MIC-5603
NEW
Advanced Mezzanine Card based on 3rd Generation
Intel
®
Core™ Processors with ECC
Features
Supports 3rd or 2nd Generation Intel
®
Core™ Processor family
Intel
®
QM67 PCH chipset with KVM over LAN
Up to 8 GB (DDR3 1066/1333/1600 MHz) soldered SDRAM with ECC
Two Gigabit Ethernet (RJ-45), one USB 2.0 (or two for full-size sku), one
console (micro-USB), and one HDMI Type D ( or Type A for full-size sku) to
front panel
AMC connector routes Gigabit Ethernet (x2), SATA 3.0 (x2), PCIe x4
Dual XAUI, SRIO, PCIe or custom fabrics on fat pipes with optional AMC fabric
mezzanine
Boot from network, onboard flash, CFast card or external devices
Supports IPMI v1.5 and Serial-over-LAN function
AMC.0, AMC.1, AMC.2, and AMC.3 compliant
RoHS
COMPLIANT
2002/95/EC
Introduction
The Advantech MIC-5603 is a single-width mid-size or full-size general purpose processor AMC module for ATCA or MicroTCA applications. Its design is based on 3rd generation
Intel
®
Core™ processors in a BGA package combined with the Intel
®
QM67 chipset. This AMC module supports processors with integrated memory and graphics controllers, and a
maximum L3 cache of 4MB. It can support up to 8 GB, dual-channel, on-board DDR3 memory with ECC at 1600 MHz, making it ideal for mission critical applications requiring low
latency and reliable memory access. For graphics or control applications the front panel HDMI port provides support for the processor’s integrated Intel
®
HD 4000 graphics controller
with DirectX v11, along with OpenGL v3.1 and OpenCL v1.1 capabilities.
As standard feature, external Ethernet connectivity is provided on two dedicated GbE front panel ports, one each from the Intel
®
QM67 PCH and the onboard Intel
®
82580 quad port
LAN controller, which also provides two additional GbE ports to the AMC base fabric. The Intel
®
PCH brings new and enhanced remote management capabilities with KVM over LAN
as well as introducing faster I/O than previous generation designs with SATA-III to AMC ports 2..3 and PCIe x4 gen.2 to ports 4..7. This module can also be configured to boot from
the network, local CFast compact flash or flash disk, or external storage media such as HDD or USB drives.
To enable maximum application flexibility, the MIC-5603 is not only designed to support PICMG AMC sub-specifications such as AMC.1/.2/.3, it also has a fabric expansion mezzanine
interface that allows the implementation of standard or customized mezzanine modules that offer enhanced fat pipe connectivity and I/O support. For example, the fabric expansion
mezzanine can implement an Intel
®
82599 controller offering dual 10 GbE to the fat pipes or a PCIe-to-SRIO bridge or any other type of PCIe device for tailored connectivity to ports
8..11 and 17..20. A dedicated Module Management Controller (MMC) monitors onboard conditions and manages hot swap operation, module replacement and field upgrades without
the need to power down the carrier system.
Specifications
Processor System
Bus
Memory
Ethernet
Front I/O Interface
Mass Storage
SATA
Interfaces
Operating System
System Management
Watchdog Timer
Miscellaneous
Compliance
CPU
Max. Speed
PCH
BIOS
DMI
Technology
Max. Capacity
Controllers
Interface
Serial (COM)
Ethernet
USB 2.0
CFast
Onboard
AMC edge connector
Other
Compatibility
MMC
IPMI Compliancy
Supervision
Interval
LEDs
Standards
Intel 3rd Generation Core i7 mobile processors up to 2.5 GHz (4 MB L3 cache)
3.2 GHz (turbo boost frequency with 1 core)
Intel QM67
UEFI BIOS based on AMI
(1. Redundant flash with HPM.1 update & rollback, 2. Configuration settings can be changed over IPMI)
5.0 GT/s point-to-point DMI interface to PCH
Dual channel DDR3 1066MT/s, 1333MT/s, and 1600MT/s SDRAM with ECC.
8 GB RAM (soldered on-board memory)
Intel 82580EB Quad-port Gigabit Ethernet controller
Two GbE accessible on front panel via RJ-45 and two SerDes links to AMC ports 0 and 1
One x86 Serial Port
(USB slave connector through onboard USB to Serial converter)
Two 10/100/1000BASE-T through PCIe based Intel 82580 & 82579 MAC/PHY
One port (Type A)
Mezzanine Module with CFast socket (NOTE 1)
8 GB (standard) or 16 GB (optional) industrial grade internal SATA flash disk
Two SATA interfaces (6Gbps) to common option ports 2..3
One SATA routed to CF daughter board (optional)
WindRiver PNE-LE 3.0, RHEL, CentOS, Windows Server 2008, Windows 7 Enterprise
NXP LPC1768
IPMI 1.5 with IPMI 2.0 features (e.g. RMCP, SOL) using Advantech IPMI Core
One MMC watchdog, One payload watchdog
IPMI compliant
x1 blue for hot swap, x1 red/amber for failure and OOS, x1 green for general purpose
PICMG AMC.0, AMC.1, AMC.2, AMC.3, IPMI v1.5, HPM.1
All product specifications are subject to change without notice
Last updated : 18-Jun-2012
MIC-5603
Block Diagram
1xLAN
DDR3
4GB
GPIO
DDR3
4GB
NC-SI
1000BX
HDMI (Type D for mid-size
sku/Type A for full-size sku)
(AMM)
AMC fabric
mezzanine
High speed
B2B
Connector
PCIex8, 1x PCIex1, 1xUSB
2xSRIO/XAUI/PCIe (2 Quad Lanes)
72bit
4 diffpairs
Display ports
72bit
PCIex4
i82580
P0
P1
P2
P3
P4
Common
options
1000BX
SATA
SATA
IO Header
PHY
(full-size sku only)
USB
LOM
USB
(Located on AMM or CFast module)
3rd or 2nd Generation
Intel® Core™ Processor
+ Intel® QM67 Chipset
PCIex4
P5
P6
P7
Fat
Pipes
PCIe
(Located on AMM)
Flash
SATA
Redriver
LPC, SPI
Clocks
GPIO
XAUI/
SRIO/
PCIex4
P9
P10
P11
P12
Fat
Pipes
XAUI
SATA
Header
(for CF module)
SATA
SPI
Flash
USB2
UART
UART
FPGA
UART
P13
P14
P15
P17
XAUI/
SRIO
MISC
USB Slave
Micro AB
UART, SPI, GPIO
P18
P19
P20
TCLK
FCLK
IPMB-L
Reset button
HW
MONITOR
TEMP.
Sensor
FRU
E
2
PROM
MMC
RTM
NC-SI
Clocks
PCIe Ref clock
IPMB-L
Handle SW
Clock
Mgmnt.
PICMG3.0+
User LEDs
Specifications (Cont.)
Power Consumption
Physical Characteristics
Configuration
TDP (Estimated)
Dimensions (W x D)
Temperature
Humidity
Vibration (5 ~ 500Hz)
Shock
Altitude
Conformance
NEBS Level 3
Intel Core i7-3555LE + QM67 + 8GB on-board DDR-III memory
40W max.
Mid-size (or Full-size), 180.6 x 73.5 mm
Operating
Non-operating
-5 ~ 55° C (23 ~ 131° F) (NOTE 2)
-40 ~ 70° C (-40 ~ 158° F)
IEC60068-2-78 (95%RH @ 40° C)
IEC60068-2-6 (0.002G2/Hz, 1Grms)
IEC60068-2-27 (10G, 11ms)
4,000m above sea level
10,000m above sea level
UL94V0, FCC Class B, CE, RoHS & WEEE Ready
Designed for GR-63-Core and GR-1089-Core
Environment
Regulatory
Ordering Information
Part Number (NOTE3, NOTE4)
MIC-5603A2FZ-M4E
MIC-5603A2FZ-M8E
MIC-5603A2M-M4E
MIC-5603A2M-M8E
MIC-5603AFZ-M4E
MIC-5603AFZ-M8E
MIC-5603AM-M4E
MIC-5603AM-M8E
Description
Full-size front panel, Intel i7-3555LE, 4GB DDR3 with ECC, AMC Mezzanine Module with 8 GB on-board flash
Full-size front panel, Intel i7-3555LE, 8GB DDR3 with ECC, AMC Mezzanine Module with 8 GB on-board flash
Mid-size front panel, Intel i7-3555LE, 4GB DDR3 with ECC, CFast module with 8 GB on-board flash
Mid-size front panel, Intel i7-3555LE, 8GB DDR3 with ECC, CFast module with 8 GB on-board flash
Full-size front panel, Intel i7-2655LE, 4GB DDR3 with ECC, AMC Mezzanine Module with 8 GB on-board flash
Full-size front panel, Intel i7-2655LE, 8GB DDR3 with ECC, AMC Mezzanine Module with 8 GB on-board flash
Mid-size front panel, Intel i7-2655LE, 4GB DDR3 with ECC, CFast module with 8 GB on-board flash
Mid-size front panel, Intel i7-2655LE, 8GB DDR3 with ECC, CFast module with 8 GB on-board flash
Where Z stands for fabric expansion mezzanine module option (Z = X for XAUI, Z= S for SRIO, Z = R for SAS RAID).
Note:
1. CFast module, available on the mid-size sku as default, and the AMC Mezzanine Module are mutually exclusive. For 16 GB on-board flash, please contact your local
Advantech sales.
2. Operating Temperature: depending on the actual air flow through the AMC slot.
3. For lower or higher on-board memory support, please contact your local Advantech sales for options.
4. For the Intel Core i7-3517UE or i7-2610EU support, please contact your local Advantech sales.
Online Download
www.advantech.com/products
AMC CONNECTOR
P8
嵌入式系统
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