HI-SINCERITY
MICROELECTRONICS CORP.
Spec. No. : HE200802
Issued Date : 2008.08.19
Revised Date :2009.11.06
Page No. : 1/4
HSBR10100CT Series to
HSBR10150CT Series
Schottky Barrier Rectifiers
(Reverse Voltage 100V to150V, Forward Current 10A)
Features
•
Low Forward Voltage Drop
•
High Current Capability
•
High Reliability
•
High Surge Current Capability
TO-220AB
•
High ESD capability;
TO-220FP
Mechanical Data
•
Cases: TO-220 molded plastic body
•
Epoxy: UL 94V-0 rate flame retardant
•
Lead: Axial leads, solderable per MIL-STD-750, Method 2026 guaranteed
•
High temperature soldering guaranteed: 250°C/10seconds/.375”(9.5mm) lead lengths at 5lbs.(2.3kg) tension
•
Weight: 2.05gram
Maximum Ratings & Electrical Characteristics
Ratings at 25°C ambient temperature unless otherwise specified.
Single phase, half wave, 60 Hz, resistive or inductive load. For capacitive load. Derate current by 20%.
Ratings
Repetitive Peak Reverse Voltage
Surge Peak Reverse Voltage
DC Blocking Voltage
Average Forward Rectified Current (T
A
=75 C)
Peak Forward Surge Current, 50Hz Half
o
Sine-wave (T
A
=25 C)
Repetitive Peak Forward C (f>15Hz)
Instantaneous Forward Voltage@5.0A
Leakage Current (T
J
=25 C, V
R
=V
RRM
)
Leakage Current (T
J
=100 C, V
R
=V
RRM
)
Typical thermal resistance
o
o
o
Symbol
V
RRM
V
RSM
V
DC
I
FAV
I
FSM
I
FRM
V
F
I
R
R
θ
JC
T
J
T
STG
HSBR
10100CTE
100
70
100
10
175
5
0.85
0.2
20
2.4
HSBR
10100CTF
HSBR
10150CTE
150
105
150
10
175
5
0.90
0.2
20
HSBR
10150CTF
Unit
V
V
V
A
A
A
V
mA
mA
3.5
-65 to +150
-65 to +150
2.4
3.5
°C/W
°C
°C
Operating Junction Temperature Range
Storage Temperature Range
HSBR10100CT Series ~HSBR10150CT Series
HSMC Product Specification
HI-SINCERITY
MICROELECTRONICS CORP.
Characteristics Curve
Typical Instantaneous Forward Characteristics
10
IF,Forward Current
200
180
160
140
120
100
80
60
40
20
0
`
Spec. No. : HE200802
Issued Date : 2008.08.19
Revised Date :2009.11.06
Page No. : 2/4
Maximum Non-repetitive Peak
Forward Surge Current
Peak Forward
Surge Current(A)
1
0.1
0.01
100V
150V
T j=T jmax.8.3ms single half
sine-wave(JEDEC Method)
Ta=25
℃
0.001
0
0.2
0.4
0.6
0.8
VF,Forward Voltage(V)
1
1
10
100
Number of Cycles at 50Hz
Typical Reverse Characteristics
Instantaneous Reverse Curren
Typical Reverse Characteristics
1
1
Instantaneous Reve
Current(mA)
0.1
Tj=150
℃
100V
Tj=120
℃
Tj=100
℃
Tj=75
℃
150V
0.1
Tj=150
℃
Tj=125
℃
0.01
Tj=100
℃
Tj=75
℃
0.001
Tj=25
℃
0.0001
0.01
0.001
Tj=25
℃
0.0001
0
50
100
150
Percent of Rated Peak Reverse Voltage(V)
0
20
40
60
80
100
Percent of Rated Peak Reverse Voltage(V)
120
Forward Current Derating Curve
12
Average Forward Curren
10
8
6
4
2
0
0
25
50
75
100
125
150
175
Resistive or Inductive Load
0.375"(9.5mm)lead length
Lead Temperature(
℃
)
HSBR10100CT Series ~HSBR10150CT Series
HSMC Product Specification
HI-SINCERITY
MICROELECTRONICS CORP.
TO-220AB Dimension
Marking:
A
D
B
E
C
F
Spec. No. : HE200802
Issued Date : 2008.08.19
Revised Date :2009.11.06
Page No. : 3/4
H
I
G
Tab
P
L
J
M
3
2
1
O
N
K
Note: Green label is used for pb-free packing
Pin Style: 1.Anode 2.Cathode 3.Anode
Material:
•
Lead solder plating: Sn60/Pb40 (Normal),
Sn/3.0Ag/0.5Cu or Pure-Tin (Pb-free)
•
Mold Compound: Epoxy resin family,
flammability solid burning class: UL94V-0
DIM
A
B
C
D
E
F
G
H
I
J
K
L
M
N
O
P
Min.
5.58
8.38
4.40
1.15
0.35
2.03
9.66
-
-
3.00
0.75
2.54
1.14
-
12.70
14.48
Max.
7.49
8.90
4.70
1.39
0.60
2.92
10.28
*16.25
*3.83
4.00
0.95
3.42
1.40
*2.54
14.27
15.87
*: Typical, Unit: mm
3-Lead TO-220AB
Plastic Package
HSMC Package Code: E
Marking:
A
D
B
E
C
F
H
I
G
Tab
P
L
J
M
3
2
1
O
N
K
Note: Green label is used for pb-free packing
Pin Style: 1.Anode 2.Cathode 3.Anode
Material:
•
Lead solder plating: Sn60/Pb40 (Normal),
Sn/3.0Ag/0.5Cu or Pure-Tin (Pb-free)
•
Mold Compound: Epoxy resin family,
flammability solid burning class: UL94V-0
DIM
A
B
C
D
E
F
G
H
I
J
K
L
M
N
O
P
Min.
5.58
8.38
4.40
1.15
0.35
2.03
9.66
-
-
3.00
0.75
2.54
1.14
-
12.70
14.48
Max.
7.49
8.90
4.70
1.39
0.60
2.92
10.28
*16.25
*3.83
4.00
0.95
3.42
1.40
*2.54
14.27
15.87
*: Typical, Unit: mm
3-Lead TO-220AB
Plastic Package
HSMC Package Code: E
HSBR10100CT Series ~HSBR10150CT Series
HSMC Product Specification
HI-SINCERITY
MICROELECTRONICS CORP.
TO-220FP Dimension
Marking:
α
4
E O
D
C
Spec. No. : HE200802
Issued Date : 2008.08.19
Revised Date :2009.11.06
Page No. : 4/4
A
B
α
1
α
2
α
3
α
5
G
H
3
I
N
J
F
2
K
1
M
L
3-Lead TO-220FP Plastic Package
HSMC Package Code: F
Style: 1.Anode 2.Cathode 3.Anode
DIM
A
B
C
D
E
F
G
H
I
J
Inches
Min.
Max.
0.2480
0.2520
0.3386
0.3425
0.1673
0.1870
0.1043
0.1083
0.0230
0.0242
0.3980
0.4039
0.1083
0.1122
0.3386
0.3425
-
*0.1496
-
*0.0236
Millimeters
Min.
Max.
6.30
6.40
8.60
8.70
4.25
4.75
2.65
2.75
0.58
0.61
10.11
10.26
2.75
2.85
8.60
8.70
-
*3.80
-
*0.60
DIM
K
L
M
N
O
α1
α2
α3
α4
α5
Inches
Min.
Max.
-
*0.1004
0.5118
0.5906
0.5886
0.5925
-
*0.0669
0.1098
0.1114
-
-2°
-
*5°
-
*15°
-
*5°
-
*5°
Millimeters
Min.
Max.
-
*2.55
13.00
15.00
14.95
15.05
-
*1.70
2.79
2.83
-
*2°
-
*5°
-
*15°
-
*5°
-
*5°
Notes:
1.Dimension and tolerance based on our Spec. dated Sep. 07,1997.
2.Controlling dimension: millimeters.
3.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material.
4.If there is any question with packing specification or packing method, please contact your local HSMC sales office.
Material:
•
Lead: 42 Alloy; solder plating
•
Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0
Important Notice:
•
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of HSMC.
•
HSMC reserves the right to make changes to its products without notice.
•
HSMC semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems.
•
HSMC assumes no liability for any consequence of customer product design, infringement of patents, or application assistance.
Head Office And Factory:
•
Head Office
(Hi-Sincerity Microelectronics Corp.): 10F.,No. 61, Sec. 2, Chung-Shan N. Rd. Taipei Taiwan R.O.C.
Tel: 886-2-25212056 Fax: 886-2-25632712
HSBR10100CT Series ~HSBR10150CT Series
HSMC Product Specification
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