IC,FREQUENCY SYNTHESIZER,CMOS,DIP,20PIN,PLASTIC
参数名称 | 属性值 |
是否Rohs认证 | 不符合 |
厂商名称 | NXP(恩智浦) |
包装说明 | DIP, DIP20,.3 |
Reach Compliance Code | unknown |
JESD-30 代码 | R-PDIP-T20 |
JESD-609代码 | e0 |
端子数量 | 20 |
最高工作温度 | 85 °C |
最低工作温度 | -40 °C |
封装主体材料 | PLASTIC/EPOXY |
封装代码 | DIP |
封装等效代码 | DIP20,.3 |
封装形状 | RECTANGULAR |
封装形式 | IN-LINE |
电源 | 3/9 V |
认证状态 | Not Qualified |
最大供电电流 (Isup) | 30 mA |
表面贴装 | NO |
技术 | CMOS |
温度等级 | INDUSTRIAL |
端子面层 | Tin/Lead (Sn/Pb) |
端子形式 | THROUGH-HOLE |
端子节距 | 2.54 mm |
端子位置 | DUAL |
MC145159P | MC145159VF1 | MC145159P1 | MC145159P1S | |
---|---|---|---|---|
描述 | IC,FREQUENCY SYNTHESIZER,CMOS,DIP,20PIN,PLASTIC | IC,FREQUENCY SYNTHESIZER,CMOS,SSOP,20PIN,PLASTIC | IC,FREQUENCY SYNTHESIZER,CMOS,DIP,20PIN,PLASTIC | IC,FREQUENCY SYNTHESIZER,CMOS,DIP,20PIN,PLASTIC |
是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 |
厂商名称 | NXP(恩智浦) | NXP(恩智浦) | NXP(恩智浦) | NXP(恩智浦) |
包装说明 | DIP, DIP20,.3 | SSOP, SSOP20(UNSPEC) | DIP, DIP20,.3 | DIP, DIP20,.3 |
Reach Compliance Code | unknown | unknown | unknown | unknown |
JESD-30 代码 | R-PDIP-T20 | R-PDSO-G20 | R-PDIP-T20 | R-PDIP-T20 |
JESD-609代码 | e0 | e0 | e0 | e0 |
端子数量 | 20 | 20 | 20 | 20 |
最高工作温度 | 85 °C | 85 °C | 85 °C | 85 °C |
最低工作温度 | -40 °C | -40 °C | -40 °C | -40 °C |
封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
封装代码 | DIP | SSOP | DIP | DIP |
封装等效代码 | DIP20,.3 | SSOP20(UNSPEC) | DIP20,.3 | DIP20,.3 |
封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
封装形式 | IN-LINE | SMALL OUTLINE, SHRINK PITCH | IN-LINE | IN-LINE |
电源 | 3/9 V | 3/9 V | 3/9 V | 3/9 V |
认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
最大供电电流 (Isup) | 30 mA | 30 mA | 30 mA | 30 mA |
表面贴装 | NO | YES | NO | NO |
技术 | CMOS | CMOS | CMOS | CMOS |
温度等级 | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL |
端子面层 | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
端子形式 | THROUGH-HOLE | GULL WING | THROUGH-HOLE | THROUGH-HOLE |
端子位置 | DUAL | DUAL | DUAL | DUAL |
端子节距 | 2.54 mm | - | 2.54 mm | 2.54 mm |
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