DC-DC Regulated Power Supply Module, 1 Output, 4.2W, Hybrid, SMD-13
| 参数名称 | 属性值 |
| 是否无铅 | 含铅 |
| 是否Rohs认证 | 不符合 |
| 厂商名称 | SHINDENGEN |
| 零件包装代码 | MODULE |
| 包装说明 | SOP, GWDIP14,1,200 |
| 针数 | 13 |
| Reach Compliance Code | unknown |
| ECCN代码 | EAR99 |
| 模拟集成电路 - 其他类型 | DC-DC REGULATED POWER SUPPLY MODULE |
| 最大输入电压 | 75 V |
| 最小输入电压 | 36 V |
| JESD-30 代码 | R-XDMA-G13 |
| JESD-609代码 | e0 |
| 湿度敏感等级 | 2 |
| 功能数量 | 1 |
| 输出次数 | 1 |
| 端子数量 | 13 |
| 最高工作温度 | 85 °C |
| 最低工作温度 | -40 °C |
| 最大输出电流 | 3.5 A |
| 标称输出电压 | 1.2 V |
| 封装主体材料 | UNSPECIFIED |
| 封装代码 | SOP |
| 封装等效代码 | GWDIP14,1,200 |
| 封装形状 | RECTANGULAR |
| 封装形式 | MICROELECTRONIC ASSEMBLY |
| 峰值回流温度（摄氏度） | 240 |
| 认证状态 | Not Qualified |
| 表面贴装 | YES |
| 技术 | HYBRID |
| 温度等级 | INDUSTRIAL |
| 端子面层 | Tin/Lead (Sn/Pb) |
| 端子形式 | GULL WING |
| 端子节距 | 5.08 mm |
| 端子位置 | DUAL |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED |
| 最大总功率输出 | 4.2 W |
| 微调/可调输出 | NO |
| EPE1R2035 | EPE3R3030 | EPE1R8030 | EPE5R2020 | EPE5R0020 | EPE1R3035 | EPE2R1030 | EPE1R5035 | EPE3R6025 | |
|---|---|---|---|---|---|---|---|---|---|
| 描述 | DC-DC Regulated Power Supply Module, 1 Output, 4.2W, Hybrid, SMD-13 | DC-DC Regulated Power Supply Module, 1 Output, 9.9W, Hybrid, SMD-13 | DC-DC Regulated Power Supply Module, 1 Output, 5.4W, Hybrid, SMD-13 | DC-DC Regulated Power Supply Module, 1 Output, 10.4W, Hybrid, SMD-13 | DC-DC Regulated Power Supply Module, 1 Output, 10W, Hybrid, SMD-13 | DC-DC Regulated Power Supply Module, 1 Output, 4.6W, Hybrid, SMD-13 | DC-DC Regulated Power Supply Module, 1 Output, 6.3W, Hybrid, SMD-13 | DC-DC Regulated Power Supply Module, 1 Output, 5.3W, Hybrid, SMD-13 | DC-DC Regulated Power Supply Module, 1 Output, 9W, Hybrid, SMD-13 |
| 是否无铅 | 含铅 | 含铅 | 含铅 | 含铅 | 含铅 | 含铅 | 含铅 | 含铅 | 含铅 |
| 是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 |
| 零件包装代码 | MODULE | MODULE | MODULE | MODULE | MODULE | MODULE | MODULE | MODULE | MODULE |
| 包装说明 | SOP, GWDIP14,1,200 | SOP, GWDIP14,1,200 | SOP, GWDIP14,1,200 | SOP, GWDIP14,1,200 | SOP, GWDIP14,1,200 | SOP, GWDIP14,1,200 | SOP, GWDIP14,1,200 | SOP, GWDIP14,1,200 | SOP, GWDIP14,1,200 |
| 针数 | 13 | 13 | 13 | 13 | 13 | 13 | 13 | 13 | 13 |
| Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown | unknown | unknown | unknown |
| ECCN代码 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
| 模拟集成电路 - 其他类型 | DC-DC REGULATED POWER SUPPLY MODULE | DC-DC REGULATED POWER SUPPLY MODULE | DC-DC REGULATED POWER SUPPLY MODULE | DC-DC REGULATED POWER SUPPLY MODULE | DC-DC REGULATED POWER SUPPLY MODULE | DC-DC REGULATED POWER SUPPLY MODULE | DC-DC REGULATED POWER SUPPLY MODULE | DC-DC REGULATED POWER SUPPLY MODULE | DC-DC REGULATED POWER SUPPLY MODULE |
| 最大输入电压 | 75 V | 75 V | 75 V | 75 V | 75 V | 75 V | 75 V | 75 V | 75 V |
| 最小输入电压 | 36 V | 36 V | 36 V | 36 V | 36 V | 36 V | 36 V | 36 V | 36 V |
| JESD-30 代码 | R-XDMA-G13 | R-XDMA-G13 | R-XDMA-G13 | R-XDMA-G13 | R-XDMA-G13 | R-XDMA-G13 | R-XDMA-G13 | R-XDMA-G13 | R-XDMA-G13 |
| JESD-609代码 | e0 | e0 | e0 | e0 | e0 | e0 | e0 | e0 | e0 |
| 湿度敏感等级 | 2 | 2 | 2 | 2 | 2 | 2 | 2 | 2 | 2 |
| 功能数量 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| 输出次数 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| 端子数量 | 13 | 13 | 13 | 13 | 13 | 13 | 13 | 13 | 13 |
| 最高工作温度 | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C |
| 最低工作温度 | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C |
| 最大输出电流 | 3.5 A | 3 A | 3 A | 2 A | 2 A | 3.5 A | 3 A | 3.5 A | 2.5 A |
| 标称输出电压 | 1.2 V | 3.3 V | 1.8 V | 5.2 V | 5 V | 1.3 V | 2.1 V | 1.5 V | 3.6 V |
| 封装主体材料 | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED |
| 封装代码 | SOP | SOP | SOP | SOP | SOP | SOP | SOP | SOP | SOP |
| 封装等效代码 | GWDIP14,1,200 | GWDIP14,1,200 | GWDIP14,1,200 | GWDIP14,1,200 | GWDIP14,1,200 | GWDIP14,1,200 | GWDIP14,1,200 | GWDIP14,1,200 | GWDIP14,1,200 |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY |
| 峰值回流温度（摄氏度） | 240 | 240 | 240 | 240 | 240 | 240 | 240 | 240 | 240 |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 表面贴装 | YES | YES | YES | YES | YES | YES | YES | YES | YES |
| 技术 | HYBRID | HYBRID | HYBRID | HYBRID | HYBRID | HYBRID | HYBRID | HYBRID | HYBRID |
| 温度等级 | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL |
| 端子面层 | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| 端子形式 | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING |
| 端子节距 | 5.08 mm | 5.08 mm | 5.08 mm | 5.08 mm | 5.08 mm | 5.08 mm | 5.08 mm | 5.08 mm | 5.08 mm |
| 端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| 最大总功率输出 | 4.2 W | 9.9 W | 5.4 W | 10.4 W | 10 W | 4.6 W | 6.3 W | 5.3 W | 9 W |
| 微调/可调输出 | NO | NO | NO | NO | NO | NO | NO | NO | NO |
| 厂商名称 | SHINDENGEN | - | SHINDENGEN | SHINDENGEN | SHINDENGEN | SHINDENGEN | SHINDENGEN | SHINDENGEN | SHINDENGEN |
电子工程世界版权所有
京B2-20211791
京ICP备10001474号-1
电信业务审批[2006]字第258号函
京公网安备 11010802033920号
Copyright © 2005-2024 EEWORLD.com.cn, Inc. All rights reserved
电子工程世界
