Logic Circuit, TTL, CQCC20, CERAMIC, LCC-20
参数名称 | 属性值 |
是否无铅 | 含铅 |
是否Rohs认证 | 不符合 |
厂商名称 | Rochester Electronics |
零件包装代码 | QLCC |
包装说明 | QCCN, |
针数 | 20 |
Reach Compliance Code | unknown |
系列 | LS |
JESD-30 代码 | S-CQCC-N20 |
长度 | 8.89 mm |
逻辑集成电路类型 | LOGIC CIRCUIT |
功能数量 | 2 |
端子数量 | 20 |
最高工作温度 | 125 °C |
最低工作温度 | -55 °C |
封装主体材料 | CERAMIC, METAL-SEALED COFIRED |
封装代码 | QCCN |
封装形状 | SQUARE |
封装形式 | CHIP CARRIER |
峰值回流温度(摄氏度) | NOT SPECIFIED |
认证状态 | Not Qualified |
座面最大高度 | 2.03 mm |
最大供电电压 (Vsup) | 5.5 V |
最小供电电压 (Vsup) | 4.5 V |
标称供电电压 (Vsup) | 5 V |
表面贴装 | YES |
技术 | TTL |
温度等级 | MILITARY |
端子形式 | NO LEAD |
端子节距 | 1.27 mm |
端子位置 | QUAD |
处于峰值回流温度下的最长时间 | NOT SPECIFIED |
宽度 | 8.89 mm |
SNJ54LS629FK | 5962-9204601MCA | 5962-9204601M2A | SN74LS629NSR | SN74LS629N3 | SNJ54LS629J | SNJ54LS628J | |
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描述 | Logic Circuit, TTL, CQCC20, CERAMIC, LCC-20 | SPECIALTY LOGIC CIRCUIT, CDIP14, CERAMIC, DIP-14 | SPECIALTY LOGIC CIRCUIT, CQCC20, CERAMIC, LCC-20 | SPECIALTY LOGIC CIRCUIT, PDSO16, SOP-16 | SPECIALTY LOGIC CIRCUIT, PDIP16, 0.300 INCH, PLASTIC, DIP-16 | Logic Circuit, TTL, CDIP16, 0.300 INCH, HERMETIC SEALED, CERAMIC, DIP-16 | SPECIALTY LOGIC CIRCUIT, CDIP14, CERAMIC, DIP-14 |
零件包装代码 | QLCC | DIP | QLCC | SOIC | DIP | DIP | DIP |
包装说明 | QCCN, | DIP, | QCCN, | SOP, | DIP, | DIP, | DIP, |
针数 | 20 | 14 | 20 | 16 | 16 | 16 | 14 |
Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown | unknown |
系列 | LS | LS | LS | LS | LS | LS | LS |
JESD-30 代码 | S-CQCC-N20 | R-GDIP-T14 | S-CQCC-N20 | R-PDSO-G16 | R-PDIP-T16 | R-GDIP-T16 | R-GDIP-T14 |
逻辑集成电路类型 | LOGIC CIRCUIT | LOGIC CIRCUIT | LOGIC CIRCUIT | LOGIC CIRCUIT | LOGIC CIRCUIT | LOGIC CIRCUIT | LOGIC CIRCUIT |
功能数量 | 2 | 1 | 1 | 2 | 2 | 2 | 1 |
端子数量 | 20 | 14 | 20 | 16 | 16 | 16 | 14 |
最高工作温度 | 125 °C | 125 °C | 125 °C | 70 °C | 70 °C | 125 °C | 125 °C |
最低工作温度 | -55 °C | -55 °C | -55 °C | - | - | -55 °C | -55 °C |
封装主体材料 | CERAMIC, METAL-SEALED COFIRED | CERAMIC, GLASS-SEALED | CERAMIC, METAL-SEALED COFIRED | PLASTIC/EPOXY | PLASTIC/EPOXY | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED |
封装代码 | QCCN | DIP | QCCN | SOP | DIP | DIP | DIP |
封装形状 | SQUARE | RECTANGULAR | SQUARE | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
封装形式 | CHIP CARRIER | IN-LINE | CHIP CARRIER | SMALL OUTLINE | IN-LINE | IN-LINE | IN-LINE |
认证状态 | Not Qualified | MILITARY | MILITARY | COMMERCIAL | COMMERCIAL | Not Qualified | COMMERCIAL |
座面最大高度 | 2.03 mm | 5.08 mm | 2.03 mm | 2 mm | 5.08 mm | 5.08 mm | 5.08 mm |
最大供电电压 (Vsup) | 5.5 V | 5.5 V | 5.5 V | 5.25 V | 5.25 V | 5.5 V | 5.5 V |
最小供电电压 (Vsup) | 4.5 V | 4.5 V | 4.5 V | 4.75 V | 4.75 V | 4.5 V | 4.5 V |
标称供电电压 (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
表面贴装 | YES | NO | YES | YES | NO | NO | NO |
技术 | TTL | TTL | TTL | TTL | TTL | TTL | TTL |
温度等级 | MILITARY | MILITARY | MILITARY | COMMERCIAL | COMMERCIAL | MILITARY | MILITARY |
端子形式 | NO LEAD | THROUGH-HOLE | NO LEAD | GULL WING | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE |
端子节距 | 1.27 mm | 2.54 mm | 1.27 mm | 1.27 mm | 2.54 mm | 2.54 mm | 2.54 mm |
端子位置 | QUAD | DUAL | QUAD | DUAL | DUAL | DUAL | DUAL |
宽度 | 8.89 mm | 7.62 mm | 8.89 mm | 5.3 mm | 7.62 mm | 7.62 mm | 7.62 mm |
是否无铅 | 含铅 | 含铅 | 含铅 | 不含铅 | - | 含铅 | 含铅 |
是否Rohs认证 | 不符合 | 不符合 | 不符合 | 符合 | - | 不符合 | 不符合 |
厂商名称 | Rochester Electronics | Rochester Electronics | Rochester Electronics | - | - | Rochester Electronics | Rochester Electronics |
长度 | 8.89 mm | 19.56 mm | 8.89 mm | 10.2 mm | 19.305 mm | - | 19.56 mm |
峰值回流温度(摄氏度) | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | 260 | - | NOT SPECIFIED | NOT SPECIFIED |
处于峰值回流温度下的最长时间 | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | - | NOT SPECIFIED | NOT SPECIFIED |
湿度敏感等级 | - | NOT SPECIFIED | NOT SPECIFIED | 1 | - | - | NOT SPECIFIED |
筛选级别 | - | MIL-STD-883 | MIL-STD-883 | - | - | MIL-PRF-38535 | MIL-PRF-38535 |
端子面层 | - | NOT SPECIFIED | NOT SPECIFIED | NICKEL PALLADIUM GOLD | - | - | NOT SPECIFIED |
Base Number Matches | - | 1 | 1 | 1 | 1 | - | - |
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