NCL30082
Dimmable Quasi-Resonant
Primary Side Current-Mode
Controller for LED Lighting
with Thermal Fold-back
The NCL30082 is a PWM current mode controller targeting isolated
flyback and non−isolated constant current topologies. The controller
operates in a quasi−resonant mode to provide high efficiency. Thanks
to a novel control method, the device is able to precisely regulate a
constant LED current from the primary side. This removes the need
for secondary side feedback circuitry, biasing and an optocoupler.
The device is highly integrated with a minimum number of external
components. A robust suite of safety protection is built in to simplify
the design. This device supports analog/digital dimming as well as
thermal current fold−back. While the NCL30082 has integrated fixed
overvoltage protection, the designer has the flexibility to program a
lower OVP level.
Features
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8
1
Micro8
DM SUFFIX
CASE 846A
8
1
SOIC−8
D SUFFIX
CASE 751
MARKING DIAGRAMS
8
AAx
AYWG
G
1
AAx
= Specific Device Code
x
= C, D or H
A
= Assembly Location
Y
= Year
W
= Work Week
G
= Pb−Free Package
(Note: Microdot may be in either location)
8
L30082x
ALYW
G
1
L30082x = Specific Device Code
x
= B, B1, B2, B3, D
A
= Assembly Location
L
= Wafer Lot
Y
= Year
W
= Work Week
G
= Pb−Free Package
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
Quasi−resonant Peak Current−mode Control Operation
Primary Side Sensing (no optocoupler needed)
Wide V
CC
Range
Source 300 mA / Sink 500 mA Totem Pole Driver with 12 V Gate
Clamp
Precise LED Constant Current Regulation
±1%
Typical
Line Feed−forward for Enhanced Regulation Accuracy
Low LED Current Ripple
250 mV
±2%
Guaranteed Voltage Reference for Current Regulation
~0.9 Power Factor with Valley Fill Input Stage
Low Start−up Current (13
mA
typ.)
Analog or Digital Dimming
Thermal Fold−back
Wide Temperature Range of −40 to +125°C
Pb−Free, Halide−Free MSL1 Product
Robust Protection Features
♦
Over Voltage / LED Open Circuit Protection
♦
Over Temperature Protection
♦
Secondary Diode Short Protection
♦
Output Short Circuit Protection
♦
Shorted Current Sense Pin Fault Detection
♦
Latched and Auto−recoverable Versions
♦
Brown−out
♦
V
CC
Under Voltage Lockout
♦
Thermal Shutdown
These Devices are Pb−Free and Halogen Free/BFR Free
PIN CONNECTIONS
1
SD
ZCD
CS
GND
(Top View)
DIM
VIN
VCC
DRV
Typical Applications
•
Integral LED Bulbs
•
LED Power Driver Supplies
•
LED Light Engines
©
Semiconductor Components Industries, LLC, 2015
ORDERING INFORMATION
See detailed ordering and shipping information on page 33 of
this data sheet.
1
January, 2015 − Rev. 5
Publication Order Number:
NCL30082/D
NCL30082
.
.
Aux
.
V
DIM
1
2
3
4
8
7
6
5
Figure 1. Typical Application Schematic for NCL30082
Table 1. PIN FUNCTION DESCRIPTION
Pin No
1
Pin Name
SD
Function
Thermal Fold−back
and shutdown
Zero Crossing Detection
Current sense
−
Driver output
Supplies the controller
Input voltage sensing
Brown−Out
Analog / PWM dimming
Pin Description
Connecting an NTC to this pin allows reducing the output current down to 50%
of its fixed value before stopping the controller. A Zener diode can also be
used to pull−up the pin and stop the controller for adjustable OVP protection
Connected to the auxiliary winding, this pin detects the core reset event.
This pin monitors the primary peak current
The controller ground
The current capability of the totem pole gate drive (+0.3/−0.5 A) makes it suit-
able to effectively drive a broad range of power MOSFETs.
This pin is connected to an external auxiliary voltage.
This pin observes the HV rail and is used in valley selection. This pin also
monitors and protects for low mains conditions.
This pin is used for analog or PWM dimming control. An analog signal than
can be varied between V
DIM(EN)
and V
DIM100
can be used to vary the current,
or a PWM signal with an amplitude greater than V
DIM100
.
2
3
4
5
6
7
8
ZCD
CS
GND
DRV
VCC
VIN
DIM
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NCL30082
CS_shorted Enable
Over Voltage
Protection
Aux_SCP
Fault
Management
Internal
Thermal
Shutdown
STOP
OFF
UVLO
Latch
VCC_max
V
DD
V
REF
VCC
VCC Management
Over Temperature
Protection
SD
Thermal
Foldback
Qdrv
Ipkmax
WOD_SCP
BO_NOK
V
VIN
V
REF
offset_OK
Valley Selection
S
V
VLY
R
V
TF
VCC Over Voltage
Protection
V
CC
Clamp
Circuit
Qdrv
DRV
ZCD
Zero Crossing Detection
Aux. Winding
Short Circuit Prot.
V
VIN
offset_OK
Aux_SCP
Q
Line
Feedforward
V
TF
STOP V
REF
Dimming
Type
Detection
DIM
CS
Leading
Edge
Blanking
Constant−Current
Control
CS_reset
V
DIMA
Ipkmax STOP
Enable V
DIMA
Max. Peak
Current
Limit
CS Short
Protection
Winding and
Output diode
Short Circuit
Protection
Enable
Ipkmax
V
VIN
VIN
Brown−Out
CS_shorted
BO_NOK
V
VIN
GND
WOD_SCP
Note: CS Short Protection is disabled
Note:
for NCL30082B1
Figure 2. Internal Circuit Architecture
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NCL30082
Table 2. MAXIMUM RATINGS TABLE
Symbol
V
CC(MAX)
I
CC(MAX)
V
DRV(MAX)
I
DRV(MAX)
V
MAX
I
MAX
V
ZCD(MAX)
I
ZCD(MAX)
V
DIM(MAX)
R
θJA
Rating
Maximum Power Supply voltage, VCC pin, continuous voltage
Maximum current for VCC pin
Maximum driver pin voltage, DRV pin, continuous voltage
Maximum current for DRV pin
Maximum voltage on low power pins (except pins ZCD, DIM, DRV and VCC)
Current range for low power pins (except pins ZCD, DRV and VCC)
Maximum voltage for ZCD pin
Maximum current for ZCD pin
Maximum voltage for DIM pin
Thermal Resistance, Junction−to−Ambient (Note 4)
Micro8 version
SOIC−8 version
Thermal Characterization Parameter, Junction−to−Case Top
Micro8 version
SOIC−8 version
Maximum Junction Temperature
Operating Temperature Range
Storage Temperature Range
ESD Capability, HBM model (Note 2)
ESD Capability, MM model (Note 2)
Value
−0.3, +35
Internally limited
−0.3, V
DRV
(Note 1)
−500, +800
−0.3, +5.5
−2, +5
−0.3, +10
−2, +5
−0.3, +10
228
180
50
45
150
−40 to +125
−60 to +150
4
200
°C/W
°C
°C
°C
kV
V
Unit
V
mA
V
mA
V
mA
V
mA
V
°C/W
Y
JC
T
J(MAX)
Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality
should not be assumed, damage may occur and reliability may be affected.
1. V
DRV
is the DRV clamp voltage V
DRV(high)
when V
CC
is higher than V
DRV(high)
. V
DRV
is V
CC
unless otherwise noted.
2. This device series contains ESD protection and exceeds the following tests: Human Body Model 4000 V per JEDEC JESD22−A114−F and
Machine Model Method 200 V per JEDEC JESD22−A115−A.
3. This device contains latch−up protection and exceeds 100 mA per JEDEC Standard JESD78 except for VIN pin which passes 60 mA.
4. With a 100 mm
2
, 2 oz copper area based on JEDEC EIA/JESD51-3 board design.
Table 3. ELECTRICAL CHARACTERISTICS
(Unless otherwise noted: For typical values T
J
= 25°C, V
CC
= 12 V;
For min/max values T
J
= −40°C to +125°C, Max T
J
= 150°C, V
CC
= 12 V)
Description
STARTUP AND SUPPLY CIRCUITS
Supply Voltage
Startup Threshold
Minimum Operating Voltage
Hysteresis V
CC(on)
– V
CC(off)
Internal logic reset
Over Voltage Protection
VCC OVP threshold
V
CC(off)
noise filter
V
CC(reset)
noise filter−
Startup current
Startup current in fault mode
Supply Current
Device Disabled/Fault
Device Enabled/No output load on pin 5
Device Switching (F
sw
= 65 kHz)
V
CC
> V
CC(off)
F
sw
= 65 kHz
C
DRV
= 470 pF,
F
sw
= 65 kHz
V
V
CC
increasing
V
CC
decreasing
V
CC
decreasing
V
CC(on)
V
CC(off)
V
CC(HYS)
V
CC(reset)
V
CC(OVP)
t
VCC(off)
t
VCC(reset)
I
CC(start)
I
CC(sFault)
I
CC1
I
CC2
I
CC3
16
8.2
8
3.5
26
–
–
–
–
0.8
–
–
18
8.8
–
4.5
28
5
20
13
46
1.2
2.3
2.7
20
9.4
–
5.5
30
–
–
30
60
1.4
4.0
5.0
V
ms
mA
mA
mA
Test Condition
Symbol
Min
Typ
Max
Unit
Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product
performance may not be indicated by the Electrical Characteristics if operated under different conditions.
6. Guaranteed by design.
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NCL30082
Table 3. ELECTRICAL CHARACTERISTICS
(Unless otherwise noted: For typical values T
J
= 25°C, V
CC
= 12 V;
For min/max values T
J
= −40°C to +125°C, Max T
J
= 150°C, V
CC
= 12 V)
Description
CURRENT SENSE
Maximum Internal current limit
Leading Edge Blanking Duration for V
ILIM
(T
j
= −25°C to 125°C) (Not applicable for NCL30082D)
Leading Edge Blanking Duration for V
ILIM
(T
j
= −40°C to 125°C)
Input Bias Current
Propagation delay from current detection to gate off−state
Threshold for immediate fault protection activation
Leading Edge Blanking Duration for V
CS(stop)
Blanking time for CS to GND short detection V
pinVIN
= 1 V
Blanking time for CS to GND short detection V
pinVIN
= 1 V
NCL30082D
Blanking time for CS to GND short detection V
pinVIN
= 3.3 V
Blanking time for CS to GND short detection V
pinVIN
= 3.3 V
NCL30082D
GATE DRIVE
Drive Resistance
DRV Sink
DRV Source
Drive current capability
DRV Sink (Note 6)
DRV Source (Note 6)
Rise Time (10% to 90%)
Fall Time (90% to 10%)
DRV Low Voltage
C
DRV
= 470 pF
C
DRV
= 470 pF
V
CC
= V
CC(off)
+0.2 V
C
DRV
= 470 pF,
R
DRV
= 33 kW
V
CC
= 30 V
C
DRV
= 470 pF,
R
DRV
= 33 kW
W
R
SNK
R
SRC
I
SNK
I
SRC
t
r
t
f
V
DRV(low)
–
–
–
–
–
–
8
13
30
500
300
40
30
–
–
–
mA
–
–
–
–
–
ns
ns
V
DRV high
V
ILIM
t
LEB
t
LEB
I
bias
t
ILIM
V
CS(stop)
t
BCS
t
CS(blank1)
t
CS(blank1)D
t
CS(blank2)
t
CS(blank2)D
0.95
250
240
–
–
1.35
–
6
8
2
2.6
1
300
300
0.02
50
1.5
120
–
10.7
–
3.6
1.05
350
350
–
150
1.65
–
12
14
4
4.6
V
ns
ns
mA
ns
V
ns
ms
ms
ms
ms
Test Condition
Symbol
Min
Typ
Max
Unit
DRV High Voltage
V
DRV(high)
10
12
14
V
Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product
performance may not be indicated by the Electrical Characteristics if operated under different conditions.
6. Guaranteed by design.
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