8.0Amps
Glass Passivated
Single Phase Silicon Bridge
Machamical Dimensions
Descriptions
3.85
+
0.25
2
21.9
+
0.5
4.4
+
0.2
1.95
+
0.25
18.6
+
0.3
20.4
+
0.3
4.2
+
0.2
GBU800~812
_
1.9 R. TYP.
(2PLACES)
~ ~ +
10.8
+
0.5
3.4
+
0.2
16.0
+
0.4
1.3
+
0.2
GBU
5.1
+
0.5
Dimensions in millimeters(1mm =0.0394＂）
Features
Ideal for P.C. Board mounting
High surge current capability
This series is UL listed under the Recognized
Component Index, file number E142814
The plastic material used carries Underwriters
Laboratory flammability recognition 94V-0
High temperature soldering guaranteed 265 C /10
seconds at 5 lbs (2.3kg) tension
Mechanical Data
Case: Molded plastic body
Terminals: Plated leads solderable per MIL-STD-202,
Method 208
Mounting Position:: Any
Weight: 3.8 grams (approx)
Maximum Ratings & Thermal Characteristics
Rating at 25 C ambient temperature unless otherwise specified, Resistive or Inductive load, 60 Hz.
For Capacitive load derate current by 20%.
GBU
Parameter
Symbol
GBU GBU GBU GBU GBU GBU GBU 812
unit
800
801 802
804
806 808 810
V
RRM
100 200
400
600 800 1000 1200 V
50
Maximum repetitive peak reverse voltage
Maximum RMS bridge input voltage
Maximum DC blocking voltage
Maximum average forward rectified
output current at T
A
=100 C
Peak forward surge current single sine-wave
superimposed on rated load (JEDEC Method)
Rating for fusing ( t<8.3ms)
Typical thermal resistance per element
(1)
Operating junction and storage temperature
range
Max. instantaneous forward voltage drop
per leg at 6.0A
Max. DC reverse current at rated Ta=25C
Max. DC reverse current at rated Ta=125C
V
RMS
V
DC
I
F(AV)
I
FSM
I t
R
eJA
T
J
,
T
STG
VF
IR
IR
2
35
50
70
100
140
200
280
400
8.0
200
166
2.2
420
600
560
800
700
840
V
V
A
A
A
sec
C/W
2
1000 1200
-55 to + 150
1.1
5.0
500
V
uA
uA
Notes: Thermal resistance from Junction to Ambient on PC board mounting
8.0Amps
Glass Passivated
Single Phase Silicon Bridge
Rating and Characteristic Curves
( TA=25
C
Unless otherwise noted )
GBU800 thru GBU810
o
Fig. 1 Derating Curve for
Output Rectified Current
Average Forward Output
Current, Amperes
Heat Sink
mounting, Tc
Fig. 2 Maximum Non-repetitive Peak
Forward Surge Current
Peak Forward Surge Current,
Amperes
300
250
200
150
100
50
1
10
100
8.3ms
Single half-sine-Wave
[JEDEC Method]
8.0
6.0
4.0
2.0
60Hz Resistive of
Inductive Load
Mounted on 4X4 inch
copper PC board, TA
1.27 mm lead length
Number of Cycles at 60HZ
100
o
0
0
50
150
Case Temperature, C
10
Fig. 4 Typical Reverse
Characteristics
Instantaneous Reverse
Current ,Amperes
Fig. 3 Typical Instantaneous
Forward Characteristics
100
40
20
10
4.0
1.0
Tc=100 C
1.0
Instantaneous Forward Current,
Amperes
0.1
TA=25 C
.01
0
20
40
60
80
100
120
140
Percent of Rated Peak Reverse
Voltage, %
0.1
Tj=25 C
Pulse Width=300us
2% duty cycle
Fig. 5 Typical Junction Capacitance
1.2
1.3
400
.01
0.6
0.7
0.8
0.9
1.0
1.1
Capacitance, pF
Instantaneous Forward
Voltage, Volts
100
50
Tj=25 C
f=1.0MHz
V
ing
=50mV p.p.
10
1
1.5
2
10
100
Reverse Voltage, Volts
2003 SEP ELECTRONIC CORP.
www.sep.net.cn
M099
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