Microcontroller, 4-Bit, MROM, CMOS, PQFP64, QIP-64
参数名称 | 属性值 |
厂商名称 | SANYO |
零件包装代码 | QFP |
包装说明 | QFF, |
针数 | 64 |
Reach Compliance Code | unknown |
具有ADC | NO |
地址总线宽度 | |
位大小 | 4 |
最大时钟频率 | 0.032768 MHz |
DAC 通道 | NO |
DMA 通道 | NO |
外部数据总线宽度 | |
JESD-30 代码 | S-PQFP-F64 |
长度 | 14 mm |
I/O 线路数量 | 17 |
端子数量 | 64 |
最高工作温度 | 70 °C |
最低工作温度 | -30 °C |
PWM 通道 | NO |
封装主体材料 | PLASTIC/EPOXY |
封装代码 | QFF |
封装形状 | SQUARE |
封装形式 | FLATPACK |
认证状态 | Not Qualified |
ROM可编程性 | MROM |
最大供电电压 | 6 V |
最小供电电压 | 2.2 V |
表面贴装 | YES |
技术 | CMOS |
温度等级 | OTHER |
端子形式 | FLAT |
端子节距 | 0.8 mm |
端子位置 | QUAD |
宽度 | 14 mm |
uPs/uCs/外围集成电路类型 | MICROCONTROLLER |
LC5733QIP64B | LC5733HQIP64A | LC5733CHIP | LC5733HCHIP | LC5733QIP64A | LC5733HQIP64B | |
---|---|---|---|---|---|---|
描述 | Microcontroller, 4-Bit, MROM, CMOS, PQFP64, QIP-64 | Microcontroller, 4-Bit, MROM, CMOS, PQFP64, QIP-64 | Microcontroller, 4-Bit, MROM, CMOS | Microcontroller, 4-Bit, MROM, CMOS | Microcontroller, 4-Bit, MROM, CMOS, PQFP64, QIP-64 | Microcontroller, 4-Bit, MROM, CMOS, PQFP64, QIP-64 |
厂商名称 | SANYO | SANYO | SANYO | SANYO | SANYO | SANYO |
包装说明 | QFF, | QFP, | DIE, | DIE, | QFP, | QFF, |
Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknow |
具有ADC | NO | NO | NO | NO | NO | NO |
位大小 | 4 | 4 | 4 | 4 | 4 | 4 |
最大时钟频率 | 0.032768 MHz | 0.032768 MHz | 0.032768 MHz | 0.032768 MHz | 0.032768 MHz | 0.032768 MHz |
DAC 通道 | NO | NO | NO | NO | NO | NO |
DMA 通道 | NO | NO | NO | NO | NO | NO |
JESD-30 代码 | S-PQFP-F64 | S-PQFP-G64 | X-XUUC-N66 | X-XUUC-N66 | S-PQFP-G64 | S-PQFP-F64 |
I/O 线路数量 | 17 | 17 | 17 | 17 | 17 | 17 |
端子数量 | 64 | 64 | 66 | 66 | 64 | 64 |
最高工作温度 | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C |
最低工作温度 | -30 °C | -30 °C | -30 °C | -30 °C | -30 °C | -30 °C |
PWM 通道 | NO | NO | NO | NO | NO | NO |
封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | UNSPECIFIED | UNSPECIFIED | PLASTIC/EPOXY | PLASTIC/EPOXY |
封装代码 | QFF | QFP | DIE | DIE | QFP | QFF |
封装形状 | SQUARE | SQUARE | UNSPECIFIED | UNSPECIFIED | SQUARE | SQUARE |
封装形式 | FLATPACK | FLATPACK | UNCASED CHIP | UNCASED CHIP | FLATPACK | FLATPACK |
认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
ROM可编程性 | MROM | MROM | MROM | MROM | MROM | MROM |
最大供电电压 | 6 V | 6 V | 6 V | 6 V | 6 V | 6 V |
最小供电电压 | 2.2 V | 2.2 V | 2.2 V | 2.2 V | 2.2 V | 2.2 V |
表面贴装 | YES | YES | YES | YES | YES | YES |
技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
温度等级 | OTHER | OTHER | OTHER | OTHER | OTHER | OTHER |
端子形式 | FLAT | GULL WING | NO LEAD | NO LEAD | GULL WING | FLAT |
端子位置 | QUAD | QUAD | UPPER | UPPER | QUAD | QUAD |
uPs/uCs/外围集成电路类型 | MICROCONTROLLER | MICROCONTROLLER | MICROCONTROLLER | MICROCONTROLLER | MICROCONTROLLER | MICROCONTROLLER |
零件包装代码 | QFP | QFP | - | - | QFP | QFP |
针数 | 64 | 64 | - | - | 64 | 64 |
长度 | 14 mm | 14 mm | - | - | 14 mm | 14 mm |
端子节距 | 0.8 mm | 0.8 mm | - | - | 0.8 mm | 0.8 mm |
宽度 | 14 mm | 14 mm | - | - | 14 mm | 14 mm |
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