OTP ROM, 64KX16, 45ns, CMOS, PDSO40, 10 X 14 MM, PLASTIC, MO-142CA, VSOP1-40
| 参数名称 | 属性值 |
| 是否Rohs认证 | 符合 |
| 厂商名称 | Atmel (Microchip) |
| 零件包装代码 | TSOP1 |
| 包装说明 | TSOP1, |
| 针数 | 40 |
| Reach Compliance Code | compliant |
| ECCN代码 | EAR99 |
| 最长访问时间 | 45 ns |
| JESD-30 代码 | R-PDSO-G40 |
| JESD-609代码 | e3 |
| 长度 | 12.4 mm |
| 内存密度 | 1048576 bit |
| 内存集成电路类型 | OTP ROM |
| 内存宽度 | 16 |
| 湿度敏感等级 | 3 |
| 功能数量 | 1 |
| 端子数量 | 40 |
| 字数 | 65536 words |
| 字数代码 | 64000 |
| 工作模式 | ASYNCHRONOUS |
| 最高工作温度 | 85 °C |
| 最低工作温度 | -40 °C |
| 组织 | 64KX16 |
| 输出特性 | 3-STATE |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | TSOP1 |
| 封装形状 | RECTANGULAR |
| 封装形式 | SMALL OUTLINE, THIN PROFILE |
| 并行/串行 | PARALLEL |
| 峰值回流温度（摄氏度） | 260 |
| 认证状态 | Not Qualified |
| 座面最大高度 | 1.2 mm |
| 最大供电电压 (Vsup) | 5.5 V |
| 最小供电电压 (Vsup) | 4.5 V |
| 标称供电电压 (Vsup) | 5 V |
| 表面贴装 | YES |
| 技术 | CMOS |
| 温度等级 | INDUSTRIAL |
| 端子面层 | MATTE TIN |
| 端子形式 | GULL WING |
| 端子节距 | 0.5 mm |
| 端子位置 | DUAL |
| 处于峰值回流温度下的最长时间 | 40 |
| 宽度 | 10 mm |
| AT27C1024-45VJ | AT27C1024-45PJ | AT27C1024-70JJ | AT27C1024-45JJ | AT27C1024-70VJ | AT27C1024-70PJ | |
|---|---|---|---|---|---|---|
| 描述 | OTP ROM, 64KX16, 45ns, CMOS, PDSO40, 10 X 14 MM, PLASTIC, MO-142CA, VSOP1-40 | OTP ROM, 64KX16, 45ns, CMOS, PDIP40, 0.600 INCH, PLASTIC, MS-011AC, DIP-40 | OTP ROM, 64KX16, 70ns, CMOS, PQCC44, PLASTIC, MS-018AC, LCC-44 | OTP ROM, 64KX16, 45ns, CMOS, PQCC44, PLASTIC, MS-018AC, LCC-44 | OTP ROM, 64KX16, 70ns, CMOS, PDSO40, 10 X 14 MM, PLASTIC, MO-142CA, VSOP1-40 | OTP ROM, 64KX16, 70ns, CMOS, PDIP40, 0.600 INCH, PLASTIC, MS-011AC, DIP-40 |
| 是否Rohs认证 | 符合 | 符合 | 符合 | 符合 | 符合 | 符合 |
| 零件包装代码 | TSOP1 | DIP | LPCC | LPCC | TSOP1 | DIP |
| 包装说明 | TSOP1, | DIP, | QCCJ, | QCCJ, | TSOP1, | DIP, |
| 针数 | 40 | 40 | 44 | 44 | 40 | 40 |
| Reach Compliance Code | compliant | compliant | compliant | compliant | compliant | compliant |
| ECCN代码 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
| 最长访问时间 | 45 ns | 45 ns | 70 ns | 45 ns | 70 ns | 70 ns |
| JESD-30 代码 | R-PDSO-G40 | R-PDIP-T40 | S-PQCC-J44 | S-PQCC-J44 | R-PDSO-G40 | R-PDIP-T40 |
| JESD-609代码 | e3 | e3 | e3 | e3 | e3 | e3 |
| 长度 | 12.4 mm | 52.324 mm | 16.586 mm | 16.586 mm | 12.4 mm | 52.324 mm |
| 内存密度 | 1048576 bit | 1048576 bit | 1048576 bit | 1048576 bit | 1048576 bit | 1048576 bit |
| 内存集成电路类型 | OTP ROM | OTP ROM | OTP ROM | OTP ROM | OTP ROM | OTP ROM |
| 内存宽度 | 16 | 16 | 16 | 16 | 16 | 16 |
| 湿度敏感等级 | 3 | 1 | 2 | 2 | 3 | 1 |
| 功能数量 | 1 | 1 | 1 | 1 | 1 | 1 |
| 端子数量 | 40 | 40 | 44 | 44 | 40 | 40 |
| 字数 | 65536 words | 65536 words | 65536 words | 65536 words | 65536 words | 65536 words |
| 字数代码 | 64000 | 64000 | 64000 | 64000 | 64000 | 64000 |
| 工作模式 | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS |
| 最高工作温度 | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C |
| 最低工作温度 | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C |
| 组织 | 64KX16 | 64KX16 | 64KX16 | 64KX16 | 64KX16 | 64KX16 |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | TSOP1 | DIP | QCCJ | QCCJ | TSOP1 | DIP |
| 封装形状 | RECTANGULAR | RECTANGULAR | SQUARE | SQUARE | RECTANGULAR | RECTANGULAR |
| 封装形式 | SMALL OUTLINE, THIN PROFILE | IN-LINE | CHIP CARRIER | CHIP CARRIER | SMALL OUTLINE, THIN PROFILE | IN-LINE |
| 并行/串行 | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL |
| 峰值回流温度（摄氏度） | 260 | 260 | 245 | 245 | 260 | 260 |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 座面最大高度 | 1.2 mm | 4.826 mm | 4.572 mm | 4.572 mm | 1.2 mm | 4.826 mm |
| 最大供电电压 (Vsup) | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
| 最小供电电压 (Vsup) | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V |
| 标称供电电压 (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| 表面贴装 | YES | NO | YES | YES | YES | NO |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL |
| 端子面层 | MATTE TIN | MATTE TIN | MATTE TIN | MATTE TIN | MATTE TIN | MATTE TIN |
| 端子形式 | GULL WING | THROUGH-HOLE | J BEND | J BEND | GULL WING | THROUGH-HOLE |
| 端子节距 | 0.5 mm | 2.54 mm | 1.27 mm | 1.27 mm | 0.5 mm | 2.54 mm |
| 端子位置 | DUAL | DUAL | QUAD | QUAD | DUAL | DUAL |
| 处于峰值回流温度下的最长时间 | 40 | 30 | 40 | 40 | 40 | 30 |
| 宽度 | 10 mm | 15.24 mm | 16.586 mm | 16.586 mm | 10 mm | 15.24 mm |
| 厂商名称 | Atmel (Microchip) | Atmel (Microchip) | - | Atmel (Microchip) | Atmel (Microchip) | Atmel (Microchip) |
| 输出特性 | 3-STATE | - | 3-STATE | 3-STATE | 3-STATE | - |
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