
SQUARE; PULSE; RECTANGULAR, 5MHz, TIMER, PDSO5, LEAD FREE, SOT-23, 5 PIN
| 参数名称 | 属性值 |
| 是否Rohs认证 | 符合 |
| 厂商名称 | Microchip(微芯科技) |
| 零件包装代码 | SOT-23 |
| 包装说明 | LSSOP, |
| 针数 | 5 |
| Reach Compliance Code | compliant |
| ECCN代码 | EAR99 |
| 模拟集成电路 - 其他类型 | SQUARE; PULSE; RECTANGULAR |
| JESD-30 代码 | R-PDSO-G5 |
| JESD-609代码 | e4 |
| 长度 | 2.9 mm |
| 湿度敏感等级 | 1 |
| 功能数量 | 1 |
| 端子数量 | 5 |
| 最高工作温度 | 85 °C |
| 最低工作温度 | -40 °C |
| 最大输出频率 | 5 GHz |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | LSSOP |
| 封装形状 | RECTANGULAR |
| 封装形式 | SMALL OUTLINE, LOW PROFILE, SHRINK PITCH |
| 峰值回流温度(摄氏度) | 260 |
| 认证状态 | Not Qualified |
| 座面最大高度 | 1.45 mm |
| 最大供电电压 (Vsup) | 18 V |
| 最小供电电压 (Vsup) | 2.7 V |
| 标称供电电压 (Vsup) | 5 V |
| 表面贴装 | YES |
| 技术 | CMOS |
| 温度等级 | INDUSTRIAL |
| 端子面层 | Nickel/Palladium/Gold (Ni/Pd/Au) |
| 端子形式 | GULL WING |
| 端子节距 | 0.95 mm |
| 端子位置 | DUAL |
| 处于峰值回流温度下的最长时间 | 40 |
| 宽度 | 1.6 mm |

| MIC1555YM5TR | MIC1557BM5T&R | MIC1557YM5TX | MIC1555BM5TX | MIC1555BM5T&R | |
|---|---|---|---|---|---|
| 描述 | SQUARE; PULSE; RECTANGULAR, 5MHz, TIMER, PDSO5, LEAD FREE, SOT-23, 5 PIN | 1 Func, 5MHz, CMOS, PDSO5, SOT-23, 5 PIN | IC,TIMER,CMOS,TSOP,5PIN,PLASTIC | IC,TIMER,CMOS,TSOP,5PIN,PLASTIC | 1 Func, 5MHz, CMOS, PDSO5, SOT-23, 5 PIN |
| 是否Rohs认证 | 符合 | 不符合 | 符合 | 不符合 | 不符合 |
| 厂商名称 | Microchip(微芯科技) | Microchip(微芯科技) | Microchip(微芯科技) | Microchip(微芯科技) | Microchip(微芯科技) |
| 包装说明 | LSSOP, | SOT-23, 5 PIN | LSSOP, TSOP5/6,.11,37 | SOT-23, 5 PIN | SOT-23, 5 PIN |
| Reach Compliance Code | compliant | not_compliant | compliant | compliant | not_compliant |
| 模拟集成电路 - 其他类型 | SQUARE; PULSE; RECTANGULAR | SQUARE; PULSE; RECTANGULAR | SQUARE; PULSE; RECTANGULAR | SQUARE; PULSE; RECTANGULAR | SQUARE; PULSE; RECTANGULAR |
| JESD-30 代码 | R-PDSO-G5 | R-PDSO-G5 | R-PDSO-G5 | R-PDSO-G5 | R-PDSO-G5 |
| JESD-609代码 | e4 | e0 | e4 | e0 | e0 |
| 长度 | 2.9 mm | 2.91 mm | 2.9 mm | 2.9 mm | 2.91 mm |
| 湿度敏感等级 | 1 | 1 | 1 | 1 | 1 |
| 功能数量 | 1 | 1 | 1 | 1 | 1 |
| 端子数量 | 5 | 5 | 5 | 5 | 5 |
| 最高工作温度 | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C |
| 最低工作温度 | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C |
| 最大输出频率 | 5 GHz | 5 GHz | 5 GHz | 5 GHz | 5 GHz |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | LSSOP | LSSOP | LSSOP | LSSOP | LSSOP |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | SMALL OUTLINE, LOW PROFILE, SHRINK PITCH | SMALL OUTLINE, LOW PROFILE, SHRINK PITCH | SMALL OUTLINE, LOW PROFILE, SHRINK PITCH | SMALL OUTLINE, LOW PROFILE, SHRINK PITCH | SMALL OUTLINE, LOW PROFILE, SHRINK PITCH |
| 峰值回流温度(摄氏度) | 260 | 240 | 260 | 240 | 240 |
| 座面最大高度 | 1.45 mm | 1.45 mm | 1.45 mm | 1.45 mm | 1.45 mm |
| 最大供电电压 (Vsup) | 18 V | 18 V | 18 V | 18 V | 18 V |
| 最小供电电压 (Vsup) | 2.7 V | 2.7 V | 2.7 V | 2.7 V | 2.7 V |
| 标称供电电压 (Vsup) | 5 V | 5 V | 15 V | 15 V | 5 V |
| 表面贴装 | YES | YES | YES | YES | YES |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL |
| 端子面层 | Nickel/Palladium/Gold (Ni/Pd/Au) | Tin/Lead (Sn85Pb15) | Nickel/Palladium/Gold (Ni/Pd/Au) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn85Pb15) |
| 端子形式 | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING |
| 端子节距 | 0.95 mm | 0.95 mm | 0.95 mm | 0.95 mm | 0.95 mm |
| 端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL |
| 处于峰值回流温度下的最长时间 | 40 | 30 | 40 | 30 | 30 |
| 宽度 | 1.6 mm | 1.625 mm | 1.6 mm | 1.6 mm | 1.625 mm |
| 零件包装代码 | SOT-23 | SOT-23 | - | - | SOT-23 |
| 针数 | 5 | 5 | - | - | 5 |
| ECCN代码 | EAR99 | EAR99 | - | - | EAR99 |
| 认证状态 | Not Qualified | Not Qualified | - | - | Not Qualified |
| 封装等效代码 | - | TSOP5/6,.11,37 | TSOP5/6,.11,37 | TSOP5/6,.11,37 | TSOP5/6,.11,37 |
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