Datasheet> 器件分类 > 无线/射频/通信> 电信电路> 450-0152R

450-0152R: 产品描述Telecom Circuit, 1-Func; 产品类别无线/射频/通信电信电路; 文件大小2MB，共66页; 制造商Laird; 标准

下载文档详细参数选型对比全文预览

450-0152R在线购买

供应商	器件名称	价格	最低购买	库存
	450-0152R	-	-	点击查看	点击购买

450-0152R概述

Telecom Circuit, 1-Func

450-0152R规格参数

参数名称	属性值
是否Rohs认证	符合
厂商名称	Laird
包装说明	CHIP ANTENNA MODULE-47
Reach Compliance Code	unknown
JESD-30 代码	R-XXMA-N47
长度	21 mm
湿度敏感等级	4
功能数量	1
端子数量	47
最高工作温度	85 °C
最低工作温度	-40 °C
封装主体材料	UNSPECIFIED
封装形状	RECTANGULAR
封装形式	MICROELECTRONIC ASSEMBLY
峰值回流温度（摄氏度）	245
座面最大高度	2.14 mm
标称供电电压	3.3 V
表面贴装	YES
电信集成电路类型	TELECOM CIRCUIT
温度等级	INDUSTRIAL
端子形式	NO LEAD
端子位置	UNSPECIFIED
处于峰值回流温度下的最长时间	NOT SPECIFIED
宽度	15.5 mm

文档预览

下载PDF文档

全文
预览

Sterling-LWB Module

Datasheet

Integrated 802.11 b/g/n WLAN, Bluetooth & BLE Module

FEATURES

•

IEEE 802.11 b/g/n (single stream n)

Typical WLAN Transmit Power:

+17.5 dBm, 11 Mbps, CCK (b)

+14.0 dBm, 54 Mbps, OFDM (g)

+12.5 dBm, HT20 MCS7 (n)

Typical WLAN Sensitivity:

-88 dBm, 8% PER,11 Mbps (b)

-75 dBm, 10% PER, 54 Mbps (g)

-72 dBm, 10% PER, MCS7 (n)

Bluetooth v4.2 BR /DR/LE

WLAN and Bluetooth coexistence

DESCRIPTION

The Sterling-LWB is a high performance 2.4 GHz

WLAN and Bluetooth combo module based on

latest-generation

silicon (Broadcom’s BCM4343W).

With an industrial temperature rating, broad

country certifications, and the availability of three

different package styles, the Sterling-LWB provides

significant flexibility to meet various end user

application needs.

The on-module chip antenna package style for the

Sterling-LWB eliminates complexity for design

integration, simplifies manufacturing assembly with

larger pin outs, and features an advanced chip

antenna that offers greater resistance to de-tuning

than typical trace or chip antennas.

•

Available in two footprint styles:

Easy to Integrate: 15.5 mm x 21 mm

Miniature footprint: 10 mm x 10 mm

Available with integrated chip antenna or

U.FL connector for external antenna

Operating voltage: 3.0V to 3.6V

Operating temperature: -40

to +85

Storage temperature: -40° to +125°C

Compact design based on Broadcom

BCM4343W SoC

Worldwide acceptance: FCC (USA), IC

(Canada), ETSI (Europe), Giteki (Japan), and

RCM (AU/NZ)

BT SIG QDID: 85005

REACH and RoHS compliant

APPLICATIONS

•

Security & Building Automation

Internet of Things / M2M Connectivity

Smart Gateways

The module includes the MAC, Baseband and Radio

to support WLAN applications and an independent,

high-speed UART is provided for the Bluetooth host

interface. In addition, the latest Linux and Android

drivers are supported directly by LSR and

Broadcom.

Need to get to market quickly? Not an expert in

802.11. Need a custom antenna? Would you like to

own the design? Would you like a custom design?

Not quite sure what you need? Do you need help

with your host board? LSR Design Services will be

happy to develop custom hardware or software or

assist with integrating the design. Contact us at

sales@lsr.com

or call us at

262-375-4400.

The information in this document is subject to change without notice.

330-0190-R7.1

Page 1 of 66

Sterling-LWB Module

Datasheet

TABLE OF CONTENTS

FEATURES ................................................................................................................................... 1

APPLICATIONS ............................................................................................................................ 1

DESCRIPTION .............................................................................................................................. 1

TABLE OF CONTENTS ................................................................................................................... 2

MODULE VARIANTS .................................................................................................................... 5

FUNCTIONAL FEATURES .............................................................................................................. 8

WLAN Features ...................................................................................................................................................... 8

Bluetooth Features ................................................................................................................................................ 8

Wireless Security System Features ........................................................................................................................ 8

ORDERING INFORMATION .......................................................................................................... 9

MODULE ACCESSORIES................................................................................................................ 9

APPLICABLE DOCUMENTS ......................................................................................................... 10

BLOCK DIAGRAMS ..................................................................................................................... 11

BASE SIP MODULE FOOTPRINT AND PIN DEFINITIONS ............................................................... 14

BASE SIP MODULE PIN DESCRIPTIONS ....................................................................................... 15

U.FL AND CHIP ANTENNA MODULE FOOTPRINT AND PIN DEFINITIONS ...................................... 20

U.FL AND CHIP ANTENNA MODULE PIN DESCRIPTIONS .............................................................. 21

MODULE POWER STATES .......................................................................................................... 23

U.FL AND CHIP ANTENNA MODULE PIN I/O STATES ................................................................... 24

GENERAL CHARACTERISTICS ...................................................................................................... 27

WLAN Power Consumption.................................................................................................................................. 29

Bluetooth Power Consumption ............................................................................................................................ 29

Power Supply Requirements ................................................................................................................................ 30

Calibration Current Profile ................................................................................................................................... 31

CRYSTAL OSCILLATOR REQUIREMENTS ...................................................................................... 32

The information in this document is subject to change without notice.

330-0190-R7.1

Page 2 of 66

Sterling-LWB Module

Datasheet

CONTROL SIGNAL TIMING DIAGRAMS ....................................................................................... 33

WLAN RF Characteristics ...................................................................................................................................... 35

Bluetooth RF Characteristics ................................................................................................................................ 37

WLAN HOST INTERFACE ............................................................................................................ 38

SDIO Interface ..................................................................................................................................................... 38

BLUETOOTH UART HOST INTERFACE.......................................................................................... 40

Overview ............................................................................................................................................................. 40

Soldering Recommendations ............................................................................................................................... 41

Recommended Reflow Profile for Lead Free Solder ............................................................................................. 41

WIFI MAC IDS/BLUETOOTH MAC IDS ......................................................................................... 42

CLEANING ................................................................................................................................. 43

OPTICAL INSPECTION ................................................................................................................ 43

REWORK ................................................................................................................................... 43

SHIPPING, HANDLING, AND STORAGE ....................................................................................... 43

Shipping ............................................................................................................................................................... 43

Handling .............................................................................................................................................................. 43

Moisture Sensitivity Level (MSL) .......................................................................................................................... 43

Storage ................................................................................................................................................................ 43

Repeated Reflow Soldering .................................................................................................................................. 44

AGENCY CERTIFICATIONS .......................................................................................................... 45

AGENCY STATEMENTS ............................................................................................................... 45

Federal Communication Commission Interference Statement ............................................................................. 45

Industry Canada Statements ................................................................................................................................ 46

OEM RESPONSIBILITIES TO COMPLY WITH FCC AND INDUSTRY CANADA REGULATIONS............. 47

OEM LABELING REQUIREMENTS FOR END-PRODUCT ................................................................. 48

OEM END PRODUCT USER MANUAL STATEMENTS ..................................................................... 49

EUROPE .................................................................................................................................... 50

CE Notice ............................................................................................................................................................. 50

Declaration of Conformity (DOC) ......................................................................................................................... 50

The information in this document is subject to change without notice.

330-0190-R7.1

Page 3 of 66

Sterling-LWB Module

Datasheet

AUSTRALIA ............................................................................................................................... 50

RCM ..................................................................................................................................................................... 50

BLUETOOTH SIG QUALIFICATION ............................................................................................... 51

Overview ............................................................................................................................................................. 51

Qualification Steps When Referencing a Laird Controller Subsystem Design ....................................................... 51

Additional Assistance........................................................................................................................................... 52

BASE SIP MODULE MECHANICAL DATA ...................................................................................... 53

BASE SIP MODULE PCB FOOTPRINT ........................................................................................... 54

BASE SIP MODULE RECOMMENDED SOLDER STENCIL ................................................................ 55

BASE SIP MODULE TAPE AND REEL PACKAGING ......................................................................... 56

U.FL AND CHIP ANTENNA MECHANICAL DATA ........................................................................... 57

U.FL AND CHIP ANTENNA PCB FOOTPRINT ................................................................................ 58

U.FL AND CHIP ANTENNA TAPE AND REEL PACKAGING .............................................................. 59

DEVICE MARKINGS .................................................................................................................... 60

SiP Module .......................................................................................................................................................... 60

Antenna Option Modules .................................................................................................................................... 62

CONTACTING LSR ...................................................................................................................... 66

The information in this document is subject to change without notice.

330-0190-R7.1

Page 4 of 66

450-0152R相似产品对比

	450-0152R	450-0148C	450-0152C
描述	Telecom Circuit, 1-Func	Telecom Circuit, 1-Func	Telecom Circuit, 1-Func
是否Rohs认证	符合	符合	符合
厂商名称	Laird	Laird	Laird
包装说明	CHIP ANTENNA MODULE-47	UFL-47	CHIP ANTENNA MODULE-47
Reach Compliance Code	unknown	unknow	unknown
JESD-30 代码	R-XXMA-N47	R-XXMA-N47	R-XXMA-N47
长度	21 mm	21 mm	21 mm
湿度敏感等级	4	4	4
功能数量	1	1	1
端子数量	47	47	47
最高工作温度	85 °C	85 °C	85 °C
最低工作温度	-40 °C	-40 °C	-40 °C
封装主体材料	UNSPECIFIED	UNSPECIFIED	UNSPECIFIED
封装形状	RECTANGULAR	RECTANGULAR	RECTANGULAR
封装形式	MICROELECTRONIC ASSEMBLY	MICROELECTRONIC ASSEMBLY	MICROELECTRONIC ASSEMBLY
峰值回流温度（摄氏度）	245	245	245
座面最大高度	2.14 mm	2.14 mm	2.14 mm
标称供电电压	3.3 V	3.3 V	3.3 V
表面贴装	YES	YES	YES
电信集成电路类型	TELECOM CIRCUIT	TELECOM CIRCUIT	TELECOM CIRCUIT
温度等级	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL
端子形式	NO LEAD	NO LEAD	NO LEAD
端子位置	UNSPECIFIED	UNSPECIFIED	UNSPECIFIED
处于峰值回流温度下的最长时间	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED
宽度	15.5 mm	15.5 mm	15.5 mm

450-0152R

450-0152R在线购买

450-0152R概述

450-0152R规格参数

文档预览

450-0152R相似产品对比

推荐资源