SNJ54HC152FK-00概述

HC/UH SERIES, 8 LINE TO 1 LINE MULTIPLEXER, INVERTED OUTPUT, CQCC20

SNJ54HC152FK-00规格参数

参数名称	属性值
厂商名称	Texas Instruments(德州仪器)
包装说明	QCCN,
Reach Compliance Code	unknown
系列	HC/UH
JESD-30 代码	S-CQCC-N20
长度	8.89 mm
负载电容（CL）	150 pF
逻辑集成电路类型	MULTIPLEXER
功能数量	1
输入次数	8
输出次数	1
端子数量	20
最高工作温度	125 °C
最低工作温度	-55 °C
输出极性	INVERTED
封装主体材料	CERAMIC, METAL-SEALED COFIRED
封装代码	QCCN
封装形状	SQUARE
封装形式	CHIP CARRIER
传播延迟（tpd）	77 ns
认证状态	Not Qualified
座面最大高度	2.03 mm
最大供电电压 (Vsup)	6 V
最小供电电压 (Vsup)	2 V
标称供电电压 (Vsup)	5 V
表面贴装	YES
技术	CMOS
温度等级	MILITARY
端子形式	NO LEAD
端子节距	1.27 mm
端子位置	QUAD
宽度	8.89 mm

SNJ54HC152FK-00相似产品对比

	SNJ54HC152FK-00	SNJ54HC152J-00	SN74HC152DR-00	SN54HC152J-00	SN74HC152N-00	SN74HC152N-10	SN74HC152D-00	SN54HC152FK-00
描述	HC/UH SERIES, 8 LINE TO 1 LINE MULTIPLEXER, INVERTED OUTPUT, CQCC20	HC/UH SERIES, 8 LINE TO 1 LINE MULTIPLEXER, INVERTED OUTPUT, CDIP14	HC/UH SERIES, 8 LINE TO 1 LINE MULTIPLEXER, INVERTED OUTPUT, PDSO14	HC/UH SERIES, 8 LINE TO 1 LINE MULTIPLEXER, INVERTED OUTPUT, CDIP14	HC/UH SERIES, 8 LINE TO 1 LINE MULTIPLEXER, INVERTED OUTPUT, PDIP14	HC/UH SERIES, 8 LINE TO 1 LINE MULTIPLEXER, INVERTED OUTPUT, PDIP14	HC/UH SERIES, 8 LINE TO 1 LINE MULTIPLEXER, INVERTED OUTPUT, PDSO14	HC/UH SERIES, 8 LINE TO 1 LINE MULTIPLEXER, INVERTED OUTPUT, CQCC20
包装说明	QCCN,	DIP,	SOP,	DIP,	DIP,	DIP,	SOP,	QCCN,
Reach Compliance Code	unknown	unknown	unknown	unknown	unknown	unknown	unknown	unknown
系列	HC/UH	HC/UH	HC/UH	HC/UH	HC/UH	HC/UH	HC/UH	HC/UH
JESD-30 代码	S-CQCC-N20	R-GDIP-T14	R-PDSO-G14	R-GDIP-T14	R-PDIP-T14	R-PDIP-T14	R-PDSO-G14	S-CQCC-N20
长度	8.89 mm	19.56 mm	8.65 mm	19.56 mm	19.305 mm	19.305 mm	8.65 mm	8.89 mm
负载电容（CL）	150 pF	150 pF	150 pF	150 pF	150 pF	150 pF	150 pF	150 pF
逻辑集成电路类型	MULTIPLEXER	MULTIPLEXER	MULTIPLEXER	MULTIPLEXER	MULTIPLEXER	MULTIPLEXER	MULTIPLEXER	MULTIPLEXER
功能数量	1	1	1	1	1	1	1	1
输入次数	8	8	8	8	8	8	8	8
输出次数	1	1	1	1	1	1	1	1
端子数量	20	14	14	14	14	14	14	20
最高工作温度	125 °C	125 °C	85 °C	125 °C	85 °C	85 °C	85 °C	125 °C
最低工作温度	-55 °C	-55 °C	-40 °C	-55 °C	-40 °C	-40 °C	-40 °C	-55 °C
输出极性	INVERTED	INVERTED	INVERTED	INVERTED	INVERTED	INVERTED	INVERTED	INVERTED
封装主体材料	CERAMIC, METAL-SEALED COFIRED	CERAMIC, GLASS-SEALED	PLASTIC/EPOXY	CERAMIC, GLASS-SEALED	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	CERAMIC, METAL-SEALED COFIRED
封装代码	QCCN	DIP	SOP	DIP	DIP	DIP	SOP	QCCN
封装形状	SQUARE	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	SQUARE
封装形式	CHIP CARRIER	IN-LINE	SMALL OUTLINE	IN-LINE	IN-LINE	IN-LINE	SMALL OUTLINE	CHIP CARRIER
传播延迟（tpd）	77 ns	77 ns	64 ns	77 ns	64 ns	64 ns	64 ns	77 ns
认证状态	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
座面最大高度	2.03 mm	5.08 mm	1.75 mm	5.08 mm	5.08 mm	5.08 mm	1.75 mm	2.03 mm
最大供电电压 (Vsup)	6 V	6 V	6 V	6 V	6 V	6 V	6 V	6 V
最小供电电压 (Vsup)	2 V	2 V	2 V	2 V	2 V	2 V	2 V	2 V
标称供电电压 (Vsup)	5 V	5 V	5 V	5 V	5 V	5 V	5 V	5 V
表面贴装	YES	NO	YES	NO	NO	NO	YES	YES
技术	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
温度等级	MILITARY	MILITARY	INDUSTRIAL	MILITARY	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	MILITARY
端子形式	NO LEAD	THROUGH-HOLE	GULL WING	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	GULL WING	NO LEAD
端子节距	1.27 mm	2.54 mm	1.27 mm	2.54 mm	2.54 mm	2.54 mm	1.27 mm	1.27 mm
端子位置	QUAD	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL	QUAD
宽度	8.89 mm	7.62 mm	3.9 mm	7.62 mm	7.62 mm	7.62 mm	3.9 mm	8.89 mm
厂商名称	Texas Instruments(德州仪器)	-	Texas Instruments(德州仪器)	Texas Instruments(德州仪器)	Texas Instruments(德州仪器)	Texas Instruments(德州仪器)	Texas Instruments(德州仪器)	Texas Instruments(德州仪器)

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