EEPROM, 128X8, Serial, CMOS, PDSO8, MSOP-8
参数名称 | 属性值 |
是否Rohs认证 | 不符合 |
厂商名称 | Integrated Silicon Solution ( ISSI ) |
零件包装代码 | MSOP |
包装说明 | MSOP-8 |
针数 | 8 |
Reach Compliance Code | unknown |
ECCN代码 | EAR99 |
最大时钟频率 (fCLK) | 0.4 MHz |
JESD-30 代码 | S-PDSO-G8 |
JESD-609代码 | e0 |
长度 | 3 mm |
内存密度 | 1024 bit |
内存集成电路类型 | EEPROM |
内存宽度 | 8 |
功能数量 | 1 |
端子数量 | 8 |
字数 | 128 words |
字数代码 | 128 |
工作模式 | SYNCHRONOUS |
最高工作温度 | 125 °C |
最低工作温度 | -40 °C |
组织 | 128X8 |
封装主体材料 | PLASTIC/EPOXY |
封装代码 | TSSOP |
封装形状 | SQUARE |
封装形式 | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
并行/串行 | SERIAL |
峰值回流温度(摄氏度) | NOT SPECIFIED |
认证状态 | Not Qualified |
座面最大高度 | 1.1 mm |
串行总线类型 | I2C |
最大供电电压 (Vsup) | 5.5 V |
最小供电电压 (Vsup) | 4.5 V |
标称供电电压 (Vsup) | 5 V |
表面贴装 | YES |
技术 | CMOS |
温度等级 | AUTOMOTIVE |
端子面层 | Tin/Lead (Sn/Pb) |
端子形式 | GULL WING |
端子节距 | 0.65 mm |
端子位置 | DUAL |
处于峰值回流温度下的最长时间 | NOT SPECIFIED |
宽度 | 3 mm |
最长写入周期时间 (tWC) | 10 ms |
IS24C01-5SA | IS24C01-3SA | IS24C01-5PA | IS24C01-5GA | IS24C01-3GA | IS24C01-3PA | IS24C01-5ZA | |
---|---|---|---|---|---|---|---|
描述 | EEPROM, 128X8, Serial, CMOS, PDSO8, MSOP-8 | EEPROM, 128X8, Serial, CMOS, PDSO8, MSOP-8 | EEPROM, 128X8, Serial, CMOS, PDIP8, 0.300 INCH, PLASTIC, DIP-8 | EEPROM, 128X8, Serial, CMOS, PDSO8, SOIC-8 | EEPROM, 128X8, Serial, CMOS, PDSO8, SOIC-8 | EEPROM, 128X8, Serial, CMOS, PDIP8, 0.300 INCH, PLASTIC, DIP-8 | EEPROM, 128X8, Serial, CMOS, PDSO8, TSSOP-8 |
是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 |
零件包装代码 | MSOP | MSOP | DIP | SOIC | SOIC | DIP | SOIC |
包装说明 | MSOP-8 | TSSOP, TSSOP8,.19 | 0.300 INCH, PLASTIC, DIP-8 | SOIC-8 | SOIC-8 | 0.300 INCH, PLASTIC, DIP-8 | TSSOP-8 |
针数 | 8 | 8 | 8 | 8 | 8 | 8 | 8 |
Reach Compliance Code | unknown | not_compliant | unknown | unknown | unknown | unknown | unknown |
ECCN代码 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
最大时钟频率 (fCLK) | 0.4 MHz | 0.1 MHz | 0.4 MHz | 0.4 MHz | 0.1 MHz | 0.1 MHz | 0.4 MHz |
JESD-30 代码 | S-PDSO-G8 | S-PDSO-G8 | R-PDIP-T8 | R-PDSO-G8 | R-PDSO-G8 | R-PDIP-T8 | R-PDSO-G8 |
JESD-609代码 | e0 | e0 | e0 | e0 | e0 | e0 | e0 |
长度 | 3 mm | 3 mm | 9.325 mm | 4.9 mm | 4.9 mm | 9.325 mm | 4.4 mm |
内存密度 | 1024 bit | 1024 bit | 1024 bit | 1024 bit | 1024 bit | 1024 bit | 1024 bit |
内存集成电路类型 | EEPROM | EEPROM | EEPROM | EEPROM | EEPROM | EEPROM | EEPROM |
内存宽度 | 8 | 8 | 8 | 8 | 8 | 8 | 8 |
功能数量 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
端子数量 | 8 | 8 | 8 | 8 | 8 | 8 | 8 |
字数 | 128 words | 128 words | 128 words | 128 words | 128 words | 128 words | 128 words |
字数代码 | 128 | 128 | 128 | 128 | 128 | 128 | 128 |
工作模式 | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS |
最高工作温度 | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C |
最低工作温度 | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C |
组织 | 128X8 | 128X8 | 128X8 | 128X8 | 128X8 | 128X8 | 128X8 |
封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
封装代码 | TSSOP | TSSOP | DIP | SOP | SOP | DIP | TSSOP |
封装形状 | SQUARE | SQUARE | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
封装形式 | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | IN-LINE | SMALL OUTLINE | SMALL OUTLINE | IN-LINE | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
并行/串行 | SERIAL | SERIAL | SERIAL | SERIAL | SERIAL | SERIAL | SERIAL |
峰值回流温度(摄氏度) | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
座面最大高度 | 1.1 mm | 1.1 mm | 4.57 mm | 1.75 mm | 1.75 mm | 4.57 mm | 1.2 mm |
串行总线类型 | I2C | I2C | I2C | I2C | I2C | I2C | I2C |
最大供电电压 (Vsup) | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
最小供电电压 (Vsup) | 4.5 V | 2.7 V | 4.5 V | 4.5 V | 2.7 V | 2.7 V | 4.5 V |
标称供电电压 (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
表面贴装 | YES | YES | NO | YES | YES | NO | YES |
技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
温度等级 | AUTOMOTIVE | AUTOMOTIVE | AUTOMOTIVE | AUTOMOTIVE | AUTOMOTIVE | AUTOMOTIVE | AUTOMOTIVE |
端子面层 | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
端子形式 | GULL WING | GULL WING | THROUGH-HOLE | GULL WING | GULL WING | THROUGH-HOLE | GULL WING |
端子节距 | 0.65 mm | 0.65 mm | 2.54 mm | 1.27 mm | 1.27 mm | 2.54 mm | 0.65 mm |
端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
处于峰值回流温度下的最长时间 | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
宽度 | 3 mm | 3 mm | 7.62 mm | 3.9 mm | 3.9 mm | 7.62 mm | 3 mm |
最长写入周期时间 (tWC) | 10 ms | 10 ms | 10 ms | 10 ms | 10 ms | 10 ms | 10 ms |
厂商名称 | Integrated Silicon Solution ( ISSI ) | - | Integrated Silicon Solution ( ISSI ) | Integrated Silicon Solution ( ISSI ) | Integrated Silicon Solution ( ISSI ) | Integrated Silicon Solution ( ISSI ) | Integrated Silicon Solution ( ISSI ) |
是否无铅 | - | 含铅 | - | 含铅 | 含铅 | - | 含铅 |
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