IC OP-AMP, 3000 uV OFFSET-MAX, 1 MHz BAND WIDTH, CDIP14, HERMETIC SEALED, DIP-14, Operational Amplifier
| 参数名称 | 属性值 |
| 是否Rohs认证 | 不符合 |
| 厂商名称 | National Semiconductor（TI ） |
| 零件包装代码 | DIP |
| 包装说明 | DIP, DIP14,.3 |
| 针数 | 14 |
| Reach Compliance Code | unknown |
| ECCN代码 | EAR99 |
| 放大器类型 | OPERATIONAL AMPLIFIER |
| 架构 | VOLTAGE-FEEDBACK |
| 最大平均偏置电流 (IIB) | 0.0005 µA |
| 25C 时的最大偏置电流 (IIB) | 0.000005 µA |
| 标称共模抑制比 | 90 dB |
| 频率补偿 | YES |
| 最大输入失调电压 | 3000 µV |
| JESD-30 代码 | R-CDIP-T14 |
| JESD-609代码 | e0 |
| 长度 | 19.304 mm |
| 低-偏置 | YES |
| 低-失调 | NO |
| 标称负供电电压 (Vsup) | -15 V |
| 功能数量 | 1 |
| 端子数量 | 14 |
| 最高工作温度 | 85 °C |
| 最低工作温度 | -25 °C |
| 封装主体材料 | CERAMIC, METAL-SEALED COFIRED |
| 封装代码 | DIP |
| 封装等效代码 | DIP14,.3 |
| 封装形状 | RECTANGULAR |
| 封装形式 | IN-LINE |
| 峰值回流温度（摄氏度） | NOT SPECIFIED |
| 电源 | +-5/+-20 V |
| 认证状态 | Not Qualified |
| 座面最大高度 | 4.572 mm |
| 最小摆率 | 1 V/us |
| 标称压摆率 | 3 V/us |
| 最大压摆率 | 3.8 mA |
| 供电电压上限 | 22 V |
| 标称供电电压 (Vsup) | 15 V |
| 表面贴装 | NO |
| 技术 | BIPOLAR |
| 温度等级 | OTHER |
| 端子面层 | Tin/Lead (Sn/Pb) |
| 端子形式 | THROUGH-HOLE |
| 端子节距 | 2.54 mm |
| 端子位置 | DUAL |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED |
| 标称均一增益带宽 | 1000 kHz |
| 最小电压增益 | 50000 |
| 宽度 | 7.62 mm |
| LH0052CD | LH0022H | LH0042D | LH0042E | LH0022CD | LH0052H | LH0052D | LH0022D | |
|---|---|---|---|---|---|---|---|---|
| 描述 | IC OP-AMP, 3000 uV OFFSET-MAX, 1 MHz BAND WIDTH, CDIP14, HERMETIC SEALED, DIP-14, Operational Amplifier | IC OP-AMP, 5000 uV OFFSET-MAX, 1 MHz BAND WIDTH, MBCY8, Operational Amplifier | IC OP-AMP, 20000 uV OFFSET-MAX, 1 MHz BAND WIDTH, CDIP14, HERMETIC SEALED, DIP-14, Operational Amplifier | IC OP-AMP, 20000 uV OFFSET-MAX, 1 MHz BAND WIDTH, CQCC20, LCC-20, Operational Amplifier | IC OP-AMP, 7000 uV OFFSET-MAX, 1 MHz BAND WIDTH, CDIP14, HERMETIC SEALED, DIP-14, Operational Amplifier | IC OP-AMP, 2000 uV OFFSET-MAX, 1 MHz BAND WIDTH, MBCY8, Operational Amplifier | IC OP-AMP, 2000 uV OFFSET-MAX, 1 MHz BAND WIDTH, CDIP14, HERMETIC SEALED, DIP-14, Operational Amplifier | IC OP-AMP, 5000 uV OFFSET-MAX, 1 MHz BAND WIDTH, CDIP14, HERMETIC SEALED, DIP-14, Operational Amplifier |
| 是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 |
| 零件包装代码 | DIP | BCY | DIP | QFN | DIP | BCY | DIP | DIP |
| 针数 | 14 | 8 | 14 | 20 | 14 | 8 | 14 | 14 |
| Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown | unknown | unknown |
| ECCN代码 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
| 放大器类型 | OPERATIONAL AMPLIFIER | OPERATIONAL AMPLIFIER | OPERATIONAL AMPLIFIER | OPERATIONAL AMPLIFIER | OPERATIONAL AMPLIFIER | OPERATIONAL AMPLIFIER | OPERATIONAL AMPLIFIER | OPERATIONAL AMPLIFIER |
| 架构 | VOLTAGE-FEEDBACK | VOLTAGE-FEEDBACK | VOLTAGE-FEEDBACK | VOLTAGE-FEEDBACK | VOLTAGE-FEEDBACK | VOLTAGE-FEEDBACK | VOLTAGE-FEEDBACK | VOLTAGE-FEEDBACK |
| 最大平均偏置电流 (IIB) | 0.0005 µA | 0.002 µA | 0.000025 µA | 0.000025 µA | 0.0025 µA | 0.0025 µA | 0.0025 µA | 0.01 µA |
| 25C 时的最大偏置电流 (IIB) | 0.000005 µA | 0.00001 µA | 0.000025 µA | 0.000025 µA | 0.000025 µA | 0.0000025 µA | 0.0000025 µA | 0.00001 µA |
| 标称共模抑制比 | 90 dB | 90 dB | 86 dB | 86 dB | 90 dB | 90 dB | 90 dB | 90 dB |
| 频率补偿 | YES | YES | YES | YES | YES | YES | YES | YES |
| 最大输入失调电压 | 3000 µV | 5000 µV | 20000 µV | 20000 µV | 7000 µV | 2000 µV | 2000 µV | 5000 µV |
| JESD-30 代码 | R-CDIP-T14 | O-MBCY-W8 | R-CDIP-T14 | S-CQCC-N20 | R-CDIP-T14 | O-MBCY-W8 | R-CDIP-T14 | R-CDIP-T14 |
| JESD-609代码 | e0 | e0 | e0 | e0 | e0 | e0 | e0 | e0 |
| 低-偏置 | YES | YES | YES | YES | YES | YES | YES | YES |
| 低-失调 | NO | NO | NO | NO | NO | NO | NO | NO |
| 标称负供电电压 (Vsup) | -15 V | -15 V | -15 V | -15 V | -15 V | -15 V | -15 V | -15 V |
| 功能数量 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| 端子数量 | 14 | 8 | 14 | 20 | 14 | 8 | 14 | 14 |
| 最高工作温度 | 85 °C | 125 °C | 125 °C | 125 °C | 85 °C | 125 °C | 125 °C | 125 °C |
| 最低工作温度 | -25 °C | -55 °C | -55 °C | -55 °C | -25 °C | -55 °C | -55 °C | -55 °C |
| 封装主体材料 | CERAMIC, METAL-SEALED COFIRED | METAL | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | METAL | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED |
| 封装等效代码 | DIP14,.3 | CAN8,.2 | DIP14,.3 | LCC20,.35SQ | DIP14,.3 | CAN8,.2 | DIP14,.3 | DIP14,.3 |
| 封装形状 | RECTANGULAR | ROUND | RECTANGULAR | SQUARE | RECTANGULAR | ROUND | RECTANGULAR | RECTANGULAR |
| 封装形式 | IN-LINE | CYLINDRICAL | IN-LINE | CHIP CARRIER | IN-LINE | CYLINDRICAL | IN-LINE | IN-LINE |
| 峰值回流温度（摄氏度） | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| 电源 | +-5/+-20 V | +-5/+-20 V | +-5/+-20 V | +-5/+-20 V | +-5/+-20 V | +-5/+-20 V | +-5/+-20 V | +-5/+-20 V |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 最小摆率 | 1 V/us | 1.5 V/us | 1.5 V/us | 1.5 V/us | 1 V/us | 1.5 V/us | 1.5 V/us | 1.5 V/us |
| 标称压摆率 | 3 V/us | 3 V/us | 3 V/us | 3 V/us | 3 V/us | 3 V/us | 3 V/us | 3 V/us |
| 最大压摆率 | 3.8 mA | 2.5 mA | 3.5 mA | 3.5 mA | 2.8 mA | 3.5 mA | 3.5 mA | 2.5 mA |
| 供电电压上限 | 22 V | 22 V | 22 V | 22 V | 22 V | 22 V | 22 V | 22 V |
| 标称供电电压 (Vsup) | 15 V | 15 V | 15 V | 15 V | 15 V | 15 V | 15 V | 15 V |
| 表面贴装 | NO | NO | NO | YES | NO | NO | NO | NO |
| 技术 | BIPOLAR | BIPOLAR | BIPOLAR | BIPOLAR | BIPOLAR | BIPOLAR | BIPOLAR | BIPOLAR |
| 温度等级 | OTHER | MILITARY | MILITARY | MILITARY | OTHER | MILITARY | MILITARY | MILITARY |
| 端子面层 | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| 端子形式 | THROUGH-HOLE | WIRE | THROUGH-HOLE | NO LEAD | THROUGH-HOLE | WIRE | THROUGH-HOLE | THROUGH-HOLE |
| 端子位置 | DUAL | BOTTOM | DUAL | QUAD | DUAL | BOTTOM | DUAL | DUAL |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| 标称均一增益带宽 | 1000 kHz | 1000 kHz | 1000 kHz | 1000 kHz | 1000 kHz | 1000 kHz | 1000 kHz | 1000 kHz |
| 最小电压增益 | 50000 | 75000 | 50000 | 50000 | 50000 | 75000 | 50000 | 100000 |
| 厂商名称 | National Semiconductor（TI ） | National Semiconductor（TI ） | - | - | National Semiconductor（TI ） | National Semiconductor（TI ） | National Semiconductor（TI ） | National Semiconductor（TI ） |
| 包装说明 | DIP, DIP14,.3 | - | HERMETIC SEALED, DIP-14 | QCCN, LCC20,.35SQ | DIP, DIP14,.3 | , CAN8,.2 | DIP, DIP14,.3 | DIP, DIP14,.3 |
| 长度 | 19.304 mm | - | 19.304 mm | 8.89 mm | 19.304 mm | - | 19.304 mm | 19.304 mm |
| 封装代码 | DIP | - | DIP | QCCN | DIP | - | DIP | DIP |
| 座面最大高度 | 4.572 mm | - | 4.572 mm | 1.905 mm | 4.572 mm | - | 4.572 mm | 4.572 mm |
| 端子节距 | 2.54 mm | - | 2.54 mm | 1.27 mm | 2.54 mm | - | 2.54 mm | 2.54 mm |
| 宽度 | 7.62 mm | - | 7.62 mm | 8.89 mm | 7.62 mm | - | 7.62 mm | 7.62 mm |
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