电子工程世界电子工程世界电子工程世界

关键词

搜索

型号

搜索

IDTQS3384H

产品描述Bus Driver, 1-Func, 10-Bit, True Output, CMOS, CDSO24, HQSOP-24
产品类别逻辑    逻辑   
文件大小82KB,共6页
制造商IDT (Integrated Device Technology)
下载文档 详细参数 选型对比 全文预览

IDTQS3384H概述

Bus Driver, 1-Func, 10-Bit, True Output, CMOS, CDSO24, HQSOP-24

IDTQS3384H规格参数

参数名称属性值
是否无铅含铅
是否Rohs认证不符合
厂商名称IDT (Integrated Device Technology)
零件包装代码SOIC
包装说明SSOP,
针数24
Reach Compliance Codecompliant
JESD-30 代码R-CDSO-G24
JESD-609代码e0
长度8.6868 mm
逻辑集成电路类型BUS DRIVER
位数10
功能数量1
端口数量2
端子数量24
最高工作温度125 °C
最低工作温度-55 °C
输出特性3-STATE
输出极性TRUE
封装主体材料CERAMIC, METAL-SEALED COFIRED
封装代码SSOP
封装形状RECTANGULAR
封装形式SMALL OUTLINE, SHRINK PITCH
峰值回流温度(摄氏度)NOT SPECIFIED
传播延迟(tpd)0.75 ns
认证状态Not Qualified
座面最大高度1.9812 mm
最大供电电压 (Vsup)5.5 V
最小供电电压 (Vsup)4.5 V
标称供电电压 (Vsup)5 V
表面贴装YES
技术CMOS
温度等级MILITARY
端子面层Tin/Lead (Sn/Pb)
端子形式GULL WING
端子节距0.635 mm
端子位置DUAL
处于峰值回流温度下的最长时间NOT SPECIFIED
宽度3.937 mm

文档预览

下载PDF文档
QUICKSWITCH
®
PRODUCTS
HIGH-SPEED CMOS
10-BIT BUS SWITCHES
FEATURES/BENEFITS
Enhanced N channel FET with no inherent diode to V
CC
5Ω bidirectional switches connect inputs to outputs
Zero propagation delay (QS3384), zero ground bounce
Undershoot clamp diodes on all switch and control pins
QS32384 is 25Ω version for low noise
Two enables control five bits each
Available in TSSOP, SOIC, QSOP AND HQSOP
QS3384
QS32384
DESCRIPTION
The QS3384 and QS32384 provide a set of ten high-speed CMOS,
TTL-compatible bus switches. The low ON resistance of QS3384
allows inputs to be connected to outputs without adding propagation
delay and without generating additional ground bounce. Two banks of
5 switches are controlled by independent Bus Enable (BE) signals.
The QS32384 adds an internal series resistor with each switch to
reduce reflection noise in high speed applications. When closed, the
switch acts as the source (series) termination for the driver connected
to it.
APPLICATIONS
• Hot-swapping, hot-docking
(Application Note AN-13)
• Voltage translation
(5V to 3.3V; Application Note AN-11)
• Power conservation
• Capacitance reduction and isolation
• Bus isolation
• Clock gating
FUNCTIONAL BLOCK DIAGRAM
A0
B0
A4
A5
B4
B5
A9
BEA
BEB
B9
JULY 1999
1
©
1999 Integrated Device Technology, Inc
DSC-XXXXXX

IDTQS3384H相似产品对比

IDTQS3384H IDTQS3384PG IDTQS3384PG8 IDTQS32384H
描述 Bus Driver, 1-Func, 10-Bit, True Output, CMOS, CDSO24, HQSOP-24 Bus Driver, 1-Func, 10-Bit, True Output, CMOS, PDSO24, TSSOP-24 Bus Driver, 1-Func, 10-Bit, True Output, CMOS, PDSO24, TSSOP-24 Bus Driver, 1-Func, 10-Bit, True Output, CMOS, CDSO24, HQSOP-24
是否无铅 含铅 含铅 含铅 含铅
是否Rohs认证 不符合 不符合 不符合 不符合
厂商名称 IDT (Integrated Device Technology) IDT (Integrated Device Technology) IDT (Integrated Device Technology) IDT (Integrated Device Technology)
零件包装代码 SOIC TSSOP TSSOP SOIC
包装说明 SSOP, TSSOP, TSSOP, HQSOP-24
针数 24 24 24 24
Reach Compliance Code compliant compliant compliant compliant
JESD-30 代码 R-CDSO-G24 R-PDSO-G24 R-PDSO-G24 R-CDSO-G24
JESD-609代码 e0 e0 e0 e0
长度 8.6868 mm 7.8 mm 7.8 mm 8.6868 mm
逻辑集成电路类型 BUS DRIVER BUS DRIVER BUS DRIVER BUS DRIVER
位数 10 10 10 10
功能数量 1 1 1 1
端口数量 2 2 2 2
端子数量 24 24 24 24
最高工作温度 125 °C 85 °C 85 °C 125 °C
最低工作温度 -55 °C -40 °C -40 °C -55 °C
输出特性 3-STATE 3-STATE 3-STATE 3-STATE WITH SERIES RESISTOR
输出极性 TRUE TRUE TRUE TRUE
封装主体材料 CERAMIC, METAL-SEALED COFIRED PLASTIC/EPOXY PLASTIC/EPOXY CERAMIC, METAL-SEALED COFIRED
封装代码 SSOP TSSOP TSSOP SSOP
封装形状 RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
封装形式 SMALL OUTLINE, SHRINK PITCH SMALL OUTLINE, THIN PROFILE, SHRINK PITCH SMALL OUTLINE, THIN PROFILE, SHRINK PITCH SMALL OUTLINE, SHRINK PITCH
峰值回流温度(摄氏度) NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED
传播延迟(tpd) 0.75 ns 0.25 ns 0.25 ns 1.75 ns
认证状态 Not Qualified Not Qualified Not Qualified Not Qualified
座面最大高度 1.9812 mm 1.2 mm 1.2 mm 1.9812 mm
最大供电电压 (Vsup) 5.5 V 5.25 V 5.25 V 5.5 V
最小供电电压 (Vsup) 4.5 V 4.75 V 4.75 V 4.5 V
标称供电电压 (Vsup) 5 V 5 V 5 V 5 V
表面贴装 YES YES YES YES
技术 CMOS CMOS CMOS CMOS
温度等级 MILITARY INDUSTRIAL INDUSTRIAL MILITARY
端子面层 Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) TIN LEAD
端子形式 GULL WING GULL WING GULL WING GULL WING
端子节距 0.635 mm 0.65 mm 0.65 mm 0.635 mm
端子位置 DUAL DUAL DUAL DUAL
处于峰值回流温度下的最长时间 NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED
宽度 3.937 mm 4.4 mm 4.4 mm 3.937 mm

 
EEWorld订阅号

 
EEWorld服务号

 
汽车开发圈

 
机器人开发圈

About Us 关于我们 客户服务 联系方式 器件索引 网站地图 最新更新 手机版

站点相关: 大学堂 TI培训 Datasheet 电子工程 索引文件: 271  820  955  1742  2867  17  15  47  45  53 

器件索引   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z

北京市海淀区中关村大街18号B座15层1530室 电话:(010)82350740 邮编:100190

电子工程世界版权所有 京B2-20211791 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号 Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved