Standard SRAM, 128KX32, 25ns, CMOS, PQCC68, LCC-68
参数名称 | 属性值 |
是否Rohs认证 | 不符合 |
厂商名称 | Mercury Systems Inc |
包装说明 | LCC-68 |
Reach Compliance Code | unknown |
最长访问时间 | 25 ns |
I/O 类型 | COMMON |
JESD-30 代码 | S-PQCC-J68 |
长度 | 25.273 mm |
内存密度 | 4194304 bit |
内存集成电路类型 | STANDARD SRAM |
内存宽度 | 32 |
功能数量 | 1 |
端子数量 | 68 |
字数 | 131072 words |
字数代码 | 128000 |
工作模式 | ASYNCHRONOUS |
最高工作温度 | 70 °C |
最低工作温度 | |
组织 | 128KX32 |
可输出 | YES |
封装主体材料 | PLASTIC/EPOXY |
封装代码 | QCCJ |
封装等效代码 | LDCC68,1.0SQ |
封装形状 | SQUARE |
封装形式 | CHIP CARRIER |
并行/串行 | PARALLEL |
座面最大高度 | 4.572 mm |
最大待机电流 | 0.02 A |
最小待机电流 | 4.75 V |
最大压摆率 | 0.6 mA |
最大供电电压 (Vsup) | 5.25 V |
最小供电电压 (Vsup) | 4.75 V |
标称供电电压 (Vsup) | 5 V |
表面贴装 | YES |
技术 | CMOS |
温度等级 | COMMERCIAL |
端子形式 | J BEND |
端子节距 | 1.27 mm |
端子位置 | QUAD |
宽度 | 25.273 mm |
WPS128K32-25PJC | WPS128K32-17PJI | WPS128K32-17PJC | WPS128K32-20PJC | EDI8L32128C25AC | WPS128K32-15PJC | WPS128K32-25PJI | WPS128K32-20PJI | WPS128K32-15PJI | WPS128K32-12PJC | |
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描述 | Standard SRAM, 128KX32, 25ns, CMOS, PQCC68, LCC-68 | Standard SRAM, 128KX32, 17ns, CMOS, PQCC68, LCC-68 | Standard SRAM, 128KX32, 17ns, CMOS, PQCC68, LCC-68 | Standard SRAM, 128KX32, 20ns, CMOS, PQCC68, LCC-68 | Standard SRAM, 128KX32, 25ns, CMOS, PQCC68, LCC-68 | Standard SRAM, 128KX32, 15ns, CMOS, PQCC68, LCC-68 | Standard SRAM, 128KX32, 25ns, CMOS, PQCC68, LCC-68 | Standard SRAM, 128KX32, 20ns, CMOS, PQCC68, LCC-68 | Standard SRAM, 128KX32, 15ns, CMOS, PQCC68, LCC-68 | Standard SRAM, 128KX32, 12ns, CMOS, PQCC68, LCC-68 |
包装说明 | LCC-68 | LCC-68 | LCC-68 | QCCJ, LDCC68,1.0SQ | LCC-68 | LCC-68 | LCC-68 | LCC-68 | LCC-68 | LCC-68 |
Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown | unknown | unknown | unknow | unknown |
最长访问时间 | 25 ns | 17 ns | 17 ns | 20 ns | 25 ns | 15 ns | 25 ns | 20 ns | 15 ns | 12 ns |
I/O 类型 | COMMON | COMMON | COMMON | COMMON | COMMON | COMMON | COMMON | COMMON | COMMON | COMMON |
JESD-30 代码 | S-PQCC-J68 | S-PQCC-J68 | S-PQCC-J68 | S-PQCC-J68 | S-PQCC-J68 | S-PQCC-J68 | S-PQCC-J68 | S-PQCC-J68 | S-PQCC-J68 | S-PQCC-J68 |
长度 | 25.273 mm | 25.273 mm | 25.273 mm | 25.273 mm | 25.273 mm | 25.273 mm | 25.273 mm | 25.273 mm | 25.273 mm | 25.273 mm |
内存密度 | 4194304 bit | 4194304 bit | 4194304 bit | 4194304 bit | 4194304 bit | 4194304 bit | 4194304 bit | 4194304 bit | 4194304 bi | 4194304 bit |
内存集成电路类型 | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM |
内存宽度 | 32 | 32 | 32 | 32 | 32 | 32 | 32 | 32 | 32 | 32 |
功能数量 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
端子数量 | 68 | 68 | 68 | 68 | 68 | 68 | 68 | 68 | 68 | 68 |
字数 | 131072 words | 131072 words | 131072 words | 131072 words | 131072 words | 131072 words | 131072 words | 131072 words | 131072 words | 131072 words |
字数代码 | 128000 | 128000 | 128000 | 128000 | 128000 | 128000 | 128000 | 128000 | 128000 | 128000 |
工作模式 | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS |
最高工作温度 | 70 °C | 85 °C | 70 °C | 70 °C | 70 °C | 70 °C | 85 °C | 85 °C | 85 °C | 70 °C |
组织 | 128KX32 | 128KX32 | 128KX32 | 128KX32 | 128KX32 | 128KX32 | 128KX32 | 128KX32 | 128KX32 | 128KX32 |
可输出 | YES | YES | YES | YES | YES | YES | YES | YES | YES | YES |
封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
封装代码 | QCCJ | QCCJ | QCCJ | QCCJ | QCCJ | QCCJ | QCCJ | QCCJ | QCCJ | QCCJ |
封装等效代码 | LDCC68,1.0SQ | LDCC68,1.0SQ | LDCC68,1.0SQ | LDCC68,1.0SQ | LDCC68,1.0SQ | LDCC68,1.0SQ | LDCC68,1.0SQ | LDCC68,1.0SQ | LDCC68,1.0SQ | LDCC68,1.0SQ |
封装形状 | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE |
封装形式 | CHIP CARRIER | CHIP CARRIER | CHIP CARRIER | CHIP CARRIER | CHIP CARRIER | CHIP CARRIER | CHIP CARRIER | CHIP CARRIER | CHIP CARRIER | CHIP CARRIER |
并行/串行 | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL |
座面最大高度 | 4.572 mm | 4.572 mm | 4.572 mm | 4.572 mm | 4.572 mm | 4.572 mm | 4.572 mm | 4.572 mm | 4.572 mm | 4.572 mm |
最大待机电流 | 0.02 A | 0.02 A | 0.02 A | 0.02 A | 0.02 A | 0.02 A | 0.02 A | 0.02 A | 0.02 A | 0.02 A |
最小待机电流 | 4.75 V | 4.75 V | 4.75 V | 4.75 V | 4.75 V | 4.75 V | 4.75 V | 4.75 V | 4.75 V | 4.75 V |
最大压摆率 | 0.6 mA | 0.64 mA | 0.64 mA | 0.6 mA | 0.6 mA | 0.68 mA | 0.6 mA | 0.6 mA | 0.68 mA | 0.72 mA |
最大供电电压 (Vsup) | 5.25 V | 5.25 V | 5.25 V | 5.25 V | 5.25 V | 5.25 V | 5.25 V | 5.25 V | 5.25 V | 5.25 V |
最小供电电压 (Vsup) | 4.75 V | 4.75 V | 4.75 V | 4.75 V | 4.75 V | 4.75 V | 4.75 V | 4.75 V | 4.75 V | 4.75 V |
标称供电电压 (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
表面贴装 | YES | YES | YES | YES | YES | YES | YES | YES | YES | YES |
技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
温度等级 | COMMERCIAL | INDUSTRIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | COMMERCIAL |
端子形式 | J BEND | J BEND | J BEND | J BEND | J BEND | J BEND | J BEND | J BEND | J BEND | J BEND |
端子节距 | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm |
端子位置 | QUAD | QUAD | QUAD | QUAD | QUAD | QUAD | QUAD | QUAD | QUAD | QUAD |
宽度 | 25.273 mm | 25.273 mm | 25.273 mm | 25.273 mm | 25.273 mm | 25.273 mm | 25.273 mm | 25.273 mm | 25.273 mm | 25.273 mm |
是否Rohs认证 | 不符合 | - | - | - | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 |
厂商名称 | Mercury Systems Inc | Mercury Systems Inc | Mercury Systems Inc | - | Mercury Systems Inc | Mercury Systems Inc | Mercury Systems Inc | Mercury Systems Inc | Mercury Systems Inc | - |
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