Microcontroller, 8-Bit, 8051 CPU, 16MHz, CMOS, PQFP44
| 参数名称 | 属性值 |
| 是否Rohs认证 | 不符合 |
| 厂商名称 | Philips Semiconductors (NXP Semiconductors N.V.) |
| 包装说明 | QFP, QFP44,.5SQ,32 |
| Reach Compliance Code | unknown |
| 位大小 | 8 |
| CPU系列 | 8051 |
| JESD-30 代码 | S-PQFP-G44 |
| JESD-609代码 | e0 |
| 端子数量 | 44 |
| 最高工作温度 | 85 °C |
| 最低工作温度 | -40 °C |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | QFP |
| 封装等效代码 | QFP44,.5SQ,32 |
| 封装形状 | SQUARE |
| 封装形式 | FLATPACK |
| 电源 | 5 V |
| 认证状态 | Not Qualified |
| RAM（字节） | 256 |
| ROM（单词） | 0 |
| 速度 | 16 MHz |
| 最大压摆率 | 32 mA |
| 标称供电电压 | 5 V |
| 表面贴装 | YES |
| 技术 | CMOS |
| 温度等级 | INDUSTRIAL |
| 端子面层 | Tin/Lead (Sn/Pb) |
| 端子形式 | GULL WING |
| 端子节距 | 0.8 mm |
| 端子位置 | QUAD |
| P80C34EFB | P80C54EBBD | P80C34EBBD | P80C34EBP | P80C34IBA | P87C54EBBD | P87C54EBP | P87C54IBA | P87C54IBBD | |
|---|---|---|---|---|---|---|---|---|---|
| 描述 | Microcontroller, 8-Bit, 8051 CPU, 16MHz, CMOS, PQFP44 | Microcontroller, 8-Bit, MROM, 8051 CPU, 16MHz, CMOS, PQFP44 | Microcontroller, 8-Bit, 8051 CPU, 16MHz, CMOS, PQFP44 | Microcontroller, 8-Bit, 8051 CPU, 16MHz, CMOS, PDIP40 | Microcontroller, 8-Bit, 8051 CPU, 24MHz, CMOS, PQCC44 | Microcontroller, 8-Bit, UVPROM, 8051 CPU, 16MHz, CMOS, PQFP44 | Microcontroller, 8-Bit, UVPROM, 8051 CPU, 16MHz, CMOS, PDIP40 | Microcontroller, 8-Bit, UVPROM, 8051 CPU, 24MHz, CMOS, PQCC44 | Microcontroller, 8-Bit, UVPROM, 8051 CPU, 24MHz, CMOS, PQFP44 |
| 是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 |
| 厂商名称 | Philips Semiconductors (NXP Semiconductors N.V.) | Philips Semiconductors (NXP Semiconductors N.V.) | Philips Semiconductors (NXP Semiconductors N.V.) | Philips Semiconductors (NXP Semiconductors N.V.) | Philips Semiconductors (NXP Semiconductors N.V.) | Philips Semiconductors (NXP Semiconductors N.V.) | Philips Semiconductors (NXP Semiconductors N.V.) | Philips Semiconductors (NXP Semiconductors N.V.) | Philips Semiconductors (NXP Semiconductors N.V.) |
| 包装说明 | QFP, QFP44,.5SQ,32 | QFP, QFP44,.5SQ,32 | QFP, QFP44,.5SQ,32 | DIP, DIP40,.6 | QCCJ, LDCC44,.7SQ | QFP, QFP44,.5SQ,32 | DIP, DIP40,.6 | QCCJ, LDCC44,.7SQ | QFP, QFP44,.5SQ,32 |
| Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown | unknown | unknown | unknown |
| 位大小 | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 |
| CPU系列 | 8051 | 8051 | 8051 | 8051 | 8051 | 8051 | 8051 | 8051 | 8051 |
| JESD-30 代码 | S-PQFP-G44 | S-PQFP-G44 | S-PQFP-G44 | R-PDIP-T40 | S-PQCC-J44 | S-PQFP-G44 | R-PDIP-T40 | S-PQCC-J44 | S-PQFP-G44 |
| JESD-609代码 | e0 | e0 | e0 | e0 | e0 | e0 | e0 | e0 | e0 |
| 端子数量 | 44 | 44 | 44 | 40 | 44 | 44 | 40 | 44 | 44 |
| 最高工作温度 | 85 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | QFP | QFP | QFP | DIP | QCCJ | QFP | DIP | QCCJ | QFP |
| 封装等效代码 | QFP44,.5SQ,32 | QFP44,.5SQ,32 | QFP44,.5SQ,32 | DIP40,.6 | LDCC44,.7SQ | QFP44,.5SQ,32 | DIP40,.6 | LDCC44,.7SQ | QFP44,.5SQ,32 |
| 封装形状 | SQUARE | SQUARE | SQUARE | RECTANGULAR | SQUARE | SQUARE | RECTANGULAR | SQUARE | SQUARE |
| 封装形式 | FLATPACK | FLATPACK | FLATPACK | IN-LINE | CHIP CARRIER | FLATPACK | IN-LINE | CHIP CARRIER | FLATPACK |
| 电源 | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| RAM（字节） | 256 | 256 | 256 | 256 | 256 | 256 | 256 | 256 | 256 |
| ROM（单词） | - | 16384 | - | - | - | 16384 | 16384 | 16384 | 16384 |
| 速度 | 16 MHz | 16 MHz | 16 MHz | 16 MHz | 24 MHz | 16 MHz | 16 MHz | 24 MHz | 24 MHz |
| 最大压摆率 | 32 mA | 32 mA | 32 mA | 32 mA | 44 mA | 32 mA | 32 mA | 44 mA | 44 mA |
| 标称供电电压 | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| 表面贴装 | YES | YES | YES | NO | YES | YES | NO | YES | YES |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | INDUSTRIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL |
| 端子面层 | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| 端子形式 | GULL WING | GULL WING | GULL WING | THROUGH-HOLE | J BEND | GULL WING | THROUGH-HOLE | J BEND | GULL WING |
| 端子节距 | 0.8 mm | 0.8 mm | 0.8 mm | 2.54 mm | 1.27 mm | 0.8 mm | 2.54 mm | 1.27 mm | 0.8 mm |
| 端子位置 | QUAD | QUAD | QUAD | DUAL | QUAD | QUAD | DUAL | QUAD | QUAD |
| ROM可编程性 | - | MROM | - | - | - | UVPROM | UVPROM | UVPROM | UVPROM |
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