EEPROM, 32KX8, 250ns, Parallel, CMOS, PQCC32
参数名称 | 属性值 |
是否Rohs认证 | 不符合 |
厂商名称 | Catalyst |
包装说明 | QCCJ, LDCC32,.5X.6 |
Reach Compliance Code | unknown |
最长访问时间 | 250 ns |
命令用户界面 | NO |
数据轮询 | YES |
耐久性 | 100000 Write/Erase Cycles |
JESD-30 代码 | R-PQCC-J32 |
JESD-609代码 | e0 |
内存密度 | 262144 bit |
内存集成电路类型 | EEPROM |
内存宽度 | 8 |
端子数量 | 32 |
字数 | 32768 words |
字数代码 | 32000 |
最高工作温度 | 70 °C |
最低工作温度 | |
组织 | 32KX8 |
封装主体材料 | PLASTIC/EPOXY |
封装代码 | QCCJ |
封装等效代码 | LDCC32,.5X.6 |
封装形状 | RECTANGULAR |
封装形式 | CHIP CARRIER |
页面大小 | 64 words |
并行/串行 | PARALLEL |
电源 | 5 V |
认证状态 | Not Qualified |
最大待机电流 | 0.00015 A |
最大压摆率 | 0.03 mA |
标称供电电压 (Vsup) | 5 V |
表面贴装 | YES |
技术 | CMOS |
温度等级 | COMMERCIAL |
端子面层 | Tin/Lead (Sn/Pb) |
端子形式 | J BEND |
端子节距 | 1.27 mm |
端子位置 | QUAD |
切换位 | YES |
最长写入周期时间 (tWC) | 5 ms |
CAT28C256HN-25 | CAT28C256HT13I-25 | CAT28C256HT14-25 | CAT28C256HT14I-15 | CAT28C256T14I-12 | CAT28C256T14I-15 | CAT28C256T14I-25 | |
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描述 | EEPROM, 32KX8, 250ns, Parallel, CMOS, PQCC32 | EEPROM, 32KX8, 250ns, Parallel, CMOS, PDSO28 | EEPROM, 32KX8, 250ns, Parallel, CMOS, PDSO32 | EEPROM, 32KX8, 150ns, Parallel, CMOS, PDSO32 | EEPROM, 32KX8, 120ns, Parallel, CMOS, PDSO32 | EEPROM, 32KX8, 150ns, Parallel, CMOS, PDSO32 | EEPROM, 32KX8, 250ns, Parallel, CMOS, PDSO32 |
是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 |
厂商名称 | Catalyst | Catalyst | Catalyst | Catalyst | Catalyst | Catalyst | Catalyst |
包装说明 | QCCJ, LDCC32,.5X.6 | TSSOP, TSSOP28,.53,22 | TSSOP, TSSOP32,.56,20 | TSSOP, TSSOP32,.56,20 | TSSOP, TSSOP32,.56,20 | TSSOP, TSSOP32,.56,20 | TSSOP, TSSOP32,.56,20 |
Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown | unknown |
最长访问时间 | 250 ns | 250 ns | 250 ns | 150 ns | 120 ns | 150 ns | 250 ns |
命令用户界面 | NO | NO | NO | NO | NO | NO | NO |
数据轮询 | YES | YES | YES | YES | YES | YES | YES |
耐久性 | 100000 Write/Erase Cycles | 100000 Write/Erase Cycles | 100000 Write/Erase Cycles | 100000 Write/Erase Cycles | 10000 Write/Erase Cycles | 10000 Write/Erase Cycles | 10000 Write/Erase Cycles |
JESD-30 代码 | R-PQCC-J32 | R-PDSO-G28 | R-PDSO-G32 | R-PDSO-G32 | R-PDSO-G32 | R-PDSO-G32 | R-PDSO-G32 |
JESD-609代码 | e0 | e0 | e0 | e0 | e0 | e0 | e0 |
内存密度 | 262144 bit | 262144 bit | 262144 bit | 262144 bit | 262144 bit | 262144 bit | 262144 bit |
内存集成电路类型 | EEPROM | EEPROM | EEPROM | EEPROM | EEPROM | EEPROM | EEPROM |
内存宽度 | 8 | 8 | 8 | 8 | 8 | 8 | 8 |
端子数量 | 32 | 28 | 32 | 32 | 32 | 32 | 32 |
字数 | 32768 words | 32768 words | 32768 words | 32768 words | 32768 words | 32768 words | 32768 words |
字数代码 | 32000 | 32000 | 32000 | 32000 | 32000 | 32000 | 32000 |
最高工作温度 | 70 °C | 85 °C | 70 °C | 85 °C | 85 °C | 85 °C | 85 °C |
最低工作温度 | - | -40 °C | - | -40 °C | -40 °C | -40 °C | -40 °C |
组织 | 32KX8 | 32KX8 | 32KX8 | 32KX8 | 32KX8 | 32KX8 | 32KX8 |
封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
封装代码 | QCCJ | TSSOP | TSSOP | TSSOP | TSSOP | TSSOP | TSSOP |
封装等效代码 | LDCC32,.5X.6 | TSSOP28,.53,22 | TSSOP32,.56,20 | TSSOP32,.56,20 | TSSOP32,.56,20 | TSSOP32,.56,20 | TSSOP32,.56,20 |
封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
封装形式 | CHIP CARRIER | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
页面大小 | 64 words | 64 words | 64 words | 64 words | 64 words | 64 words | 64 words |
并行/串行 | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL |
电源 | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
最大待机电流 | 0.00015 A | 0.00015 A | 0.00015 A | 0.00015 A | 0.00015 A | 0.00015 A | 0.00015 A |
最大压摆率 | 0.03 mA | 0.03 mA | 0.03 mA | 0.03 mA | 0.03 mA | 0.03 mA | 0.03 mA |
标称供电电压 (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
表面贴装 | YES | YES | YES | YES | YES | YES | YES |
技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
温度等级 | COMMERCIAL | INDUSTRIAL | COMMERCIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL |
端子面层 | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
端子形式 | J BEND | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING |
端子节距 | 1.27 mm | 0.55 mm | 0.5 mm | 0.5 mm | 0.5 mm | 0.5 mm | 0.5 mm |
端子位置 | QUAD | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
切换位 | YES | YES | YES | YES | YES | YES | YES |
最长写入周期时间 (tWC) | 5 ms | 5 ms | 5 ms | 5 ms | 5 ms | 5 ms | 5 ms |
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