Bulletin I0205J 07/98
IR230SG..HCB SERIES
PHASE CONTROL THYRISTORS
Square 230 mils
4"
600 and 1200 V
Glassivated MESA
Junction Size:
Wafer Size:
V
RRM
Class:
Passivation Process:
Reference IR Packaged Part:
n. a.
Major Ratings and Characteristics
Parameters
V
TM
V
RRM
I
GT
V
GT
I
H
I
L
Maximum On-state Voltage
Reverse Breakdown Voltage
Max. Required DC Gate Current to Trigger
Max. Required DC Gate Voltage to Trigger
Holding Current Range
Maximum Latching Current
Units
1.3 V
Test Conditions
T
J
= 25°C, I
T
= 25 A
(1)
600 and 1200 V T
J
= 25°C, I
RRM
= 100 µA
60 mA
1.9 V
5 to 150 mA
400 mA
T
J
= 25° C, anode supply = 6 V, resistive load
T
J
= 25° C, anode supply = 6 V, resistive load
Anode supply = 6 V, resistive load
Anode supply = 6 V, resistive load
(1)
Nitrogen flow on die edge.
Mechanical Characteristics
Nominal Back Metal Composition, Thickness
Nominal Front Metal Composition, Thickness
Chip Dimensions
Wafer Diameter
Wafer Thickness
Maximum Width of Sawing Line
Reject Ink Dot Size
Ink Dot Location
Recommended Storage Environment
Cr - Ni - Ag (1 KA - 4 KA - 6 KA)
Cr - Ni - Ag (1 KA - 4 KA - 6 KA)
230 x 230 mils (see drawing)
100 mm, with std. < 100 > flat
370 µm ± 10 µm
130 µm
0.25 mm diameter minimum
See drawing
Storage in original container, in dessicated
nitrogen, with no contamination
Document Number: 93836
www.vishay.com
1
IR230SG..HCB Series
Bulletin I0205J 07/98
Ordering Information Table
Device Code
IR
1
230
2
S
3
G
4
12
5
H
6
CB
7
5
4
Voltage Device: in Mils
3
Passivation Rectifier Device
2
Type of code: Code Solderable
- Chip Dimension S = x G = Glassivated
1
InternationalProcess: 100 = V SCR MESA
Available Class
RRM
06 = 600 V
12 = 1200 V
7
- CB = Probed Uncut Die (wafer Silver
6
Metallization: H = Silver (Anode) -in box)(Cathode)
None = Probed Die in chip carrier
Outline Table
All dimensions are in millimeters
Document Number: 93836
www.vishay.com
2
IR230SG..HCB Series
Bulletin I0205J 07/98
Wafer Layout
TOP VIEW
N° 177 Basic Cells
All dimensions are in millimeters
Document Number: 93836
www.vishay.com
3
Legal Disclaimer Notice
Vishay
Notice
The products described herein were acquired by Vishay Intertechnology, Inc., as part of its acquisition of
International Rectifier’s Power Control Systems (PCS) business, which closed in April 2007. Specifications of the
products displayed herein are pending review by Vishay and are subject to the terms and conditions shown below.
Specifications of the products displayed herein are subject to change without notice. Vishay Intertechnology, Inc., or
anyone on its behalf, assumes no responsibility or liability for any errors or inaccuracies.
Information contained herein is intended to provide a product description only. No license, express or implied, by
estoppel or otherwise, to any intellectual property rights is granted by this document. Except as provided in Vishay's
terms and conditions of sale for such products, Vishay assumes no liability whatsoever, and disclaims any express
or implied warranty, relating to sale and/or use of Vishay products including liability or warranties relating to fitness
for a particular purpose, merchantability, or infringement of any patent, copyright, or other intellectual property right.
The products shown herein are not designed for use in medical, life-saving, or life-sustaining applications.
Customers using or selling these products for use in such applications do so at their own risk and agree to fully
indemnify Vishay for any damages resulting from such improper use or sale.
International Rectifier
®
, IR
®
, the IR logo, HEXFET
®
, HEXSense
®
, HEXDIP
®
, DOL
®
, INTERO
®
, and POWIRTRAIN
®
are registered trademarks of International Rectifier Corporation in the U.S. and other countries. All other product
names noted herein may be trademarks of their respective owners.
Document Number: 99901
Revision: 12-Mar-07
www.vishay.com
1
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