10E SERIES, 4 LINE TO 1 LINE MULTIPLEXER, COMPLEMENTARY OUTPUT, PDSO20, LEAD FREE, TSSOP-20
| 参数名称 | 属性值 |
| 是否无铅 | 不含铅 |
| 厂商名称 | Rochester Electronics |
| 零件包装代码 | TSSOP |
| 包装说明 | LEAD FREE, TSSOP-20 |
| 针数 | 20 |
| Reach Compliance Code | unknown |
| 其他特性 | NECL MODE: VCC = 0V WITH VEE = -3.0V TO -5.5V; |
| 系列 | 10E |
| JESD-30 代码 | R-PDSO-G20 |
| JESD-609代码 | e4 |
| 长度 | 6.5 mm |
| 逻辑集成电路类型 | MULTIPLEXER |
| 湿度敏感等级 | NOT SPECIFIED |
| 功能数量 | 1 |
| 输入次数 | 4 |
| 输出次数 | 1 |
| 端子数量 | 20 |
| 最高工作温度 | 85 °C |
| 最低工作温度 | -40 °C |
| 输出极性 | COMPLEMENTARY |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | TSSOP |
| 封装形状 | RECTANGULAR |
| 封装形式 | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
| 峰值回流温度（摄氏度） | 260 |
| 传播延迟（tpd） | 0.475 ns |
| 认证状态 | COMMERCIAL |
| 座面最大高度 | 1.2 mm |
| 最大供电电压 (Vsup) | 5.5 V |
| 最小供电电压 (Vsup) | 3 V |
| 标称供电电压 (Vsup) | 3.3 V |
| 表面贴装 | YES |
| 技术 | ECL |
| 温度等级 | INDUSTRIAL |
| 端子面层 | NICKEL PALLADIUM GOLD |
| 端子形式 | GULL WING |
| 端子节距 | 0.65 mm |
| 端子位置 | DUAL |
| 处于峰值回流温度下的最长时间 | 40 |
| 宽度 | 4.4 mm |
| MC10EP57DTR2G | MC100EP57MNG | MC10EP57DTG | MC10EP57DT | MC10EP57DTR2 | MC10EP57MNTXG | MC10EP57MNG | |
|---|---|---|---|---|---|---|---|
| 描述 | 10E SERIES, 4 LINE TO 1 LINE MULTIPLEXER, COMPLEMENTARY OUTPUT, PDSO20, LEAD FREE, TSSOP-20 | 100E SERIES, 4 LINE TO 1 LINE MULTIPLEXER, COMPLEMENTARY OUTPUT, QCC20, LEAD FREE, QFN-20 | 10E SERIES, 4 LINE TO 1 LINE MULTIPLEXER, COMPLEMENTARY OUTPUT, PDSO20, LEAD FREE, TSSOP-20 | 10E SERIES, 4 LINE TO 1 LINE MULTIPLEXER, COMPLEMENTARY OUTPUT, PDSO20, TSSOP-20 | 10E SERIES, 4 LINE TO 1 LINE MULTIPLEXER, COMPLEMENTARY OUTPUT, PDSO20, TSSOP-20 | 10E SERIES, 4 LINE TO 1 LINE MULTIPLEXER, COMPLEMENTARY OUTPUT, QCC20, LEAD FREE, QFN-20 | 10E SERIES, 4 LINE TO 1 LINE MULTIPLEXER, COMPLEMENTARY OUTPUT, QCC20, LEAD FREE, QFN-20 |
| 是否无铅 | 不含铅 | 不含铅 | 不含铅 | 不含铅 | 不含铅 | 不含铅 | 不含铅 |
| 厂商名称 | Rochester Electronics | Rochester Electronics | Rochester Electronics | Rochester Electronics | Rochester Electronics | Rochester Electronics | Rochester Electronics |
| 零件包装代码 | TSSOP | QFN | TSSOP | TSSOP | TSSOP | QFN | QFN |
| 包装说明 | LEAD FREE, TSSOP-20 | LEAD FREE, QFN-20 | LEAD FREE, TSSOP-20 | TSSOP-20 | TSSOP-20 | LEAD FREE, QFN-20 | LEAD FREE, QFN-20 |
| 针数 | 20 | 20 | 20 | 20 | 20 | 20 | 20 |
| Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknow | unknow |
| 其他特性 | NECL MODE: VCC = 0V WITH VEE = -3.0V TO -5.5V; | NECL MODE: VCC = 0V WITH VEE = -3.0V TO -5.5V; | NECL MODE: VCC = 0V WITH VEE = -3.0V TO -5.5V; | NECL MODE: VCC = 0V WITH VEE = -3.0V TO -5.5V; | NECL MODE: VCC = 0V WITH VEE = -3.0V TO -5.5V; | NECL MODE: VCC = 0V WITH VEE = -3.0V TO -5.5V; | NECL MODE: VCC = 0V WITH VEE = -3.0V TO -5.5V; |
| 系列 | 10E | 100E | 10E | 10E | 10E | 10E | 10E |
| JESD-30 代码 | R-PDSO-G20 | S-XQCC-N20 | R-PDSO-G20 | R-PDSO-G20 | R-PDSO-G20 | S-XQCC-N20 | S-XQCC-N20 |
| JESD-609代码 | e4 | e3 | e4 | e4 | e4 | e3 | e3 |
| 长度 | 6.5 mm | 4 mm | 6.5 mm | 6.5 mm | 6.5 mm | 4 mm | 4 mm |
| 逻辑集成电路类型 | MULTIPLEXER | MULTIPLEXER | MULTIPLEXER | MULTIPLEXER | MULTIPLEXER | MULTIPLEXER | MULTIPLEXER |
| 湿度敏感等级 | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| 功能数量 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| 输入次数 | 4 | 4 | 4 | 4 | 4 | 4 | 4 |
| 输出次数 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| 端子数量 | 20 | 20 | 20 | 20 | 20 | 20 | 20 |
| 最高工作温度 | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C |
| 最低工作温度 | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C |
| 输出极性 | COMPLEMENTARY | COMPLEMENTARY | COMPLEMENTARY | COMPLEMENTARY | COMPLEMENTARY | COMPLEMENTARY | COMPLEMENTARY |
| 封装主体材料 | PLASTIC/EPOXY | UNSPECIFIED | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | UNSPECIFIED | UNSPECIFIED |
| 封装代码 | TSSOP | HVQCCN | TSSOP | TSSOP | TSSOP | HVQCCN | HVQCCN |
| 封装形状 | RECTANGULAR | SQUARE | RECTANGULAR | RECTANGULAR | RECTANGULAR | SQUARE | SQUARE |
| 封装形式 | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
| 峰值回流温度（摄氏度） | 260 | 260 | 260 | 260 | 260 | NOT SPECIFIED | 260 |
| 传播延迟（tpd） | 0.475 ns | 0.475 ns | 0.475 ns | 0.475 ns | 0.475 ns | 0.475 ns | 0.475 ns |
| 认证状态 | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL |
| 座面最大高度 | 1.2 mm | 1 mm | 1.2 mm | 1.2 mm | 1.2 mm | 1 mm | 1 mm |
| 最大供电电压 (Vsup) | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
| 最小供电电压 (Vsup) | 3 V | 3 V | 3 V | 3 V | 3 V | 3 V | 3 V |
| 标称供电电压 (Vsup) | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
| 表面贴装 | YES | YES | YES | YES | YES | YES | YES |
| 技术 | ECL | ECL | ECL | ECL | ECL | ECL | ECL |
| 温度等级 | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL |
| 端子面层 | NICKEL PALLADIUM GOLD | MATTE TIN | NICKEL PALLADIUM GOLD | NICKEL PALLADIUM GOLD | NICKEL PALLADIUM GOLD | MATTE TIN | MATTE TIN |
| 端子形式 | GULL WING | NO LEAD | GULL WING | GULL WING | GULL WING | NO LEAD | NO LEAD |
| 端子节距 | 0.65 mm | 0.5 mm | 0.65 mm | 0.65 mm | 0.65 mm | 0.5 mm | 0.5 mm |
| 端子位置 | DUAL | QUAD | DUAL | DUAL | DUAL | QUAD | QUAD |
| 处于峰值回流温度下的最长时间 | 40 | 40 | 40 | 40 | 40 | NOT SPECIFIED | 40 |
| 宽度 | 4.4 mm | 4 mm | 4.4 mm | 4.4 mm | 4.4 mm | 4 mm | 4 mm |
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