21CDFG, TMP87CP21CDFG

Semiconductor Company

TMP87CH21C/M21C/P21C

4. RESTRICTIONS ON PRODUCT USE

The following replaces the “RESTRICTIONS ON PRODUCT USE” on page 1 of body text.

RESTRICTIONS ON PRODUCT USE

20070701-EN

•

The information contained herein is subject to change without notice.

•

TOSHIBA is continually working to improve the quality and reliability of its products. Nevertheless, semiconductor

devices in general can malfunction or fail due to their inherent electrical sensitivity and vulnerability to physical

stress. It is the responsibility of the buyer, when utilizing TOSHIBA products, to comply with the standards of safety

in making a safe design for the entire system, and to avoid situations in which a malfunction or failure of such

TOSHIBA products could cause loss of human life, bodily injury or damage to property.

In developing your designs, please ensure that TOSHIBA products are used within specified operating ranges as

set forth in the most recent TOSHIBA products specifications. Also, please keep in mind the precautions and

conditions set forth in the “Handling Guide for Semiconductor Devices,” or “TOSHIBA Semiconductor Reliability

Handbook” etc.

•

The TOSHIBA products listed in this document are intended for usage in general electronics applications (computer,

personal equipment, office equipment, measuring equipment, industrial robotics, domestic appliances, etc.).These

TOSHIBA products are neither intended nor warranted for usage in equipment that requires extraordinarily high

quality and/or reliability or a malfunction or failure of which may cause loss of human life or bodily injury

(“Unintended Usage”). Unintended Usage include atomic energy control instruments, airplane or spaceship

instruments, transportation instruments, traffic signal instruments, combustion control instruments, medical

instruments, all types of safety devices, etc.. Unintended Usage of TOSHIBA products listed in his document shall

be made at the customer’s own risk.

•

The products described in this document shall not be used or embedded to any downstream products of which

manufacture, use and/or sale are prohibited under any applicable laws and regulations.

•

The information contained herein is presented only as a guide for the applications of our products. No responsibility

is assumed by TOSHIBA for any infringements of patents or other rights of the third parties which may result from its

use. No license is granted by implication or otherwise under any patents or other rights of TOSHIBA or the third

parties.

•

Please contact your sales representative for product-by-product details in this document regarding RoHS

compatibility. Please use these products in this document in compliance with all applicable laws and regulations that

regulate the inclusion or use of controlled substances. Toshiba assumes no liability for damage or losses occurring

as a result of noncompliance with applicable laws and regulations.

•

For a discussion of how the reliability of microcontrollers can be predicted, please refer to Section 1.3 of the chapter

entitled Quality and Reliability Assurance/Handling Precautions.

5. Publication date of the datasheet

The publication date of this datasheet is printed at the lower right corner of this notification.

III

22008-03-06

TMP87CH21CDFG相似产品对比

	TMP87CH21CDFG	TMP87CH21CFG	TMP87CM21CDFG	TMP87CM21CFG	TMP87CP21CDFG	TMP87CP21CFG
描述	TLCS-870 Series	TLCS-870 Series	TLCS-870 Series	TLCS-870 Series	TLCS-870 Series	TLCS-870 Series
厂商名称	Toshiba(东芝)	Toshiba(东芝)	Toshiba(东芝)	Toshiba(东芝)	Toshiba(东芝)	Toshiba(东芝)
零件包装代码	QFP	QFP	QFP	QFP	QFP	QFP
包装说明	FQFP,	QFP,	12 X 12 MM, 0.50 MM PITCH, LEAD FREE, PLASTIC, LQFP-80	14 X 20 MM, 0.80 MM PITCH, LEAD FREE, PLASTIC, QFP-80	FQFP,	14 X 20 MM, 0.80 MM PITCH, LEAD FREE, PLASTIC, QFP-80
针数	80	80	80	80	80	80
Reach Compliance Code	unknow	unknow	unknow	unknow	unknow	unknow
具有ADC	YES	YES	YES	YES	YES	YES
其他特性	OPERATES AT 2.7V MIN SUPPLY @ 4.2 MHZ	OPERATES AT 2.7V MIN SUPPLY @ 4.2 MHZ	OPERATES AT 2.7V MIN SUPPLY @ 4.2 MHZ	OPERATES AT 2.7V MIN SUPPLY @ 4.2 MHZ	OPERATES AT 2.7V MIN SUPPLY @ 4.2 MHZ	OPERATES AT 2.7V MIN SUPPLY @ 4.2 MHZ
位大小	8	8	8	8	8	8
最大时钟频率	8 MHz	8 MHz	8 MHz	8 MHz	8 MHz	8 MHz
DAC 通道	NO	NO	NO	NO	NO	NO
DMA 通道	NO	NO	NO	NO	NO	NO
JESD-30 代码	S-PQFP-G80	R-PQFP-G80	S-PQFP-G80	R-PQFP-G80	S-PQFP-G80	R-PQFP-G80
长度	12 mm	20 mm	12 mm	20 mm	12 mm	20 mm
I/O 线路数量	52	52	52	52	52	52
端子数量	80	80	80	80	80	80
最高工作温度	70 °C	70 °C	70 °C	70 °C	70 °C	70 °C
最低工作温度	-30 °C	-30 °C	-30 °C	-30 °C	-30 °C	-30 °C
PWM 通道	YES	YES	YES	YES	YES	YES
封装主体材料	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
封装代码	FQFP	QFP	FQFP	QFP	FQFP	QFP
封装形状	SQUARE	RECTANGULAR	SQUARE	RECTANGULAR	SQUARE	RECTANGULAR
封装形式	FLATPACK, FINE PITCH	FLATPACK	FLATPACK, FINE PITCH	FLATPACK	FLATPACK, FINE PITCH	FLATPACK
认证状态	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
ROM可编程性	MROM	MROM	MROM	MROM	MROM	MROM
座面最大高度	1.85 mm	3.05 mm	1.85 mm	3.05 mm	1.85 mm	3.05 mm
速度	8 MHz	8 MHz	8 MHz	8 MHz	8 MHz	8 MHz
最大供电电压	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V
最小供电电压	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V
标称供电电压	5 V	5 V	5 V	5 V	5 V	5 V
表面贴装	YES	YES	YES	YES	YES	YES
技术	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
温度等级	OTHER	OTHER	OTHER	OTHER	OTHER	OTHER
端子形式	GULL WING	GULL WING	GULL WING	GULL WING	GULL WING	GULL WING
端子节距	0.5 mm	0.8 mm	0.5 mm	0.8 mm	0.5 mm	0.8 mm
端子位置	QUAD	QUAD	QUAD	QUAD	QUAD	QUAD
宽度	12 mm	14 mm	12 mm	14 mm	12 mm	14 mm
uPs/uCs/外围集成电路类型	MICROCONTROLLER	MICROCONTROLLER	MICROCONTROLLER	MICROCONTROLLER	MICROCONTROLLER	MICROCONTROLLER

TMP87CH21CDFG