PARALLEL, 8 BITS INPUT LOADING, 12-BIT DAC, PDSO24, SOL-24
| 参数名称 | 属性值 |
| 是否无铅 | 含铅 |
| 是否Rohs认证 | 不符合 |
| 厂商名称 | ADI(亚德诺半导体) |
| 零件包装代码 | SOIC |
| 包装说明 | SOL-24 |
| 针数 | 24 |
| Reach Compliance Code | compliant |
| 转换器类型 | D/A CONVERTER |
| 输入位码 | BINARY, OFFSET BINARY |
| 输入格式 | PARALLEL, 8 BITS |
| JESD-30 代码 | R-PDSO-G24 |
| JESD-609代码 | e0 |
| 长度 | 15.4 mm |
| 最大线性误差 (EL) | 0.0244% |
| 位数 | 12 |
| 功能数量 | 1 |
| 端子数量 | 24 |
| 最高工作温度 | 70 °C |
| 最低工作温度 | |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | SOP |
| 封装形状 | RECTANGULAR |
| 封装形式 | SMALL OUTLINE |
| 峰值回流温度（摄氏度） | NOT SPECIFIED |
| 认证状态 | Not Qualified |
| 座面最大高度 | 2.65 mm |
| 标称供电电压 | 5 V |
| 表面贴装 | YES |
| 技术 | CMOS |
| 温度等级 | COMMERCIAL |
| 端子面层 | TIN LEAD |
| 端子形式 | GULL WING |
| 端子节距 | 1.27 mm |
| 端子位置 | DUAL |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED |
| 宽度 | 7.5 mm |
| DAC8248BIHS | DAC8248AW/883 | DAC8248AW/883B | DAC8248GBC | DAC8248G | DAC8248BIFP | DAC8248BIGP | |
|---|---|---|---|---|---|---|---|
| 描述 | PARALLEL, 8 BITS INPUT LOADING, 12-BIT DAC, PDSO24, SOL-24 | PARALLEL, 8 BITS INPUT LOADING, 12-BIT DAC, CDIP24, CERDIP-24 | IC DUAL, PARALLEL, WORD INPUT LOADING, 12-BIT DAC, CDIP24, 0.300 INCH, CERDIP-24, Digital to Analog Converter | IC DUAL, PARALLEL, WORD INPUT LOADING, 12-BIT DAC, UUC24, 0.124 X 0.132 INCH, DIE-22, Digital to Analog Converter | PARALLEL, 8 BITS INPUT LOADING, 12-BIT DAC, UUC24, 0.124 X 0.132 INCH, DIE-24 | IC PARALLEL, 8 BITS INPUT LOADING, 12-BIT DAC, PDIP24, PLASTIC, DIP-24, Digital to Analog Converter | IC PARALLEL, 8 BITS INPUT LOADING, 12-BIT DAC, PDIP24, PLASTIC, DIP-24, Digital to Analog Converter |
| 是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 |
| 零件包装代码 | SOIC | DIP | DIP | DIE | DIE | DIP | DIP |
| 包装说明 | SOL-24 | DIP, DIP24,.3 | DIP, | 0.124 X 0.132 INCH, DIE-22 | 0.124 X 0.132 INCH, DIE-24 | PLASTIC, DIP-24 | PLASTIC, DIP-24 |
| 针数 | 24 | 24 | 24 | 22 | 24 | 24 | 24 |
| Reach Compliance Code | compliant | not_compliant | not_compliant | not_compliant | compliant | compliant | compliant |
| 转换器类型 | D/A CONVERTER | D/A CONVERTER | D/A CONVERTER | D/A CONVERTER | D/A CONVERTER | D/A CONVERTER | D/A CONVERTER |
| 输入位码 | BINARY, OFFSET BINARY | BINARY, OFFSET BINARY | BINARY | BINARY, OFFSET BINARY | BINARY, OFFSET BINARY | BINARY, OFFSET BINARY | BINARY, OFFSET BINARY |
| 输入格式 | PARALLEL, 8 BITS | PARALLEL, 8 BITS | PARALLEL, WORD | PARALLEL, WORD | PARALLEL, 8 BITS | PARALLEL, 8 BITS | PARALLEL, 8 BITS |
| JESD-30 代码 | R-PDSO-G24 | R-GDIP-T24 | R-GDIP-T24 | R-XUUC-N24 | R-XUUC-N24 | R-PDIP-T24 | R-PDIP-T24 |
| 最大线性误差 (EL) | 0.0244% | 0.0122% | 0.0122% | 0.0122% | 0.0244% | 0.0244% | 0.0122% |
| 位数 | 12 | 12 | 12 | 12 | 12 | 12 | 12 |
| 功能数量 | 1 | 1 | 2 | 2 | 1 | 1 | 1 |
| 端子数量 | 24 | 24 | 24 | 24 | 24 | 24 | 24 |
| 封装主体材料 | PLASTIC/EPOXY | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED | UNSPECIFIED | UNSPECIFIED | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | SOP | DIP | DIP | DIE | DIE | DIP | DIP |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | SMALL OUTLINE | IN-LINE | IN-LINE | UNCASED CHIP | UNCASED CHIP | IN-LINE | IN-LINE |
| 峰值回流温度（摄氏度） | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 标称供电电压 | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| 表面贴装 | YES | NO | NO | YES | YES | NO | NO |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| 端子形式 | GULL WING | THROUGH-HOLE | THROUGH-HOLE | NO LEAD | NO LEAD | THROUGH-HOLE | THROUGH-HOLE |
| 端子位置 | DUAL | DUAL | DUAL | UPPER | UPPER | DUAL | DUAL |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| 是否无铅 | 含铅 | 含铅 | 含铅 | - | 含铅 | - | - |
| JESD-609代码 | e0 | e0 | e0 | e0 | - | e0 | e0 |
| 最高工作温度 | 70 °C | 125 °C | 125 °C | 25 °C | - | 85 °C | 70 °C |
| 最低工作温度 | - | -55 °C | -55 °C | 25 °C | - | -40 °C | - |
| 座面最大高度 | 2.65 mm | 5.08 mm | 5.08 mm | - | - | 5.33 mm | 5.33 mm |
| 温度等级 | COMMERCIAL | MILITARY | MILITARY | OTHER | - | INDUSTRIAL | COMMERCIAL |
| 端子面层 | TIN LEAD | Tin/Lead (Sn63Pb37) | Tin/Lead (Sn63Pb37) | TIN LEAD | - | TIN LEAD | TIN LEAD |
| 端子节距 | 1.27 mm | 2.54 mm | 2.54 mm | - | - | 2.54 mm | 2.54 mm |
| 宽度 | 7.5 mm | 7.62 mm | 7.62 mm | - | - | 7.62 mm | 7.62 mm |
| ECCN代码 | - | 3A001.A.2.C | 3A001.A.2.C | EAR99 | 3A001.A.5.B | - | - |
| 最大稳定时间 | - | 1 µs | 1 µs | 1 µs | 1 µs | - | - |
| Base Number Matches | - | 1 | 1 | 1 | 1 | 1 | 1 |
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