PRODUCT DATASHEET
Mira series
last update 17/4/2012
Ordering number C12502_MIRA-WW
Family
Type
LED
Color
Diameter
Height
Style
Optic Material
Holder Material
Fastening
Status
Mira
Lens
MT-G
Clear
32.4 mm
14.7 mm
Round
PC
-
Glue
Ready
FWHM
Efficiency
cd/lm
Gerber File
58 degrees
81 %
0.900
Available
Ordering number CA12505_MIRA-WW
Family
Type
LED
Color
Diameter
Height
Style
Optic Material
Holder Material
Fastening
Status
Mira
Assembly
MT-G
White
35 mm
15.8 mm
Round
PC
PC
Tape
Ready
FWHM
Efficiency
cd/lm
Gerber File
66 degrees
81 %
-
Available
NOTE: The typical divergence will be changed by different color, chip size and chip position
tolerance. The typical total divergence is the full angle measured where the luminous intensity
is half of the peak value.
October 19th 2012 21:21 Copyright Ledil Oy - Subject to change without prior notice - Page 2/3
Ledil Oy
Salorankatu 10
24240 SALO
Finland
http://www.ledil.com
email: ledil@ledil.com
FAX: +358-2-733 8001
PRODUCT DATASHEET
Mira series
last update 17/4/2012
GENERAL INFORMATION
- Product series especially designed & optimized for MT-G series of LEDs.
- Special care taken to make light distribution as uniform as possible.
- Lens material optical grade PC with high UV and temperature resistance (120 degrees of Celcius / 248
degrees of Fahrenheit). Allows use of high current and temperature conditions.
Please find more information about used materials from below:
http://ledil.fi/sites/default/files/Documents/Technical/Material/PC%20Makrolon%202400_2407_2456_2458-UL
.pdf
- Optic holder molded by high quality PC material (120 dergees of Celcius / 248 degrees of Fahrenheit).
- Fastening to heat sink with a PU foam adhesive tape of automotive grade. Please find fastening details by
clicking link: http://www.ledil.com/datasheets/DataSheet_TAPE.pdf
- Fastening to PCB with appropriate adhesive. By clicking link below you can find Ledil recommended glue
options.
http://www.ledil.com/datasheets/DataSheet_GLUES.pdf
NOTE 1: We advise customer to ensure the suitability and sufficiency of the bond in the end
product. For example, mechanical stress, vibration and holes on the surface of the circuit boar
weaken the strength of the tape.
NOTE 2: Assembly to the surface must be made straight, so the tape bonds constant and
balanced with fastening surface. Slanted assembly might cause unbalanced bond to the
surface. All surfaces where tape is applied must be clean, dry and free from grease and dirt.
If cleaning of PCB surfaces is needed, please follow strictly the cleaning instructions of your
LED manufacturer - this is important as cleaning shall under no circumstances damage LEDs or
other electronics components on the PCB.
Further note that optical components shall not be cleaned with any chemicals - only micro fiber
cloth may be used to remove fingerprints or other traces from handling.
NOTE 1: We advise customer to ensure the suitability and sufficiency of the bond in the end
product. For example, mechanical stress, vibration and holes on the surface of the circuit boar
weaken the strength of the glue.
NOTE 2: All surfaces where glue is applied must be clean, dry and free from grease and dirt. If
cleaning of PCB surfaces is needed, please follow strictly the cleaning instructions of your LED
manufacturer -this is important as cleaning shall under no circumstances damage LEDs or other
electronics components on the PCB.
Further note that optical components shall not be cleaned with any chemicals - only micro fiber
cloth may be used to remove fingerprints or other traces from handling.
October 19th 2012 21:21 Copyright Ledil Oy - Subject to change without prior notice - Page 3/3
Ledil Oy
Salorankatu 10
24240 SALO
Finland
http://www.ledil.com
email: ledil@ledil.com
FAX: +358-2-733 8001
PCB设计
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