Fixed-Point Digital Signal Processor 532-FCBGA 0 to 90
| 参数名称 | 属性值 |
| Brand Name | Texas Instruments |
| 零件包装代码 | BGA |
| 包装说明 | HFBGA, BGA532,26X26,32 |
| 针数 | 532 |
| Reach Compliance Code | _compli |
| ECCN代码 | 3A991.A.2 |
| Factory Lead Time | 1 week |
| Is Samacsys | N |
| 其他特性 | ALSO REQUIRES 3.3V SUPPLY |
| 地址总线宽度 | 23 |
| 桶式移位器 | NO |
| 位大小 | 32 |
| 边界扫描 | YES |
| 最大时钟频率 | 75 MHz |
| 外部数据总线宽度 | 64 |
| 格式 | FIXED POINT |
| 集成缓存 | YES |
| 内部总线架构 | MULTIPLE |
| JESD-30 代码 | S-PBGA-B532 |
| JESD-609代码 | e0 |
| 长度 | 23 mm |
| 低功率模式 | YES |
| 湿度敏感等级 | 4 |
| DMA 通道数量 | 64 |
| 外部中断装置数量 | 4 |
| 端子数量 | 532 |
| 计时器数量 | 3 |
| 片上程序ROM宽度 | 8 |
| 最高工作温度 | 90 °C |
| 最低工作温度 | |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | HFBGA |
| 封装等效代码 | BGA532,26X26,32 |
| 封装形状 | SQUARE |
| 封装形式 | GRID ARRAY, HEAT SINK/SLUG, FINE PITCH |
| 峰值回流温度（摄氏度） | 220 |
| 电源 | 1.1,3.3 V |
| 认证状态 | Not Qualified |
| RAM（字数） | 262144 |
| ROM可编程性 | FLASH |
| 座面最大高度 | 3.25 mm |
| 最大供电电压 | 1.24 V |
| 最小供电电压 | 1.16 V |
| 标称供电电压 | 1.2 V |
| 表面贴装 | YES |
| 技术 | CMOS |
| 温度等级 | OTHER |
| 端子面层 | Tin/Lead (Sn/Pb) |
| 端子形式 | BALL |
| 端子节距 | 0.8 mm |
| 端子位置 | BOTTOM |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED |
| 宽度 | 23 mm |
| uPs/uCs/外围集成电路类型 | DIGITAL SIGNAL PROCESSOR, OTHER |
| Base Number Matches | 1 |
| TMS320C6415TBGLZ6 | TMS320C6414TBGLZ7 | TMS320C6414TBGLZA6 | TMS320C6414TBZLZ1 | TMS320C6415TBGLZ1 | TMS320C6415TBGLZA8 | TMS320C6415TBZLZ1 | TMS320C6415TBZLZ6 | TMS320C6415TBZLZA8 | TMS320C6416TBZLZ7 | |
|---|---|---|---|---|---|---|---|---|---|---|
| 描述 | Fixed-Point Digital Signal Processor 532-FCBGA 0 to 90 | Fixed-Point Digital Signal Processor 532-FCBGA 0 to 90 | Fixed-Point Digital Signal Processor 532-FCBGA -40 to 105 | Fixed-Point Digital Signal Processor 532-FCBGA 0 to 90 | Fixed-Point Digital Signal Processor 532-FCBGA 0 to 90 | Fixed-Point Digital Signal Processor 532-FCBGA -40 to 105 | Digital Signal Processors & Controllers - DSP, DSC Fixed-Pt Dig Sig Proc | Digital Signal Processors & Controllers - DSP, DSC Fixed-Pt Dig Sig Proc | Digital Signal Processors & Controllers - DSP, DSC Fixed-Pt Dig Signal Processor | Fixed-Point Digital Signal Processor 532-FCBGA 0 to 90 |
| Brand Name | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments |
| 零件包装代码 | BGA | BGA | BGA | BGA | BGA | BGA | BGA | BGA | BGA | BGA |
| 包装说明 | HFBGA, BGA532,26X26,32 | HFBGA, BGA532,26X26,32 | HFBGA, BGA532,26X26,32 | FBGA, BGA532,26X26,32 | HFBGA, BGA532,26X26,32 | HFBGA, BGA532,26X26,32 | FBGA, BGA532,26X26,32 | FBGA, BGA532,26X26,32 | FBGA, BGA532,26X26,32 | BGA-532 |
| 针数 | 532 | 532 | 532 | 532 | 532 | 532 | 532 | 532 | 532 | 532 |
| Reach Compliance Code | _compli | _compli | _compli | unknow | _compli | _compli | unknow | unknow | unknow | unknown |
| ECCN代码 | 3A991.A.2 | 3A991.A.2 | 3A991.A.2 | 3A001.A.3 | 3A991.A.2 | 3A991.A.2 | 3A001.A.3 | 3A001.A.3 | 3A001.A.3 | 3A001.A.3 |
| 其他特性 | ALSO REQUIRES 3.3V SUPPLY | ALSO REQUIRES 3.3V SUPPLY | ALSO REQUIRES 3.3V SUPPLY | ALSO REQUIRES 3.3V SUPPLY | ALSO REQUIRES 3.3V SUPPLY | ALSO REQUIRES 3.3V SUPPLY | ALSO REQUIRES 3.3V SUPPLY | ALSO REQUIRES 3.3V SUPPLY | ALSO REQUIRES 3.3V SUPPLY | ALSO REQUIRES 3.3V SUPPLY |
| 地址总线宽度 | 23 | 23 | 23 | 23 | 23 | 23 | 23 | 23 | 23 | 23 |
| 桶式移位器 | NO | NO | NO | NO | NO | NO | NO | NO | NO | NO |
| 位大小 | 32 | 32 | 32 | 32 | 32 | 32 | 32 | 32 | 32 | 32 |
| 边界扫描 | YES | YES | YES | YES | YES | YES | YES | YES | YES | YES |
| 最大时钟频率 | 75 MHz | 75 MHz | 75 MHz | 75 MHz | 75 MHz | 75 MHz | 75 MHz | 75 MHz | 75 MHz | 75 MHz |
| 外部数据总线宽度 | 64 | 64 | 64 | 64 | 64 | 64 | 64 | 64 | 64 | 64 |
| 格式 | FIXED POINT | FIXED POINT | FIXED POINT | FIXED POINT | FIXED POINT | FIXED POINT | FIXED POINT | FIXED POINT | FIXED POINT | FIXED POINT |
| 内部总线架构 | MULTIPLE | MULTIPLE | MULTIPLE | MULTIPLE | MULTIPLE | MULTIPLE | MULTIPLE | MULTIPLE | MULTIPLE | MULTIPLE |
| JESD-30 代码 | S-PBGA-B532 | S-PBGA-B532 | S-PBGA-B532 | S-PBGA-B532 | S-PBGA-B532 | S-PBGA-B532 | S-PBGA-B532 | S-PBGA-B532 | S-PBGA-B532 | S-PBGA-B532 |
| JESD-609代码 | e0 | e0 | e0 | e1 | e0 | e0 | e1 | e1 | e1 | e1 |
| 长度 | 23 mm | 23 mm | 23 mm | 23 mm | 23 mm | 23 mm | 23 mm | 23 mm | 23 mm | 23 mm |
| 低功率模式 | YES | YES | YES | YES | YES | YES | YES | YES | YES | YES |
| 湿度敏感等级 | 4 | 4 | 4 | 4 | 4 | 4 | 4 | 4 | 4 | 4 |
| 端子数量 | 532 | 532 | 532 | 532 | 532 | 532 | 532 | 532 | 532 | 532 |
| 最高工作温度 | 90 °C | 90 °C | 105 °C | 90 °C | 90 °C | 105 °C | 90 °C | 90 °C | 105 °C | 90 °C |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | HFBGA | HFBGA | HFBGA | FBGA | HFBGA | HFBGA | FBGA | FBGA | FBGA | FBGA |
| 封装等效代码 | BGA532,26X26,32 | BGA532,26X26,32 | BGA532,26X26,32 | BGA532,26X26,32 | BGA532,26X26,32 | BGA532,26X26,32 | BGA532,26X26,32 | BGA532,26X26,32 | BGA532,26X26,32 | BGA532,26X26,32 |
| 封装形状 | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE |
| 封装形式 | GRID ARRAY, HEAT SINK/SLUG, FINE PITCH | GRID ARRAY, HEAT SINK/SLUG, FINE PITCH | GRID ARRAY, HEAT SINK/SLUG, FINE PITCH | GRID ARRAY, FINE PITCH | GRID ARRAY, HEAT SINK/SLUG, FINE PITCH | GRID ARRAY, HEAT SINK/SLUG, FINE PITCH | GRID ARRAY, FINE PITCH | GRID ARRAY, FINE PITCH | GRID ARRAY, FINE PITCH | GRID ARRAY, FINE PITCH |
| 峰值回流温度（摄氏度） | 220 | 220 | 220 | 260 | 220 | 220 | 260 | 260 | 260 | 260 |
| 电源 | 1.1,3.3 V | 1.2,3.3 V | 1.2,3.3 V | 1.1,3.3 V | 1.1,3.3 V | 1.1,3.3 V | 1.1,3.3 V | 1.1,3.3 V | 1.2,3.3 V | 1.2,3.3 V |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| RAM（字数） | 262144 | 16384 | 16384 | 262144 | 262144 | 262144 | 262144 | 262144 | 16384 | 16384 |
| 座面最大高度 | 3.25 mm | 3.25 mm | 3.25 mm | 3.25 mm | 3.25 mm | 3.25 mm | 3.25 mm | 3.25 mm | 3.25 mm | 3.25 mm |
| 最大供电电压 | 1.24 V | 1.24 V | 1.16 V | 1.24 V | 1.16 V | 1.24 V | 1.16 V | 1.24 V | 1.24 V | 1.24 V |
| 最小供电电压 | 1.16 V | 1.16 V | 1.05 V | 1.16 V | 1.05 V | 1.16 V | 1.05 V | 1.16 V | 1.16 V | 1.16 V |
| 标称供电电压 | 1.2 V | 1.2 V | 1.1 V | 1.2 V | 1.1 V | 1.2 V | 1.1 V | 1.2 V | 1.2 V | 1.2 V |
| 表面贴装 | YES | YES | YES | YES | YES | YES | YES | YES | YES | YES |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | OTHER | OTHER | INDUSTRIAL | OTHER | OTHER | INDUSTRIAL | OTHER | OTHER | INDUSTRIAL | OTHER |
| 端子面层 | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Silver/Copper (Sn/Ag/Cu) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Silver/Copper (Sn/Ag/Cu) | Tin/Silver/Copper (Sn/Ag/Cu) | Tin/Silver/Copper (Sn/Ag/Cu) | Tin/Silver/Copper (Sn/Ag/Cu) |
| 端子形式 | BALL | BALL | BALL | BALL | BALL | BALL | BALL | BALL | BALL | BALL |
| 端子节距 | 0.8 mm | 0.8 mm | 0.8 mm | 0.8 mm | 0.8 mm | 0.8 mm | 0.8 mm | 0.8 mm | 0.8 mm | 0.8 mm |
| 端子位置 | BOTTOM | BOTTOM | BOTTOM | BOTTOM | BOTTOM | BOTTOM | BOTTOM | BOTTOM | BOTTOM | BOTTOM |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| 宽度 | 23 mm | 23 mm | 23 mm | 23 mm | 23 mm | 23 mm | 23 mm | 23 mm | 23 mm | 23 mm |
| uPs/uCs/外围集成电路类型 | DIGITAL SIGNAL PROCESSOR, OTHER | DIGITAL SIGNAL PROCESSOR, OTHER | DIGITAL SIGNAL PROCESSOR, OTHER | DIGITAL SIGNAL PROCESSOR, OTHER | DIGITAL SIGNAL PROCESSOR, OTHER | DIGITAL SIGNAL PROCESSOR, OTHER | DIGITAL SIGNAL PROCESSOR, OTHER | DIGITAL SIGNAL PROCESSOR, OTHER | DIGITAL SIGNAL PROCESSOR, OTHER | DIGITAL SIGNAL PROCESSOR, OTHER |
| Factory Lead Time | 1 week | 1 week | 1 week | - | 1 week | 1 week | - | 1 week | 1 week | - |
| Base Number Matches | 1 | 1 | 1 | - | 1 | 1 | 1 | - | - | 1 |
| 厂商名称 | - | - | - | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | - | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) |
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