05
COM Express CPU Modules
COM-945GSE
COM Express Type 2 CPU Module With Onboard Intel® Atom™ N270 Processor
Features
DDR2 SODIMM
Intel® 945GSE
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Onboard Intel® Atom™ N270
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Intel® 945GSE + ICH7M
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SODIMM DDR2
Processor
Intel® ICH7M
Onboard Intel®
Atom™ N270
Processor
Intel® 82574L
Gigabit Ethernet
400/533 Memory, Max. 2 GB
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Gigabit Ethernet
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CRT, 18-bit Dual-channel LVDS LCD, SDVO
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High Definition Audio Interface
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PATA x 1, SATA 1.5Gb/s x 2
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USB2.0 x 8
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PCI x 4, PCI-Express [x1] x 3
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Wide DC Input Range, +8.5V To +19V (Optional)
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COM Express Pin-out Type 2
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Compact Module Size, 95mm x 95mm, COM.0 Rev. 1.0
2-pin Wafer for
RTC Battery
Specifications
System
Form Factor
Processor
System Memory
Chipset
I/O Chipset
Ethernet
BIOS
EEPROM
Wake on LAN
Watchdog Timer
H/W Status Monitoring
COM Express compact module, Pin-out Type 2, COM.0 Rev. 1.0
Onboard Intel® Atom™ N270 Processor, 1.6 GHz, FSB 533 MHz
200-pin DDR2 SODIMM x 1, Max. 2 GB (DDR2 400/533)
Intel® 945GSE + ICH7M
ICH7M
Intel® 82574L, 10/100/1000Base-TX
Award BIOS v8.0
SPI type, 2 MB ROM
Atmel® AT24C02, save BIOS and configuration data (Optional)
Yes
Fintek F75111
Supports CPU temperature monitoring
PCI-Express [x1] x 3 (82801GBM)
PCI-Express [x1] x 5 (82801GHM) (Optional)
32-bit PCI x 4
LPC bus x 1
SMBus x 1
I2C x 1
Wide DC input range, +8.5V to +19V (Optional)
Nominal: +12V
2-pin wafer for RTC battery
Intel® Atom™ N270 1.6 GHz, DDR2 533 1 GB
1.31A @ +12V
0.36A @ +5V (w/ECB-916M)
3.74" (L) x 3.74" (W) (95mm x 95mm)
0.55 lb (0.25 Kg)
32˚F ~ 140˚F (0˚C ~ 60˚C), -4°F ~ 158°F (-20°C ~ 70°C) for WiTAS 1
-40˚F ~ 176˚F (-40˚C ~ 80˚C)
0% ~ 90% relative humidity, non-condensing
100,000
Supports CRT/LCD simultaneous/ dual view displays
Intel® 945GSE integrated
Shared system memory up to 224 MB/ DVMT 3.0
Up to 2048 x 1536 (QXGA) for CRT
Up to 1600 x 1200 (UXGA) for LCD
18-bit dual-channel LVDS
Supports SDVO x 1
PATA x 1 (Two devices)
SATA 1.5Gb/s x 2
USB2.0 x 8
High definition audio
Up to 4 in or 4 out
Packing List
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M2.5 Screw x 4
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Product CD
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COM-945GSE
Expansion Interface
Power Requirement
Power Consumption
(Typical)
Board Size
Gross Weight
Operating Temperature
Storage Temperature
Operating Humidity
MTBF (Hours)
Display
Chipset
Memory
Resolutions
LCD Interface
SDVO
I/O
Storage
USB
Audio
GPIO
05-19
Note: All specifications are subject to change without notice.
COM-945GSE
Dimension
Unit: mm
Ordering Information
Part Number
TF-COM-945GSE-A11-01
TF-COM-945GSEW1-A11
COM Express Type
2 (COM.0 Rev.1.0)
2 (COM.0 Rev.1.0)
CPU
Intel® Atom™ N270/1.6G
Intel® Atom™ N270/1.6G
Memory
DDR2 SODIMM x 1
Max.2GB
DDR2 SODIMM x 1
Max.2GB
Display
CRT, LVDS, SDVO
CRT, LVDS, SDVO
LVDS
18-bit dual channel
18-bit dual channel
Storage
SATA2 x 2
PATA x 1
SATA2 x 2
PATA x 1
LAN
GbE x 1
GbE x 1
USB
USB2.0 x 8
USB2.0 x 8
URAT
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—
Expansion Slot
PCI-E[1] x 3
32-bit PCI x 4
PCI-E[1] x 3
32-bit PCI x 4
Power
12V
12V
Temp
0°C ~ 60°C
WiTAS 1
-20°C ~ 70°C
Optional Accessories
•
TF-ECB-916M-A10-02
COM Express Carrier Board, microATX, Dual Gigabit Ethernet, 7.1CH Audio, 4 COM, USB, PCI-Express, AT/ATX, 6th Standoff, Rev. A1.0
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TF-PER-A060
CPU Cooler, For COM-945GSE, Onboard CPU, 12V Fan
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TF-PER-A055
Passive Heatsink, For COM-945GSE, Onboard CPU
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TF-PER-A056
Heat Speader Kit, For COM-945GSE, Onboard CPU
05-20
微控制器 MCU
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