IC PARALLEL, WORD INPUT LOADING, 1.5 us SETTLING TIME, 6-BIT DAC, CDIP14, HERMETIC SEALED, CERAMIC, DIP-14, Digital to Analog Converter
| 参数名称 | 属性值 |
| 是否Rohs认证 | 不符合 |
| 厂商名称 | ADI(亚德诺半导体) |
| 零件包装代码 | DIP |
| 包装说明 | HERMETIC SEALED, CERAMIC, DIP-14 |
| 针数 | 14 |
| Reach Compliance Code | unknown |
| 最大模拟输出电压 | 11.89 V |
| 最小模拟输出电压 | -11.89 V |
| 转换器类型 | D/A CONVERTER |
| 输入位码 | BINARY, 2\'S COMPLEMENT BINARY, 1\'S COMPLEMENT BINARY, COMPLEMENTARY OFFSET BINARY |
| 输入格式 | PARALLEL, WORD |
| JESD-30 代码 | R-GDIP-T14 |
| JESD-609代码 | e0 |
| 长度 | 19.43 mm |
| 最大线性误差 (EL) | 0.391% |
| 标称负供电电压 | -15 V |
| 位数 | 6 |
| 功能数量 | 1 |
| 端子数量 | 14 |
| 最高工作温度 | 70 °C |
| 最低工作温度 | |
| 封装主体材料 | CERAMIC, GLASS-SEALED |
| 封装代码 | DIP |
| 封装等效代码 | DIP14,.3 |
| 封装形状 | RECTANGULAR |
| 封装形式 | IN-LINE |
| 峰值回流温度（摄氏度） | NOT SPECIFIED |
| 电源 | +-15 V |
| 认证状态 | Not Qualified |
| 座面最大高度 | 5.08 mm |
| 最大稳定时间 | 3 µs |
| 标称安定时间 (tstl) | 1.5 µs |
| 最大压摆率 | 9.3 mA |
| 标称供电电压 | 15 V |
| 表面贴装 | NO |
| 技术 | BIPOLAR |
| 温度等级 | COMMERCIAL |
| 端子面层 | Tin/Lead (Sn/Pb) |
| 端子形式 | THROUGH-HOLE |
| 端子节距 | 2.54 mm |
| 端子位置 | DUAL |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED |
| 宽度 | 7.62 mm |
| DAC01HY | DAC01FY | DAC01G | DAC01CY | DAC01N | DAC01Y | |
|---|---|---|---|---|---|---|
| 描述 | IC PARALLEL, WORD INPUT LOADING, 1.5 us SETTLING TIME, 6-BIT DAC, CDIP14, HERMETIC SEALED, CERAMIC, DIP-14, Digital to Analog Converter | IC PARALLEL, WORD INPUT LOADING, 1.5 us SETTLING TIME, 6-BIT DAC, CDIP14, HERMETIC SEALED, CERAMIC, DIP-14, Digital to Analog Converter | IC PARALLEL, WORD INPUT LOADING, 1.5 us SETTLING TIME, 6-BIT DAC, UUC14, 0.093 X 0.055 INCH, DIE-14, Digital to Analog Converter | IC PARALLEL, WORD INPUT LOADING, 1.5 us SETTLING TIME, 6-BIT DAC, CDIP14, HERMETIC SEALED, CERAMIC, DIP-14, Digital to Analog Converter | IC PARALLEL, WORD INPUT LOADING, 1.5 us SETTLING TIME, 6-BIT DAC, UUC14, 0.093 X 0.055 INCH, DIE-14, Digital to Analog Converter | IC PARALLEL, WORD INPUT LOADING, 1.5 us SETTLING TIME, 6-BIT DAC, CDIP14, HERMETIC SEALED, CERAMIC, DIP-14, Digital to Analog Converter |
| 是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 |
| 零件包装代码 | DIP | DIP | DIE | DIP | DIE | DIP |
| 包装说明 | HERMETIC SEALED, CERAMIC, DIP-14 | HERMETIC SEALED, CERAMIC, DIP-14 | 0.093 X 0.055 INCH, DIE-14 | HERMETIC SEALED, CERAMIC, DIP-14 | 0.093 X 0.055 INCH, DIE-14 | HERMETIC SEALED, CERAMIC, DIP-14 |
| 针数 | 14 | 14 | 14 | 14 | 14 | 14 |
| Reach Compliance Code | unknown | not_compliant | compliant | unknown | compliant | compliant |
| 最大模拟输出电压 | 11.89 V | 11.89 V | 11.89 V | 11.89 V | 11.89 V | 11.89 V |
| 最小模拟输出电压 | -11.89 V | -11.89 V | -11.89 V | -11.89 V | -11.89 V | -11.89 V |
| 转换器类型 | D/A CONVERTER | D/A CONVERTER | D/A CONVERTER | D/A CONVERTER | D/A CONVERTER | D/A CONVERTER |
| 输入位码 | BINARY, 2\'S COMPLEMENT BINARY, 1\'S COMPLEMENT BINARY, COMPLEMENTARY OFFSET BINARY | BINARY, 2'S COMPLEMENT BINARY, 1'S COMPLEMENT BINARY, COMPLEMENTARY OFFSET BINARY | BINARY, 2\'S COMPLEMENT BINARY, 1\'S COMPLEMENT BINARY, COMPLEMENTARY OFFSET BINARY | BINARY, 2\'S COMPLEMENT BINARY, 1\'S COMPLEMENT BINARY, COMPLEMENTARY OFFSET BINARY | BINARY, 2\'S COMPLEMENT BINARY, 1\'S COMPLEMENT BINARY, COMPLEMENTARY OFFSET BINARY | BINARY, 2\'S COMPLEMENT BINARY, 1\'S COMPLEMENT BINARY, COMPLEMENTARY OFFSET BINARY |
| 输入格式 | PARALLEL, WORD | PARALLEL, WORD | PARALLEL, WORD | PARALLEL, WORD | PARALLEL, WORD | PARALLEL, WORD |
| JESD-30 代码 | R-GDIP-T14 | R-GDIP-T14 | R-XUUC-N14 | R-GDIP-T14 | R-XUUC-N14 | R-GDIP-T14 |
| JESD-609代码 | e0 | e0 | e0 | e0 | e0 | e0 |
| 标称负供电电压 | -15 V | -15 V | -15 V | -15 V | -15 V | -15 V |
| 位数 | 6 | 6 | 6 | 6 | 6 | 6 |
| 功能数量 | 1 | 1 | 1 | 1 | 1 | 1 |
| 端子数量 | 14 | 14 | 14 | 14 | 14 | 14 |
| 封装主体材料 | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED | UNSPECIFIED | CERAMIC, GLASS-SEALED | UNSPECIFIED | CERAMIC, GLASS-SEALED |
| 封装代码 | DIP | DIP | DIE | DIP | DIE | DIP |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | IN-LINE | IN-LINE | UNCASED CHIP | IN-LINE | UNCASED CHIP | IN-LINE |
| 峰值回流温度（摄氏度） | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 标称安定时间 (tstl) | 1.5 µs | 1.5 µs | 1.5 µs | 1.5 µs | 1.5 µs | 1.5 µs |
| 标称供电电压 | 15 V | 15 V | 15 V | 15 V | 15 V | 15 V |
| 表面贴装 | NO | NO | YES | NO | YES | NO |
| 技术 | BIPOLAR | BIPOLAR | BIPOLAR | BIPOLAR | BIPOLAR | BIPOLAR |
| 端子面层 | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | TIN LEAD | Tin/Lead (Sn/Pb) | TIN LEAD | TIN LEAD |
| 端子形式 | THROUGH-HOLE | THROUGH-HOLE | NO LEAD | THROUGH-HOLE | NO LEAD | THROUGH-HOLE |
| 端子位置 | DUAL | DUAL | UPPER | DUAL | UPPER | DUAL |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| 厂商名称 | ADI(亚德诺半导体) | - | ADI(亚德诺半导体) | ADI(亚德诺半导体) | ADI(亚德诺半导体) | ADI(亚德诺半导体) |
| 长度 | 19.43 mm | 19.43 mm | - | 19.43 mm | - | 19.43 mm |
| 最大线性误差 (EL) | 0.391% | 0.391% | - | 0.391% | - | 0.391% |
| 最高工作温度 | 70 °C | 125 °C | - | 70 °C | - | 125 °C |
| 座面最大高度 | 5.08 mm | 5.08 mm | - | 5.08 mm | - | 5.08 mm |
| 最大稳定时间 | 3 µs | 3 µs | - | 3 µs | - | 3 µs |
| 最大压摆率 | 9.3 mA | 9.3 mA | - | 9.3 mA | - | 9.3 mA |
| 温度等级 | COMMERCIAL | MILITARY | - | COMMERCIAL | - | MILITARY |
| 端子节距 | 2.54 mm | 2.54 mm | - | 2.54 mm | - | 2.54 mm |
| 宽度 | 7.62 mm | 7.62 mm | - | 7.62 mm | - | 7.62 mm |
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