8-CHANNEL, SGL ENDED MULTIPLEXER, CDFP16, CERAMIC, DFP-16
| 参数名称 | 属性值 |
| 是否无铅 | 含铅 |
| 是否Rohs认证 | 不符合 |
| 厂商名称 | Renesas(瑞萨电子) |
| 零件包装代码 | DFP |
| 包装说明 | DFP, |
| 针数 | 16 |
| Reach Compliance Code | compliant |
| 模拟集成电路 - 其他类型 | SINGLE-ENDED MULTIPLEXER |
| JESD-30 代码 | R-CDFP-F16 |
| JESD-609代码 | e4 |
| 标称负供电电压 (Vsup) | -15 V |
| 信道数量 | 8 |
| 功能数量 | 1 |
| 端子数量 | 16 |
| 标称断态隔离度 | 45 dB |
| 最大通态电阻 (Ron) | 1800 Ω |
| 最高工作温度 | 125 °C |
| 最低工作温度 | -55 °C |
| 封装主体材料 | CERAMIC, METAL-SEALED COFIRED |
| 封装代码 | DFP |
| 封装形状 | RECTANGULAR |
| 封装形式 | FLATPACK |
| 峰值回流温度(摄氏度) | NOT SPECIFIED |
| 认证状态 | Not Qualified |
| 筛选级别 | MIL-PRF-38535 |
| 座面最大高度 | 2.92 mm |
| 标称供电电压 (Vsup) | 15 V |
| 表面贴装 | YES |
| 最长断开时间 | 3000 ns |
| 最长接通时间 | 3000 ns |
| 技术 | CMOS |
| 温度等级 | MILITARY |
| 端子面层 | GOLD |
| 端子形式 | FLAT |
| 端子节距 | 1.27 mm |
| 端子位置 | DUAL |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED |
| 总剂量 | 100k Rad(Si) V |
| 宽度 | 6.73 mm |

| 5962R9674202VXC | 5962R9674202QXC | 5962R9674202VEX | 5962R9674202QEX | 5962R9674202VEC | 5962R9674202QEC | 5962R9674202VXX | 5962R9674202QXX | |
|---|---|---|---|---|---|---|---|---|
| 描述 | 8-CHANNEL, SGL ENDED MULTIPLEXER, CDFP16, CERAMIC, DFP-16 | 8-CHANNEL, SGL ENDED MULTIPLEXER, CDFP16, CERAMIC, DFP-16 | 8-CHANNEL, SGL ENDED MULTIPLEXER, CDIP16, SIDE BRAZED, CERAMIC, DIP-16 | 8-CHANNEL, SGL ENDED MULTIPLEXER, CDIP16, SIDE BRAZED, CERAMIC, DIP-16 | 8-CHANNEL, SGL ENDED MULTIPLEXER, CDIP16, SIDE BRAZED, CERAMIC, DIP-16 | 8-CHANNEL, SGL ENDED MULTIPLEXER, CDIP16, SIDE BRAZED, CERAMIC, DIP-16 | 8-CHANNEL, SGL ENDED MULTIPLEXER, CDFP16, CERAMIC, DFP-16 | 8-CHANNEL, SGL ENDED MULTIPLEXER, CDFP16, CERAMIC, DFP-16 |
| 零件包装代码 | DFP | DFP | DIP | DIP | DIP | DIP | DFP | DFP |
| 包装说明 | DFP, | DFP, | DIP, | DIP, | DIP, | DIP, | DFP, | DFP, |
| 针数 | 16 | 16 | 16 | 16 | 16 | 16 | 16 | 16 |
| Reach Compliance Code | compliant | compliant | compliant | compliant | compliant | compliant | compliant | compli |
| 模拟集成电路 - 其他类型 | SINGLE-ENDED MULTIPLEXER | SINGLE-ENDED MULTIPLEXER | SINGLE-ENDED MULTIPLEXER | SINGLE-ENDED MULTIPLEXER | SINGLE-ENDED MULTIPLEXER | SINGLE-ENDED MULTIPLEXER | SINGLE-ENDED MULTIPLEXER | SINGLE-ENDED MULTIPLEXER |
| JESD-30 代码 | R-CDFP-F16 | R-CDFP-F16 | R-CDIP-T16 | R-CDIP-T16 | R-CDIP-T16 | R-CDIP-T16 | R-CDFP-F16 | R-CDFP-F16 |
| 标称负供电电压 (Vsup) | -15 V | -15 V | -15 V | -15 V | -15 V | -15 V | -15 V | -15 V |
| 信道数量 | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 |
| 功能数量 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| 端子数量 | 16 | 16 | 16 | 16 | 16 | 16 | 16 | 16 |
| 标称断态隔离度 | 45 dB | 45 dB | 45 dB | 45 dB | 45 dB | 45 dB | 45 dB | 45 dB |
| 最大通态电阻 (Ron) | 1800 Ω | 1800 Ω | 1800 Ω | 1800 Ω | 1800 Ω | 1800 Ω | 1800 Ω | 1800 Ω |
| 最高工作温度 | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C |
| 最低工作温度 | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C |
| 封装主体材料 | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED |
| 封装代码 | DFP | DFP | DIP | DIP | DIP | DIP | DFP | DFP |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | FLATPACK | FLATPACK | IN-LINE | IN-LINE | IN-LINE | IN-LINE | FLATPACK | FLATPACK |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 筛选级别 | MIL-PRF-38535 | MIL-PRF-38535 | MIL-PRF-38535 | MIL-PRF-38535 | MIL-PRF-38535 | MIL-PRF-38535 | MIL-PRF-38535 | MIL-PRF-38535 |
| 座面最大高度 | 2.92 mm | 2.92 mm | 5.08 mm | 5.08 mm | 5.08 mm | 5.08 mm | 2.92 mm | 2.92 mm |
| 标称供电电压 (Vsup) | 15 V | 15 V | 15 V | 15 V | 15 V | 15 V | 15 V | 15 V |
| 表面贴装 | YES | YES | NO | NO | NO | NO | YES | YES |
| 最长断开时间 | 3000 ns | 3000 ns | 3000 ns | 3000 ns | 3000 ns | 3000 ns | 3000 ns | 3000 ns |
| 最长接通时间 | 3000 ns | 3000 ns | 3000 ns | 3000 ns | 3000 ns | 3000 ns | 3000 ns | 3000 ns |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY |
| 端子形式 | FLAT | FLAT | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | FLAT | FLAT |
| 端子节距 | 1.27 mm | 1.27 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 1.27 mm | 1.27 mm |
| 端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
| 总剂量 | 100k Rad(Si) V | 100k Rad(Si) V | 100k Rad(Si) V | 100k Rad(Si) V | 100k Rad(Si) V | 100k Rad(Si) V | 100k Rad(Si) V | 100k Rad(Si) V |
| 宽度 | 6.73 mm | 6.73 mm | 7.62 mm | 7.62 mm | 7.62 mm | 7.62 mm | 6.73 mm | 6.73 mm |
| 厂商名称 | Renesas(瑞萨电子) | - | Renesas(瑞萨电子) | Renesas(瑞萨电子) | Renesas(瑞萨电子) | Renesas(瑞萨电子) | Renesas(瑞萨电子) | Renesas(瑞萨电子) |
| Base Number Matches | - | 1 | 1 | 1 | 1 | 1 | - | - |
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