PCM Codec, 1-Func, CMOS, PQFP48, 7 X 7 MM, 1 MM HEIGHT, MS-026ABC, TQFP-48
| 参数名称 | 属性值 |
| 厂商名称 | Cirrus Logic(凌云半导体) |
| 包装说明 | 7 X 7 MM, 1 MM HEIGHT, MS-026ABC, TQFP-48 |
| Reach Compliance Code | compliant |
| 滤波器 | YES |
| JESD-30 代码 | S-PQFP-G48 |
| 长度 | 7 mm |
| 功能数量 | 1 |
| 端子数量 | 48 |
| 工作模式 | SYNCHRONOUS |
| 最高工作温度 | 85 °C |
| 最低工作温度 | -25 °C |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | TFQFP |
| 封装形状 | SQUARE |
| 封装形式 | FLATPACK, THIN PROFILE, FINE PITCH |
| 座面最大高度 | 1.2 mm |
| 标称供电电压 | 3.3 V |
| 表面贴装 | YES |
| 技术 | CMOS |
| 电信集成电路类型 | PCM CODEC |
| 温度等级 | OTHER |
| 端子形式 | GULL WING |
| 端子节距 | 0.5 mm |
| 端子位置 | QUAD |
| 宽度 | 7 mm |
| XWM9710EFT/RV | WM9710GEFL/V | WM9710SEFT/V | WM9710SEFT/RV | XWM9710EFL/RV | |
|---|---|---|---|---|---|
| 描述 | PCM Codec, 1-Func, CMOS, PQFP48, 7 X 7 MM, 1 MM HEIGHT, MS-026ABC, TQFP-48 | PCM Codec, 1-Func, CMOS, PQCC48, 7 X 7 MM, 0.90 MM HEIGHT, 0.50 MM PITCH, LEAD FREE, PLASTIC, MO-220-VKKD-2, QFN-48 | PCM Codec, 1-Func, CMOS, PQFP48, 7 X 7 MM, 1 MM HEIGHT, LEAD FREE, MS-026ABC, TQFP-48 | PCM Codec, 1-Func, CMOS, PQFP48, 7 X 7 MM, 1 MM HEIGHT, LEAD FREE, MS-026ABC, TQFP-48 | PCM Codec, 1-Func, CMOS, PQCC48, 7 X 7 MM, 0.90 MM HEIGHT, 0.50 MM PITCH, PLASTIC, MO-220-VKKD-2, QFN-48 |
| 厂商名称 | Cirrus Logic(凌云半导体) | Cirrus Logic(凌云半导体) | Cirrus Logic(凌云半导体) | Cirrus Logic(凌云半导体) | Cirrus Logic(凌云半导体) |
| 包装说明 | 7 X 7 MM, 1 MM HEIGHT, MS-026ABC, TQFP-48 | HVQCCN, | TFQFP, | TFQFP, | HVQCCN, |
| Reach Compliance Code | compliant | compliant | compliant | compliant | compliant |
| 滤波器 | YES | YES | YES | YES | YES |
| JESD-30 代码 | S-PQFP-G48 | S-PQCC-N48 | S-PQFP-G48 | S-PQFP-G48 | S-PQCC-N48 |
| 长度 | 7 mm | 7 mm | 7 mm | 7 mm | 7 mm |
| 功能数量 | 1 | 1 | 1 | 1 | 1 |
| 端子数量 | 48 | 48 | 48 | 48 | 48 |
| 工作模式 | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS |
| 最高工作温度 | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C |
| 最低工作温度 | -25 °C | -25 °C | -25 °C | -25 °C | -25 °C |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | TFQFP | HVQCCN | TFQFP | TFQFP | HVQCCN |
| 封装形状 | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE |
| 封装形式 | FLATPACK, THIN PROFILE, FINE PITCH | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | FLATPACK, THIN PROFILE, FINE PITCH | FLATPACK, THIN PROFILE, FINE PITCH | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
| 座面最大高度 | 1.2 mm | 1 mm | 1.2 mm | 1.2 mm | 1 mm |
| 标称供电电压 | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
| 表面贴装 | YES | YES | YES | YES | YES |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS |
| 电信集成电路类型 | PCM CODEC | PCM CODEC | PCM CODEC | PCM CODEC | PCM CODEC |
| 温度等级 | OTHER | OTHER | OTHER | OTHER | OTHER |
| 端子形式 | GULL WING | NO LEAD | GULL WING | GULL WING | NO LEAD |
| 端子节距 | 0.5 mm | 0.5 mm | 0.5 mm | 0.5 mm | 0.5 mm |
| 端子位置 | QUAD | QUAD | QUAD | QUAD | QUAD |
| 宽度 | 7 mm | 7 mm | 7 mm | 7 mm | 7 mm |
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