Parallel In Parallel Out, LS Series, 8-Bit, Bidirectional, True Output, TTL, 0.096 X 0.112 INCH, DIE-20
| 参数名称 | 属性值 |
| 厂商名称 | AMD(超微) |
| 零件包装代码 | DIE |
| 包装说明 | DIE, |
| 针数 | 20 |
| Reach Compliance Code | unknown |
| 计数方向 | BIDIRECTIONAL |
| 系列 | LS |
| JESD-30 代码 | R-XUUC-N20 |
| 负载电容（CL） | 50 pF |
| 逻辑集成电路类型 | PARALLEL IN PARALLEL OUT |
| 位数 | 8 |
| 功能数量 | 1 |
| 端子数量 | 20 |
| 最高工作温度 | 70 °C |
| 最低工作温度 | |
| 输出特性 | 3-STATE |
| 输出极性 | TRUE |
| 封装主体材料 | UNSPECIFIED |
| 封装代码 | DIE |
| 封装形状 | RECTANGULAR |
| 封装形式 | UNCASED CHIP |
| 最大电源电流（ICC） | 60 mA |
| 传播延迟（tpd） | 40 ns |
| 认证状态 | Not Qualified |
| 最大供电电压 (Vsup) | 5.25 V |
| 最小供电电压 (Vsup) | 4.75 V |
| 标称供电电压 (Vsup) | 5 V |
| 表面贴装 | YES |
| 技术 | TTL |
| 温度等级 | COMMERCIAL |
| 端子形式 | NO LEAD |
| 端子位置 | UPPER |
| 触发器类型 | POSITIVE EDGE |
| 最小 fmax | 50 MHz |
| AM25LS23XC | AM25LS23PC | AM25LS23XM | AM25LS23DC | |
|---|---|---|---|---|
| 描述 | Parallel In Parallel Out, LS Series, 8-Bit, Bidirectional, True Output, TTL, 0.096 X 0.112 INCH, DIE-20 | Parallel In Parallel Out, LS Series, 8-Bit, Bidirectional, True Output, TTL, PDIP20, PLASTIC, DIP-20 | Parallel In Parallel Out, LS Series, 8-Bit, Bidirectional, True Output, TTL, 0.096 X 0.112 INCH, DIE-20 | Parallel In Parallel Out, LS Series, 8-Bit, Bidirectional, True Output, TTL, CDIP20, HERMETIC SEALED, CERDIP-20 |
| 零件包装代码 | DIE | DIP | DIE | DIP |
| 包装说明 | DIE, | DIP, DIP20,.3 | DIE, | DIP, DIP20,.3 |
| 针数 | 20 | 20 | 20 | 20 |
| Reach Compliance Code | unknown | unknown | unknown | unknown |
| 计数方向 | BIDIRECTIONAL | BIDIRECTIONAL | BIDIRECTIONAL | BIDIRECTIONAL |
| 系列 | LS | LS | LS | LS |
| JESD-30 代码 | R-XUUC-N20 | R-PDIP-T20 | R-XUUC-N20 | R-CDIP-T20 |
| 负载电容（CL） | 50 pF | 50 pF | 50 pF | 50 pF |
| 逻辑集成电路类型 | PARALLEL IN PARALLEL OUT | PARALLEL IN PARALLEL OUT | PARALLEL IN PARALLEL OUT | PARALLEL IN PARALLEL OUT |
| 位数 | 8 | 8 | 8 | 8 |
| 功能数量 | 1 | 1 | 1 | 1 |
| 端子数量 | 20 | 20 | 20 | 20 |
| 最高工作温度 | 70 °C | 70 °C | 125 °C | 70 °C |
| 输出特性 | 3-STATE | 3-STATE | 3-STATE | 3-STATE |
| 输出极性 | TRUE | TRUE | TRUE | TRUE |
| 封装主体材料 | UNSPECIFIED | PLASTIC/EPOXY | UNSPECIFIED | CERAMIC, METAL-SEALED COFIRED |
| 封装代码 | DIE | DIP | DIE | DIP |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | UNCASED CHIP | IN-LINE | UNCASED CHIP | IN-LINE |
| 最大电源电流（ICC） | 60 mA | 60 mA | 60 mA | 60 mA |
| 传播延迟（tpd） | 40 ns | 40 ns | 47 ns | 40 ns |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 最大供电电压 (Vsup) | 5.25 V | 5.25 V | 5.5 V | 5.25 V |
| 最小供电电压 (Vsup) | 4.75 V | 4.75 V | 4.5 V | 4.75 V |
| 标称供电电压 (Vsup) | 5 V | 5 V | 5 V | 5 V |
| 表面贴装 | YES | NO | YES | NO |
| 技术 | TTL | TTL | TTL | TTL |
| 温度等级 | COMMERCIAL | COMMERCIAL | MILITARY | COMMERCIAL |
| 端子形式 | NO LEAD | THROUGH-HOLE | NO LEAD | THROUGH-HOLE |
| 端子位置 | UPPER | DUAL | UPPER | DUAL |
| 触发器类型 | POSITIVE EDGE | POSITIVE EDGE | POSITIVE EDGE | POSITIVE EDGE |
| 最小 fmax | 50 MHz | 50 MHz | 50 MHz | 50 MHz |
| 厂商名称 | AMD(超微) | - | AMD(超微) | AMD(超微) |
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