电子工程世界电子工程世界电子工程世界

关键词

搜索

型号

搜索

VP2106N3-GP013

产品描述SMALL SIGNAL, FET
产品类别分立半导体    晶体管   
文件大小626KB,共5页
制造商Microchip(微芯科技)
官网地址https://www.microchip.com
标准
下载文档 详细参数 选型对比 全文预览

VP2106N3-GP013概述

SMALL SIGNAL, FET

VP2106N3-GP013规格参数

参数名称属性值
是否Rohs认证符合
厂商名称Microchip(微芯科技)
Reach Compliance Codecompliant
其他特性HIGH INPUT IMPEDANCE
配置SINGLE WITH BUILT-IN DIODE
最小漏源击穿电压60 V
最大漏极电流 (ID)0.25 A
最大漏源导通电阻12 Ω
FET 技术METAL-OXIDE SEMICONDUCTOR
最大反馈电容 (Crss)8 pF
JEDEC-95代码TO-92
JESD-30 代码O-PBCY-T3
元件数量1
端子数量3
工作模式ENHANCEMENT MODE
最高工作温度150 °C
最低工作温度-55 °C
封装主体材料PLASTIC/EPOXY
封装形状ROUND
封装形式CYLINDRICAL
极性/信道类型P-CHANNEL
最大功率耗散 (Abs)1 W
表面贴装NO
端子形式THROUGH-HOLE
端子位置BOTTOM
晶体管应用SWITCHING
晶体管元件材料SILICON

文档预览

下载PDF文档
Supertex inc.
P-Channel Enhancement-Mode
Vertical DMOS FETs
Features
Free from secondary breakdown
Low power drive requirement
Ease of paralleling
Low C
ISS
and fast switching speeds
Excellent thermal stability
VP2106
General Description
Integral source-drain diode
High input impedance and high gain
Applications
Converters
Amplifiers
Switches
This enhancement-mode (normally-off) transistor utilizes
a vertical DMOS structure and Supertex’s well-proven,
silicon-gate manufacturing process. This combination
produces a device with the power handling capabilities
of bipolar transistors and the high input impedance and
positive temperature coefficient inherent in MOS devices.
Characteristic of all MOS structures, this device is free
from thermal runaway and thermally-induced secondary
breakdown.
Supertex’s vertical DMOS FETs are ideally suited to a
wide range of switching and amplifying applications where
very low threshold voltage, high breakdown voltage, high
input impedance, low input capacitance, and fast switching
speeds are desired.
Motor controls
Power supply circuits
Drivers (relays, hammers, solenoids, lamps, memories,
displays, bipolar transistors, etc.)
Ordering Information
Part Number
VP2106N3-G
VP2106N3-G P002
VP2106N3-G P003
VP2106N3-G P005
VP2106N3-G P013
VP2106N3-G P014
-G denotes a lead (Pb)-free / RoHS compliant package.
Contact factory for Wafer / Die availablity.
Devices in Wafer / Die form are lead (Pb)-free / RoHS compliant.
Package Option
TO-92
Packing
1000/Bag
Product Summary
BV
DSS
/BV
DGS
-60V
R
DS(ON)
(max)
I
D(ON)
(min)
12Ω
-500mA
TO-92
2000/Reel
Pin Configuration
DRAIN
SOURCE
Absolute Maximum Ratings
Parameter
Drain-to-source voltage
Drain-to-gate voltage
Gate-to-source voltage
Operating and storage temperature
Value
BV
DSS
BV
DGS
±20V
-55
O
C to +150
O
C
GATE
TO-92
Product Marking
SiVP
2106
YYWW
YY = Year Sealed
WW = Week Sealed
= “Green” Packaging
TO-92
Absolute Maximum Ratings are those values beyond which damage to the device may
occur. Functional operation under these conditions is not implied. Continuous operation
of the device at the absolute rating level may affect device reliability. All voltages are
referenced to device ground.
Typical Thermal Resistance
Package
TO-92
θ
ja
132
O
C/W
Package may or may not include the following marks: Si or
Doc.# DSFP-VP2106
C082313
Supertex inc.
www.supertex.com

VP2106N3-GP013相似产品对比

VP2106N3-GP013 VP2106N3-GP014 VP2106N3-GP005 VP2106N3-GP003 VP2106N3-GP002
描述 SMALL SIGNAL, FET SMALL SIGNAL, FET SMALL SIGNAL, FET SMALL SIGNAL, FET SMALL SIGNAL, FET
是否Rohs认证 符合 符合 符合 符合 符合
厂商名称 Microchip(微芯科技) Microchip(微芯科技) Microchip(微芯科技) Microchip(微芯科技) Microchip(微芯科技)
Reach Compliance Code compliant compliant compliant compliant compliant
其他特性 HIGH INPUT IMPEDANCE HIGH INPUT IMPEDANCE HIGH INPUT IMPEDANCE HIGH INPUT IMPEDANCE HIGH INPUT IMPEDANCE
配置 SINGLE WITH BUILT-IN DIODE SINGLE WITH BUILT-IN DIODE SINGLE WITH BUILT-IN DIODE SINGLE WITH BUILT-IN DIODE SINGLE WITH BUILT-IN DIODE
最小漏源击穿电压 60 V 60 V 60 V 60 V 60 V
最大漏极电流 (ID) 0.25 A 0.25 A 0.25 A 0.25 A 0.25 A
最大漏源导通电阻 12 Ω 12 Ω 12 Ω 12 Ω 12 Ω
FET 技术 METAL-OXIDE SEMICONDUCTOR METAL-OXIDE SEMICONDUCTOR METAL-OXIDE SEMICONDUCTOR METAL-OXIDE SEMICONDUCTOR METAL-OXIDE SEMICONDUCTOR
最大反馈电容 (Crss) 8 pF 8 pF 8 pF 8 pF 8 pF
JEDEC-95代码 TO-92 TO-92 TO-92 TO-92 TO-92
JESD-30 代码 O-PBCY-T3 O-PBCY-T3 O-PBCY-T3 O-PBCY-T3 O-PBCY-T3
元件数量 1 1 1 1 1
端子数量 3 3 3 3 3
工作模式 ENHANCEMENT MODE ENHANCEMENT MODE ENHANCEMENT MODE ENHANCEMENT MODE ENHANCEMENT MODE
最高工作温度 150 °C 150 °C 150 °C 150 °C 150 °C
最低工作温度 -55 °C -55 °C -55 °C -55 °C -55 °C
封装主体材料 PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
封装形状 ROUND ROUND ROUND ROUND ROUND
封装形式 CYLINDRICAL CYLINDRICAL CYLINDRICAL CYLINDRICAL CYLINDRICAL
极性/信道类型 P-CHANNEL P-CHANNEL P-CHANNEL P-CHANNEL P-CHANNEL
最大功率耗散 (Abs) 1 W 1 W 1 W 1 W 1 W
表面贴装 NO NO NO NO NO
端子形式 THROUGH-HOLE THROUGH-HOLE THROUGH-HOLE THROUGH-HOLE THROUGH-HOLE
端子位置 BOTTOM BOTTOM BOTTOM BOTTOM BOTTOM
晶体管应用 SWITCHING SWITCHING SWITCHING SWITCHING SWITCHING
晶体管元件材料 SILICON SILICON SILICON SILICON SILICON

 
EEWorld订阅号

 
EEWorld服务号

 
汽车开发圈

 
机器人开发圈

About Us 关于我们 客户服务 联系方式 器件索引 网站地图 最新更新 手机版

站点相关: 大学堂 TI培训 Datasheet 电子工程 索引文件: 1267  2781  1965  2004  1157  41  27  59  32  49 

器件索引   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z

北京市海淀区中关村大街18号B座15层1530室 电话:(010)82350740 邮编:100190

电子工程世界版权所有 京B2-20211791 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号 Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved