Standard SRAM, 256KX32, 20ns, CMOS, SIMM-64
参数名称 | 属性值 |
是否Rohs认证 | 不符合 |
厂商名称 | Integrated Silicon Solution ( ISSI ) |
包装说明 | SIMM-64 |
Reach Compliance Code | compliant |
最长访问时间 | 20 ns |
其他特性 | WD-MAX |
I/O 类型 | COMMON |
JESD-30 代码 | R-XSMA-N64 |
JESD-609代码 | e0 |
长度 | 97.79 mm |
内存密度 | 8388608 bit |
内存集成电路类型 | STANDARD SRAM |
内存宽度 | 32 |
功能数量 | 1 |
端子数量 | 64 |
字数 | 262144 words |
字数代码 | 256000 |
工作模式 | ASYNCHRONOUS |
最高工作温度 | 70 °C |
最低工作温度 | |
组织 | 256KX32 |
输出特性 | 3-STATE |
封装主体材料 | UNSPECIFIED |
封装代码 | SIMM |
封装等效代码 | SSIM64 |
封装形状 | RECTANGULAR |
封装形式 | MICROELECTRONIC ASSEMBLY |
并行/串行 | PARALLEL |
电源 | 5 V |
认证状态 | Not Qualified |
座面最大高度 | 15.11 mm |
最大待机电流 | 0.04 A |
最小待机电流 | 4.5 V |
最大压摆率 | 1.12 mA |
最大供电电压 (Vsup) | 5.5 V |
最小供电电压 (Vsup) | 4.5 V |
标称供电电压 (Vsup) | 5 V |
表面贴装 | NO |
技术 | CMOS |
温度等级 | COMMERCIAL |
端子面层 | Tin/Lead (Sn/Pb) |
端子形式 | NO LEAD |
端子节距 | 1.27 mm |
端子位置 | SINGLE |
宽度 | 8.89 mm |
AP32M256M-20 | AP32M256Z-25 | AP32M256M-25 | AP32M256M7-15 | AP32M256M-15 | AP32M256Z-15 | AP32M256M7-20 | AP32M256M7-25 | AP32M256Z-20 | |
---|---|---|---|---|---|---|---|---|---|
描述 | Standard SRAM, 256KX32, 20ns, CMOS, SIMM-64 | Standard SRAM, 256KX32, 25ns, CMOS, PZIP64, | Standard SRAM, 256KX32, 25ns, CMOS, SIMM-64 | Standard SRAM, 256KX32, 15ns, CMOS, SIMM-72 | Standard SRAM, 256KX32, 15ns, CMOS, SIMM-64 | Standard SRAM, 256KX32, 15ns, CMOS, PZIP64, | Standard SRAM, 256KX32, 20ns, CMOS, SIMM-72 | Standard SRAM, 256KX32, 25ns, CMOS, SIMM-72 | Standard SRAM, 256KX32, 20ns, CMOS, PZIP64, |
是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 |
Reach Compliance Code | compliant | compliant | compliant | compliant | compliant | compliant | compliant | compliant | compliant |
最长访问时间 | 20 ns | 25 ns | 25 ns | 15 ns | 15 ns | 15 ns | 20 ns | 25 ns | 20 ns |
I/O 类型 | COMMON | COMMON | COMMON | COMMON | COMMON | COMMON | COMMON | COMMON | COMMON |
JESD-30 代码 | R-XSMA-N64 | R-PZIP-T64 | R-XSMA-N64 | R-XSMA-N72 | R-XSMA-N64 | R-PZIP-T64 | R-XSMA-N72 | R-XSMA-N72 | R-PZIP-T64 |
JESD-609代码 | e0 | e0 | e0 | e0 | e0 | e0 | e0 | e0 | e0 |
内存密度 | 8388608 bit | 8388608 bit | 8388608 bit | 8388608 bit | 8388608 bit | 8388608 bit | 8388608 bit | 8388608 bit | 8388608 bit |
内存集成电路类型 | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM |
内存宽度 | 32 | 32 | 32 | 32 | 32 | 32 | 32 | 32 | 32 |
端子数量 | 64 | 64 | 64 | 72 | 64 | 64 | 72 | 72 | 64 |
字数 | 262144 words | 262144 words | 262144 words | 262144 words | 262144 words | 262144 words | 262144 words | 262144 words | 262144 words |
字数代码 | 256000 | 256000 | 256000 | 256000 | 256000 | 256000 | 256000 | 256000 | 256000 |
工作模式 | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS |
最高工作温度 | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C |
组织 | 256KX32 | 256KX32 | 256KX32 | 256KX32 | 256KX32 | 256KX32 | 256KX32 | 256KX32 | 256KX32 |
输出特性 | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE |
封装主体材料 | UNSPECIFIED | PLASTIC/EPOXY | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED | PLASTIC/EPOXY | UNSPECIFIED | UNSPECIFIED | PLASTIC/EPOXY |
封装代码 | SIMM | ZIP | SIMM | SIMM | SIMM | ZIP | SIMM | SIMM | ZIP |
封装等效代码 | SSIM64 | ZIP64/68,.1,.1 | SSIM64 | SSIM72 | SSIM64 | ZIP64/68,.1,.1 | SSIM72 | SSIM72 | ZIP64/68,.1,.1 |
封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
封装形式 | MICROELECTRONIC ASSEMBLY | IN-LINE | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY | IN-LINE | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY | IN-LINE |
并行/串行 | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL |
电源 | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
座面最大高度 | 15.11 mm | 15.494 mm | 15.11 mm | 15.113 mm | 15.11 mm | 15.494 mm | 15.113 mm | 15.113 mm | 15.494 mm |
最大待机电流 | 0.04 A | 0.04 A | 0.04 A | 0.04 A | 0.04 A | 0.04 A | 0.04 A | 0.04 A | 0.04 A |
最小待机电流 | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V |
最大压摆率 | 1.12 mA | 0.96 mA | 0.96 mA | 1.28 mA | 1.28 mA | 1.28 mA | 1.12 mA | 0.96 mA | 1.12 mA |
标称供电电压 (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
表面贴装 | NO | NO | NO | NO | NO | NO | NO | NO | NO |
技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
温度等级 | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL |
端子面层 | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
端子形式 | NO LEAD | THROUGH-HOLE | NO LEAD | NO LEAD | NO LEAD | THROUGH-HOLE | NO LEAD | NO LEAD | THROUGH-HOLE |
端子节距 | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm |
端子位置 | SINGLE | ZIG-ZAG | SINGLE | SINGLE | SINGLE | ZIG-ZAG | SINGLE | SINGLE | ZIG-ZAG |
厂商名称 | Integrated Silicon Solution ( ISSI ) | - | Integrated Silicon Solution ( ISSI ) | Integrated Silicon Solution ( ISSI ) | Integrated Silicon Solution ( ISSI ) | Integrated Silicon Solution ( ISSI ) | Integrated Silicon Solution ( ISSI ) | Integrated Silicon Solution ( ISSI ) | Integrated Silicon Solution ( ISSI ) |
包装说明 | SIMM-64 | - | SIMM-64 | SIMM-72 | SIMM-64 | - | SIMM-72 | SIMM-72 | - |
其他特性 | WD-MAX | - | WD-MAX | LG-MAX; WD-MAX | WD-MAX | - | LG-MAX; WD-MAX | LG-MAX; WD-MAX | - |
长度 | 97.79 mm | - | 97.79 mm | 108.077 mm | 97.79 mm | - | 108.077 mm | 108.077 mm | - |
功能数量 | 1 | - | 1 | 1 | 1 | - | 1 | 1 | - |
最大供电电压 (Vsup) | 5.5 V | - | 5.5 V | 5.5 V | 5.5 V | - | 5.5 V | 5.5 V | - |
最小供电电压 (Vsup) | 4.5 V | - | 4.5 V | 4.5 V | 4.5 V | - | 4.5 V | 4.5 V | - |
宽度 | 8.89 mm | - | 8.89 mm | 8.89 mm | 8.89 mm | - | 8.89 mm | 8.89 mm | - |
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