ALS SERIES, QUAD 2-INPUT XNOR GATE, CQCC20, CERAMIC, LCC-20
参数名称 | 属性值 |
是否Rohs认证 | 不符合 |
厂商名称 | Texas Instruments(德州仪器) |
零件包装代码 | QLCC |
包装说明 | QCCN, LCC20,.35SQ |
针数 | 20 |
Reach Compliance Code | not_compliant |
系列 | ALS |
JESD-30 代码 | S-CQCC-N20 |
长度 | 8.89 mm |
负载电容(CL) | 50 pF |
逻辑集成电路类型 | XNOR GATE |
功能数量 | 4 |
输入次数 | 2 |
端子数量 | 20 |
最高工作温度 | 125 °C |
最低工作温度 | -55 °C |
封装主体材料 | CERAMIC, METAL-SEALED COFIRED |
封装代码 | QCCN |
封装等效代码 | LCC20,.35SQ |
封装形状 | SQUARE |
封装形式 | CHIP CARRIER |
峰值回流温度(摄氏度) | NOT SPECIFIED |
最大电源电流(ICC) | 7.5 mA |
传播延迟(tpd) | 23 ns |
认证状态 | Not Qualified |
施密特触发器 | NO |
筛选级别 | 38535Q/M;38534H;883B |
座面最大高度 | 2.03 mm |
最大供电电压 (Vsup) | 5.5 V |
最小供电电压 (Vsup) | 4.5 V |
标称供电电压 (Vsup) | 5 V |
表面贴装 | YES |
技术 | TTL |
温度等级 | MILITARY |
端子形式 | NO LEAD |
端子节距 | 1.27 mm |
端子位置 | QUAD |
处于峰值回流温度下的最长时间 | NOT SPECIFIED |
宽度 | 8.89 mm |
SNJ54ALS810FK | SNJ54AS810FKR | SNJ54ALS810J | SN74AS810DR | SNJ54ALS810FKR | SNJ54AS810FK | |
---|---|---|---|---|---|---|
描述 | ALS SERIES, QUAD 2-INPUT XNOR GATE, CQCC20, CERAMIC, LCC-20 | AS SERIES, QUAD 2-INPUT XNOR GATE, CQCC20, CERAMIC, LCC-20 | ALS SERIES, QUAD 2-INPUT XNOR GATE, CDIP14, 0.300 INCH, CERAMIC, DIP-14 | AS SERIES, QUAD 2-INPUT XNOR GATE, PDSO14, PLASTIC, SO-14 | ALS SERIES, QUAD 2-INPUT XNOR GATE, CQCC20, CERAMIC, LCC-20 | AS SERIES, QUAD 2-INPUT XNOR GATE, CQCC20, CERAMIC, LCC-20 |
厂商名称 | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) |
零件包装代码 | QLCC | QLCC | DIP | SOIC | QLCC | QLCC |
包装说明 | QCCN, LCC20,.35SQ | QCCN, | DIP, DIP14,.3 | SOP, | QCCN, | QCCN, LCC20,.35SQ |
针数 | 20 | 20 | 14 | 14 | 20 | 20 |
Reach Compliance Code | not_compliant | unknown | not_compliant | unknown | unknown | _compli |
系列 | ALS | AS | ALS | AS | ALS | AS |
JESD-30 代码 | S-CQCC-N20 | S-CQCC-N20 | R-GDIP-T14 | R-PDSO-G14 | S-CQCC-N20 | S-CQCC-N20 |
长度 | 8.89 mm | 8.89 mm | 19.56 mm | 8.65 mm | 8.89 mm | 8.89 mm |
逻辑集成电路类型 | XNOR GATE | XNOR GATE | XNOR GATE | XNOR GATE | XNOR GATE | XNOR GATE |
功能数量 | 4 | 4 | 4 | 4 | 4 | 4 |
输入次数 | 2 | 2 | 2 | 2 | 2 | 2 |
端子数量 | 20 | 20 | 14 | 14 | 20 | 20 |
最高工作温度 | 125 °C | 125 °C | 125 °C | 70 °C | 125 °C | 125 °C |
最低工作温度 | -55 °C | -55 °C | -55 °C | - | -55 °C | -55 °C |
封装主体材料 | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, GLASS-SEALED | PLASTIC/EPOXY | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED |
封装代码 | QCCN | QCCN | DIP | SOP | QCCN | QCCN |
封装形状 | SQUARE | SQUARE | RECTANGULAR | RECTANGULAR | SQUARE | SQUARE |
封装形式 | CHIP CARRIER | CHIP CARRIER | IN-LINE | SMALL OUTLINE | CHIP CARRIER | CHIP CARRIER |
传播延迟(tpd) | 23 ns | 9 ns | 23 ns | 9 ns | 23 ns | 9 ns |
认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
座面最大高度 | 2.03 mm | 2.03 mm | 5.08 mm | 1.75 mm | 2.03 mm | 2.03 mm |
最大供电电压 (Vsup) | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
最小供电电压 (Vsup) | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V |
标称供电电压 (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
表面贴装 | YES | YES | NO | YES | YES | YES |
技术 | TTL | TTL | TTL | TTL | TTL | TTL |
温度等级 | MILITARY | MILITARY | MILITARY | COMMERCIAL | MILITARY | MILITARY |
端子形式 | NO LEAD | NO LEAD | THROUGH-HOLE | GULL WING | NO LEAD | NO LEAD |
端子节距 | 1.27 mm | 1.27 mm | 2.54 mm | 1.27 mm | 1.27 mm | 1.27 mm |
端子位置 | QUAD | QUAD | DUAL | DUAL | QUAD | QUAD |
宽度 | 8.89 mm | 8.89 mm | 7.62 mm | 3.9 mm | 8.89 mm | 8.89 mm |
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