AQ7-IMX6
09
Qseven CPU Modules
Specifications
System
Form Factor
Processor
System Memory
Chipset
I/O Chipset
Ethernet
BIOS
Wake On LAN
Watchdog Timer
H/W Status Monitoring
Qseven, Qseven Rev. 2.0
Freescale® i.MX6 Solo 1.0GHz Processor
Freescale® i.MX6 Dual 1.0GHz Processor
Freescale® i.MX6 Quad 1.0/1.2GHz Processor
Onboard DDR3/1GB, Max. 1 GB (Solo/Dual)
Onboard DDR3/1GB, Max. 2 GB (Quad)
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Micrel® KSZ9021RNI for 10/1000/1000Base
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Yes
Integrated Watch Dog and Timer
Integrate advanced power management
PCI Express [x1] x1
CAN Bus x1
SMBUS x1
UART x1
SDIO x1
+5V DC
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2.75" x 2.75"(70mm x 70mm)
0.44 lb (0.2 Kg)
32 °F ~ 140 °F (0 °C ~ 60 °C) or
-40°F ~ 185°F (-40°C ~ 85°C) for WiTAS 2
-40°F ~ 185°F (-40°C ~ 85°C)
0% ~ 90% relative humidity, non-condensing
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Supports LCD/CRT/HDMI
Up to 1400 x 1050 (SXGA) @ 60Hz for CRT
Up to 1366 x 768 or 1280 x 800 (WXGA) @ 60Hz for LCD
Up to 24-bit dual channel LVDS (optional)
1 SATA (3GB/s), eMMCx1(optional)
1 (Tx/Rx)
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USB 2.0 x 5(Shared with 1 x USB OTG client)
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1
I2S
8-bit
Expansion Interface
Power Requirement
Power Consumption
(Typical)
Board Size
Gross Weight
Operation Temperature
Storage Temperature
Operation Humidity
MTBF (Hours)
Qseven CPU Module with Onboard Freescale® i.MX6 Solo/Dual/Quad ARM Cortex A9 Processor
Features
DDR3 Memory Chips
Solo/Dual/Quad Processor
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Onboard DDR3 800 Memory 1GB (Solo/Dual)
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Onboard DDR3 1066 Memory 2GB (Quad)
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Gigabit Ethernet x 1
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24-bit Dual-Channel LVDS LCDs (Optional)
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I2S Audio Interface
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SATA x 1, eMMC (Optional)
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USB2.0 x 5, PCI-Express [x1] x 1
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Qseven Module Size, 70mm x 70mm , Qseven Rev. 2.0
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Freescale® i.MX6
Micrel® KSZ9021RNI
Gigabit Ethernet
Onboard Freescale® i.MX6 Solo/Dual/Quad Processor
eMMC
Packing List
•
Product CD
•
AQ7-IMX6
Ordering Information
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TBD
Optional Accessories
•
TBD
Display
Resolution
LCD Interface
I/O
Storage
Serial Port
Parallel Port
USB
PS/2 Port
I2C
Audio
GPIO
09-3
ECB-970
Qseven Rev. 2.0 Carrier Board for ARM/X86 Solutions
Features
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Supports Qseven Module
Launching in Q2
Based
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Supports Gigabit Ethernet, RJ-45
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Up to 24-bit Dual Channel LVDS Connector or EDP, DP or HDMI
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High Definition Audio or I2S Audio Interface
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SATA Port x 2, SDIO x 1
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USB 2.0 x 8, USB 3.0 x 2, USB OTG
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LPC Connector x 1
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Qseven 2.0
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9.65” Form Factor
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Support ARM/x86
Specifications
System
Form Factor
I/O Chipset
Ethernet
Expansion Interface
Power Requirement
Power Consumption
(Typical)
Board Size
Gross Weight
Operation Temperature
Storage Temperature
Operation Humidity
MTBF (Hours)
Display
LCD Interface
I/O
Storage
Serial Port
Parallel Port
USB
PS/2 Port
I2C
Audio
Debug LED
MTX
Winbond W83627DHG-P or Fintek F81866 (optional)
10/1000/1000Base-TX, RJ-45 x 1 (From CPU module)
PCI Express [x4] x 1, LPC Connector x 1 (For Super I/O Card only)
+5V DC
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9.65" x 9.65" (243.84mm x 243.84mm)
1.32 lb (0.6 Kg)
32°F ~ 140°F (0°C ~ 60°C)
-40°F ~ 185°F (-40°C ~ 85°C)
0% ~ 90% relative humidity, non-condensing
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LVDS or EDP, DP or HDMI
Up to 24-bit dual channel LVDS
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SATA x 2, SDIO x 1
RS-232 x 1, RS-232/422/485 x 1
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USB 2.0 x 8, USB3.0 x 2, USB OTG
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1
Audio Jack, supports Line-in, Line-out, Microphone, Headphone (ARM base only)
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Packing List
•
Product CD
•
ECB-970
09-4