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W19B320ABT9G

产品描述Flash, 2MX16, 70ns, PDSO48, 12 X 20 MM, TSOP-48
产品类别存储    存储   
文件大小479KB,共53页
制造商Winbond(华邦电子)
官网地址http://www.winbond.com.tw
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W19B320ABT9G概述

Flash, 2MX16, 70ns, PDSO48, 12 X 20 MM, TSOP-48

W19B320ABT9G规格参数

参数名称属性值
是否Rohs认证不符合
厂商名称Winbond(华邦电子)
零件包装代码TSOP
包装说明12 X 20 MM, TSOP-48
针数48
Reach Compliance Codeunknown
ECCN代码3A991.B.1.A
最长访问时间70 ns
备用内存宽度8
启动块BOTTOM
JESD-30 代码R-PDSO-G48
JESD-609代码e0
长度18.4 mm
内存密度33554432 bit
内存集成电路类型FLASH
内存宽度16
功能数量1
端子数量48
字数2097152 words
字数代码2000000
工作模式ASYNCHRONOUS
最高工作温度85 °C
最低工作温度-20 °C
组织2MX16
封装主体材料PLASTIC/EPOXY
封装代码TSOP1
封装形状RECTANGULAR
封装形式SMALL OUTLINE, THIN PROFILE
并行/串行PARALLEL
峰值回流温度(摄氏度)240
编程电压3 V
认证状态Not Qualified
座面最大高度1.2 mm
最大供电电压 (Vsup)3.6 V
最小供电电压 (Vsup)2.7 V
标称供电电压 (Vsup)3 V
表面贴装YES
技术CMOS
温度等级OTHER
端子面层TIN LEAD
端子形式GULL WING
端子节距0.5 mm
端子位置DUAL
处于峰值回流温度下的最长时间30
类型NOR TYPE
宽度12 mm

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W19B320AT/B Data Sheet
4M
×
8/2M
×
16 BITS
3V FLEXIBLE BANK FLASH MEMORY
Table of Contents-
1.
2.
3.
4.
5.
6.
GENERAL DESCRIPTION ......................................................................................................... 4
FEATURES ................................................................................................................................. 4
PIN CONFIGURATIONS ............................................................................................................ 5
BLOCK DIAGRAM ...................................................................................................................... 6
PIN DESCRIPTION..................................................................................................................... 6
FUNCTIONAL DESCRIPTION ................................................................................................... 7
6.1
Device Bus Operation..................................................................................................... 7
6.1.1
6.1.2
6.1.3
6.1.4
6.1.5
6.1.6
6.1.7
6.1.8
6.1.9
6.1.10
6.1.11
6.1.12
6.1.13
6.1.14
Word/Byte Configuration ..................................................................................................7
Reading Array Data ..........................................................................................................7
Writing Commands/Command Sequences.......................................................................7
Simultaneous Read/Write Operations with Zero Latency .................................................8
Standby Mode ..................................................................................................................8
Automatic Sleep Mode .....................................................................................................8
#RESET: Hardware Reset Pin..........................................................................................9
Output Disable Mode........................................................................................................9
Autoselect Mode...............................................................................................................9
Sector/Sector Block Protection and Unprotection...........................................................9
Write Protect (#WP) .....................................................................................................10
Temporary Sector Unprotect ........................................................................................10
Security Sector Flash Memory Region .........................................................................10
Hardware Data Protection ............................................................................................11
Reading Array Data ........................................................................................................12
Reset Command.............................................................................................................12
AUTOSELECT Command Sequence .............................................................................13
Byte/Word Program Command Sequence......................................................................13
Unlock Bypass Command Sequence .............................................................................14
Chip Erase Command Sequence ...................................................................................14
Sector Erase Command Sequence ................................................................................14
Erase Suspend/Erase Resume Commands ...................................................................15
DQ7: #Data Polling.........................................................................................................16
RY/#BY: Ready/#Busy ...................................................................................................16
DQ6: Toggle Bit I............................................................................................................16
6.2
Command Definitions ................................................................................................... 12
6.2.1
6.2.2
6.2.3
6.2.4
6.2.5
6.2.6
6.2.7
6.2.8
6.3
Write Operation Status ................................................................................................. 16
6.3.1
6.3.2
6.3.3
-1-
Publication Release Date: December 27, 2005
Revision A4

 
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