F-219
QTE–014–01–F–D–DP–A
®
QTE–040–01–L–D–A
QTE–060–01–L–D–A
(0.80 mm) .0315"
QTE SERIES
HIGH-SPEED GROUND PLANE HEADER
SPECIFICATIONS
For complete specifications and
recommended PCB layouts see
www.samtec.com?QTE
Insulator Material:
Liquid Crystal Polymer
Terminal Material:
Phosphor Bronze
Plating:
Au or Sn over
50 µ" (1.27 µm) Ni
Current Rating:
Contact:
2 A per pin
(2 pins powered)
Ground Plane:
23 A per ground plane
(1 ground plane powered)
Operating Temp Range:
-55 °C to +125 °C
Voltage Rating:
225 VAC mated with QSE
& 5 mm Stack Height
Max Cycles:
100
RoHS Compliant:
Yes
Board Mates:
QSE
Cable Mates:
EQCD, EQDP
(See Also Available Note)
Standoffs:
SO
Integral metal plane
for power or ground
Standard stack heights
from 5 mm to 25 mm
POWER/SIGNAL
APPLICATION
HIGH-SPEED CHANNEL PERFORMANCE
QTE-D/QSE-D or QTE-DP/QSE-DP
@ 5 mm Mated Stack Height
Rating based on Samtec reference
channel.For full SI performance
data visit Samtec.comor contact
SIG@samtec.com
QTE-D/QSE-D
Compatible with
UMPT/UMPS for flexible
two-piece power/signal solutions
14 28
G b p s
G b p s
QTE-DP/QSE-DP
EXTENDED LIFE
PRODUCT
HIGH MATING
CYCLES
10 YEAR MFG
WITH 50 µ" GOLD
PROCESSING
Lead–Free Solderable:
Yes
SMT Lead Coplanarity:
(0.10 mm) .004" max (020-060)
Board Stacking:
For applications requiring
more than two connectors per
board contact ipg@samtec.com
QTE
PINS PER ROW
NO. OF PAIRS
LEAD
STYLE
Specify
LEAD
STYLE
from
chart
PLATING
OPTION
TYPE
A
OTHER
OPTION
1-DH1
(40 total pins per bank = –D)
–020, –040, –060
–014, –028, –042
(14 pairs per bank = –D–DP)
RECOGNITIONS
For complete scope of
recognitions see
www.samtec.com/quality
= Gold Flash on
Signal Pins and
Ground Plane,
Matte Tin on tails
= 10 µ" (0.25 µm)
Gold on Signal Pins
and Ground Plane,
Matte Tin on tails
–F
= Single-Ended
–D
–L
= Differential Pair
(–01 only)
–D–DP
= (7.00 mm)
.275" DIA
Polyimide
Film Pick &
Place Pad
–K
–D–DP = (No. of Positions per Row/14)
x (20.00) .7875
FILE NO. E111594
ALSO AVAILABLE
(MOQ Required)
• 15 mm, 22 mm and
30 mm stack height
• 30 µ" (0.76 µm) Gold
(Specify -H plating for
Data Rate cable mating
applications.)
• Edge Mount, Guide Posts,
Screw Down & Friction Lock
• 56 (-DP), 80, 100
positions per row
• Retention Option
01
–D = (No. of Positions per Row/20)
x (20.00) .7875
(20.00) .7875
= Tape & Reel
Packaging
(N/A –05 & –07
lead style)
–TR
(5.97)
.235
02
(0.80)
.0315
(0.20)
.008
A
= Electro-Polished
Selective
(7.11)
.280
50 µ" (1.27 µm) min
Au over 150µ"
(3.81 µm) Ni on Signal
Pins in contact area,
10 µ" (0.25 µm) min
Au over 50 µ" (1.27 µm)
Ni on Ground Plane
in contact area,
Matte Tin over 50µ"
(1.27 µm) min Ni on
all solder tails
*Note:
–C Plating passes
10 year MFG testing
–C*
= Latching
Option
(N/A on –042 &
–060 positions)
QTE
LEAD
STYLE
–L
A
(4.27) .168
(7.26) .286
HEIGHT
WITH QSE*
(5.00) .197
(8.00) .315
(0.76)
.030
(0.89)
.035 DIA
(0.64)
.025
–01
–02
–03
–04
–05
–07
–09
(10.27) .404 (11.00) .433
(15.25) .600 (16.00) .630
(18.26) .718 (19.00) .748
(24.24) .954 (25.00) .984
(13.26) .522 (14.00) .551
Note:
Some lengths, styles and
options are non-standard,
non-returnable.
–L
*Processing conditions will affect
mated height. See SO Series for
board space tolerances
Due to technical progress, all designs, specifications and components are subject to change without notice.
All parts within this catalog are built to Samtec’s specifications.
Customer specific requirements must be approved by Samtec and identified in a Samtec customer-specific drawing to apply.
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