Datasheet> 器件分类 > 无线/射频/通信> 电信电路> L-TTSI002321BL-2-DB

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L-TTSI002321BL-2-DB: 产品描述Telecom IC, CMOS, PBGA240,; 产品类别无线/射频/通信电信电路; 文件大小1012KB，共61页; 制造商Broadcom(博通); 标准

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L-TTSI002321BL-2-DB概述

Telecom IC, CMOS, PBGA240,

L-TTSI002321BL-2-DB规格参数

参数名称	属性值
是否Rohs认证	符合
厂商名称	Broadcom(博通)
包装说明	BGA, BGA240,18X18,40
Reach Compliance Code	compliant
JESD-30 代码	S-PBGA-B240
端子数量	240
最高工作温度	85 °C
最低工作温度	-40 °C
封装主体材料	PLASTIC/EPOXY
封装代码	BGA
封装等效代码	BGA240,18X18,40
封装形状	SQUARE
封装形式	GRID ARRAY
电源	1.5,3.3 V
认证状态	Not Qualified
表面贴装	YES
技术	CMOS
温度等级	INDUSTRIAL
端子形式	BALL
端子节距	1 mm
端子位置	BOTTOM

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Data Sheet, Revision 3

September 21, 2005

TSI-2

2k x 2k Time-Slot Interchanger

1 Introduction

The last issue of this data sheet was August 31, 2005. A change history is included in Section

11 Change History on page

61.

Red change bars have been installed on all text, figures, and tables that were added or changed. All changes to the text

are highlighted in red. Changes within figures, and the figure title itself, are highlighted in red, if feasible. Formatting or

grammatical changes have not been highlighted. Deleted sections, paragraphs, figures, or tables will be specifically

mentioned.

This document consists of two major sections:

The

TSI-2

device hardware description. This section contains ball information, operating conditions, dc electrical charac-

teristics, timing diagrams, ac characteristics, and packaging information.

The

TSI-2

device register description. This section contains register information.

1.1 Related Documents

The documentation package for this device consists of the following documents:

The TSI-2 2k x 2k Time-Slot Interchanger Product Brief, the TSI Family Selection Guide, the TSI-2 2k x 2k Time-Slot

Interchanger Data Sheet (this document), and the TSI-2 Time-Slot Interchanger System Design Guide.

These documents are available on the public website shown below.

If the reader displays this document using

Acrobat Reader

, clicking on any blue text will bring the reader to that reference

point.

To access related documents, including the documents mentioned above, please go to the following public website, or con-

tact your Agere representative (see the last page of this document).

http://www.agere.com/telecom/time_slot_interchangers.html

1.2 Block Diagram and High-Level Interface Definition

TEST ACCESS

PORT

TEST PATTERN

MONITOR

TEST PATTERN

GENERATOR

2k x 2k Switch Fabric

RECEIVE

CHI

DATA

STORE

TRANSMIT

CHI

WRITE ADDRESS

COUNTER

CLOCK

GENERATOR

CONNECTION

STORE

READ ADDRESS

COUNTER

MICROPROCESSOR

INTERFACE

Figure 1-1. Block Diagram and High-Level Interface Definition

TSI-2

2k x 2k Time-Slot Interchanger

Data Sheet, Revision 3

September 21, 2005

Table of Contents

Contents

Page

1 Introduction .........................................................................................................................................................................1

1.1 Related Documents .....................................................................................................................................................1

1.2 Block Diagram and High-Level Interface Definition .....................................................................................................1

2 Ball Information ...................................................................................................................................................................7

2.1 Top View Ball Diagram ................................................................................................................................................7

2.2 Package Ball Assignments ..........................................................................................................................................8

2.3 Package Ball Matrix ...................................................................................................................................................10

2.3.1 Top View ..........................................................................................................................................................10

2.3.2 Bottom View .....................................................................................................................................................11

2.4 Ball Types ..................................................................................................................................................................12

2.5 Ball Definitions ...........................................................................................................................................................12

3 Operating Conditions and Reliability ................................................................................................................................15

3.1 Absolute Maximum Ratings .......................................................................................................................................15

3.2 Recommended Operating Conditions .......................................................................................................................15

3.3 Handling Precautions ................................................................................................................................................15

3.4 Thermal Parameters (Definitions and Values) ...........................................................................................................16

3.5 Power Consumption ..................................................................................................................................................17

4 dc Electrical Characteristics .............................................................................................................................................18

5 Timing Diagrams and ac Characteristics ..........................................................................................................................19

6 Register Description .........................................................................................................................................................31

6.1 Device Addressing Notes ..........................................................................................................................................31

6.2 Acronyms Used .........................................................................................................................................................31

6.3 Address Map .............................................................................................................................................................31

6.4 Register Summary .....................................................................................................................................................32

6.5 Global Control Registers ...........................................................................................................................................34

6.6 Connection Store Generator Registers .....................................................................................................................39

6.7 Test Pattern Generator and Monitor Registers ..........................................................................................................44

6.8 Concentration Highway Configuration Registers .......................................................................................................48

7 Switch Fabric Control .......................................................................................................................................................54

8 Connection Store ..............................................................................................................................................................58

9 Outline Diagrams ..............................................................................................................................................................60

10 Ordering Information .......................................................................................................................................................61

11 Change History ...............................................................................................................................................................61

11.1 Navigating Through an Adobe Acrobat Document ..................................................................................................61

Agere Systems Inc.

Data Sheet, Revision 3

September 21, 2005

TSI-2

2k x 2k Time-Slot Interchanger

Table of Contents

(continued)

Contents

Page

Table 2-1. Package Ball Assignments in Signal Name Order.................................................................................................8

Table 2-2. Package Ball Assignments (Top View) ................................................................................................................10

Table 2-3. Package Ball Assignments (Bottom View)........................................................................................................... 11

Table 2-4. Ball Types ............................................................................................................................................................12

Table 2-5. Timing Port ..........................................................................................................................................................12

Table 2-6. Transmit and Receive Concentration Highways ..................................................................................................12

Table 2-7. Control Port..........................................................................................................................................................13

Table 2-8. Initialization and Test Access...............................................................................................................................13

Table 2-9. Power Balls..........................................................................................................................................................14

Table 3-1. Absolute Maximum Ratings .................................................................................................................................15

Table 3-2. Operating Conditions ...........................................................................................................................................15

Table 3-3. ESD Tolerance.....................................................................................................................................................15

Table 3-4. Thermal Parameter Values ..................................................................................................................................16

Table 3-5. Power Consumption ............................................................................................................................................17

Table 4-1. CMOS Inputs .......................................................................................................................................................18

Table 4-2. CMOS Outputs ....................................................................................................................................................18

Table 4-3. CMOS Bidirectionals (DATA[15:0]) ......................................................................................................................18

Table 5-1. CHICLK Timing Specifications .............................................................................................................................19

Table 5-2. MPUCLK Timing Specifications ...........................................................................................................................19

Table 5-3. CMOS Output ac Timing Specification * ..............................................................................................................20

Table 5-4. CHI Interface Timing ............................................................................................................................................21

Table 5-5. CHI 3-State Output Control..................................................................................................................................27

Table 5-6. Microprocessor Port Timing—Read Cycle...........................................................................................................28

Table 5-7. Microprocessor Port Timing—Write Cycle ...........................................................................................................29

Table 6-1. Address Map........................................................................................................................................................31

Table 6-2. Global Registers ..................................................................................................................................................32

Table 6-3. Connection Store Generator Registers................................................................................................................32

Table 6-4. Test Pattern Generator and Monitor Registers ....................................................................................................33

Table 6-5. Concentration Highway Configuration Registers .................................................................................................33

Table 6-6. Switch Fabric Control...........................................................................................................................................33

Table 6-7. Connection Store .................................................................................................................................................34

Table 6-8. Reserved Registers .............................................................................................................................................34

Table 6-9. Version_Control (Read Only)...............................................................................................................................34

Table 6-10. Chip_Identity (Read Only) .................................................................................................................................34

Table 6-11. Summary_Interrupt_Status (Read Only) ............................................................................................................35

Table 6-12. Summary_Interrupt_Mask (Read/Write) ............................................................................................................35

Table 6-13. CPU_Access_Error (CORWN) ..........................................................................................................................36

Table 6-14. CPU_Access_Error_Mask (Read/Write)............................................................................................................36

Table 6-15. Global_Control (Read/Write) .............................................................................................................................37

Table 6-16. PLL_Control (Read/Write) .................................................................................................................................38

Table 6-17. Power_Control (Read/Write)..............................................................................................................................38

Table 6-18. Invalid_Address_Trap (Read Only)....................................................................................................................38

Table 6-19. Scratch_Register (Read/Write)..........................................................................................................................38

Table 6-20. Reserved_0 (Read/Write) ..................................................................................................................................39

Table 6-21. CSG_Control (Read/Write) ................................................................................................................................39

Table 6-22. CSG_Status (Read Only)...................................................................................................................................40

Table 6-23. CSG_Starting_Address (Read/Write) ................................................................................................................40

Table 6-24. CSG_Ending_Address (Read/Write) .................................................................................................................40

Table 6-25. CSG_Write_Enable_Low (Read/Write)..............................................................................................................40

Table 6-26. CSG_Write_Enable_High (Read/Write).............................................................................................................40

Table 6-27. CSG_Seed_Low (Read/Write)...........................................................................................................................41

Table 6-28. CSG_Seed_High (Read/Write)..........................................................................................................................41

Agere Systems Inc.

TSI-2

2k x 2k Time-Slot Interchanger

Data Sheet, Revision 3

September 21, 2005

Table of Contents

(continued)

Tables

Page

Table 6-29. CSG_OR_Mask_Low (Read/Write) ...................................................................................................................41

Table 6-30. CSG_OR_Mask_High (Read/Write) ..................................................................................................................41

Table 6-31. CSG_AND_Mask_Low (Read/Write) .................................................................................................................42

Table 6-32. CSG_AND_Mask_High (Read/Write) ................................................................................................................42

Table 6-33. CS_Stream_Control (Read/Write) .....................................................................................................................42

Table 6-34. CSG_Configuration (Read/Write) ......................................................................................................................43

Table 6-35. TPG_Configuration (Read/Write).......................................................................................................................44

Table 6-36. TPG_User_Pattern (Read/Write) .......................................................................................................................44

Table 6-37. TPM_Configuration (Read/Write) ......................................................................................................................45

Table 6-38. TPM_User_Pattern (Read/Write).......................................................................................................................45

Table 6-39. TPM_Error_Count (Sat/Roll*) ............................................................................................................................46

Table 6-40. TPG_Inject_Error_Count (Write Only) ...............................................................................................................46

Table 6-41. TPG_Data_Invert_Mask (Read/Write) ...............................................................................................................46

Table 6-42. TPM_Status (Read Only)...................................................................................................................................47

Table 6-43. TPM_Status_Mask (Read/Write) .......................................................................................................................47

Table 6-44. Receive_CHI_Configuration (Read/Write) .........................................................................................................48

Table 6-45. Receive_CHI_Status (CORWN) Receive_CHI_Status (CORWN).....................................................................48

Table 6-46. Receive_CHI_Status_Mask (Read/Write)..........................................................................................................49

Table 6-47. Receive_CHI_Global_Configuration (Read/Write) ............................................................................................49

Table 6-48. Transmit_CHI_Configuration (Read/Write) ........................................................................................................50

Table 6-49. Transmit_CHI_Status (CORWN) .......................................................................................................................51

Table 6-50. Transmit_CHI_Status_Mask (Read/Write).........................................................................................................51

Table 6-51. Transmit_CHI_Global_Configuration (Read/Write)............................................................................................52

Table 6-52. Receive_CHI_Time_Slot_Offset (Read/Write)...................................................................................................53

Table 6-53. Transmit_CHI_Time_Slot_Offset (Read/Write)..................................................................................................53

Table 7-1. SF_Status (CORWN) ...........................................................................................................................................54

Table 7-2. SF_Status_Mask (Read/Write) ............................................................................................................................54

Table 7-3. Data_Store_Time_Slot_Capture_Select (Read/Write).........................................................................................55

Table 7-4. Data_Store_Captured_Data (Read Only) ............................................................................................................55

Table 7-5. Connection_Store_Parity_Error_Address_Trap (CORWN) .................................................................................56

Table 7-6. Receive_Link_Offset (Read Only) .......................................................................................................................56

Table 7-7. Transmit_Link_Offset (Read/Write) .....................................................................................................................56

Table 7-8. Wide_Mode_Control (Read/Write).......................................................................................................................57

Table 8-1. Low_Control_Word (Read/Write).........................................................................................................................58

Table 8-2. High_Control_Word (Read/Write) ........................................................................................................................59

Table 10-1. Ordering Information..........................................................................................................................................61

Agere Systems Inc.

Data Sheet, Revision 3

September 21, 2005

TSI-2

2k x 2k Time-Slot Interchanger

Table of Contents

(continued)

Figures

Page

Figure 1-1. Block Diagram and High-Level Interface Definition..............................................................................................1

Figure 2-1. Package Diagram (Top View) ..............................................................................................................................7

Figure 5-1. CHICLK Timing Specifications ...........................................................................................................................19

Figure 5-2. MPUCLK Timing Specifications .........................................................................................................................19

Figure 5-3. ac Timing Specification ......................................................................................................................................20

Figure 5-4. CHI Interface Timing ..........................................................................................................................................21

Figure 5-5. Typical Receive CHI Timing with 16.384 Mbits/s Data and 16.384 MHz CHICLK.............................................22

Figure 5-6. Transmit CHI Timing with 16.384 Mbits/s Data and 16.384 MHz CHICLK ........................................................22

Figure 5-7. Typical Receive CHI Timing with 8.192 Mbits/s Data and 16.384 MHz CHICLK...............................................23

Figure 5-8. Transmit CHI Timing with 8.192 Mbits/s Data and 16.384 MHz CHICLK ..........................................................23

Figure 5-9. Typical Receive CHI Timing with 4.096 Mbits/s Data and 16.384 MHz CHICLK...............................................24

Figure 5-10. Transmit CHI Timing with 4.096 Mbits/s Data and 16.384 MHz CHICLK ........................................................24

Figure 5-11. Typical Receive CHI Timing with 2.048 Mbits/s Data and 16.384 MHz CHICLK.............................................25

Figure 5-12. Transmit CHI Timing with 2.048 Mbits/s Data and 16.384 MHz CHICLK ........................................................25

Figure 5-13. Typical Receive CHI Timing with 8.192 Mbits/s Data and 8.192 MHz CHICLK...............................................26

Figure 5-14. Transmit CHI Timing with 8.192 Mbits/s Data and 8.192 MHz CHICLK ..........................................................26

Figure 5-15. CHI 3-State Output Control ..............................................................................................................................27

Figure 5-16. Microprocessor Port Timing—Read Cycle .......................................................................................................28

Figure 5-17. Microprocessor Port Timing—Write Cycle .......................................................................................................29

Figure 6-1. Transmit CHI Configuration (R/W) .....................................................................................................................50

Agere Systems Inc.

L-TTSI002321BL-2-DB相似产品对比

	L-TTSI002321BL-2-DB
描述	Telecom IC, CMOS, PBGA240,
是否Rohs认证	符合
厂商名称	Broadcom(博通)
包装说明	BGA, BGA240,18X18,40
Reach Compliance Code	compliant
JESD-30 代码	S-PBGA-B240
端子数量	240
最高工作温度	85 °C
最低工作温度	-40 °C
封装主体材料	PLASTIC/EPOXY
封装代码	BGA
封装等效代码	BGA240,18X18,40
封装形状	SQUARE
封装形式	GRID ARRAY
电源	1.5,3.3 V
认证状态	Not Qualified
表面贴装	YES
技术	CMOS
温度等级	INDUSTRIAL
端子形式	BALL
端子节距	1 mm
端子位置	BOTTOM

L-TTSI002321BL-2-DB

L-TTSI002321BL-2-DB概述

L-TTSI002321BL-2-DB规格参数

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