ASMT-Mxx5 / ASMT-Mxx6
Moonstone
®
1W Power LED Light Source
Data Sheet
Description
The Moonstone
®
1W Power LED Light Source is a high
performance energy efficient device which can handle
high thermal and high driving current. The exposed pad
design has excellent heat transfer from the package to the
motherboard.
The Cool White Power LED is available in various color
temperature ranging from 4000K to 10000K and Warm
White Power LED ranging from 2600K to 4000K.
The low profile package design is suitable for a wide variety
of applications especially where height is a constraint.
The package is compatible with reflow soldering. This
will give more freedom and flexibility to the light source
designer.
Features
•
Available in Cool White & Warm White color
•
Energy efficient
•
Exposed pad for excellent heat transfer
•
Suitable for reflow soldering process
•
High current operation
•
•
•
•
•
•
Long operation life
Wide viewing angle
Silicone encapsulation
Non-ESD sensitive (threshold > 16KV)
MSL 4 products
Available in both electrically isolated and non-isolated
metal heat slug
Applications
•
Sign backlight
•
Safety, exit and emergency sign lightings
•
Specialty lighting such as task lighting and reading
lights
•
Retail display
•
Commercial lighting
•
Accent or marker lightings, strip or step lightings
•
Portable lightings, bicycle head lamp, torch lights.
•
Decorative lighting
•
Architectural lighting
•
Pathway lighting
•
Street lighting
•
Pedestrian street lighting
•
Tunnel lighting
Specifications
•
InGaN Technology
•
4.0 V (max) at 350 mA
•
110° viewing angle
Package Dimensions
10.00
1
Anode
2 Cathode
3
Heat
Sink
3.30
8.50
Metal Slug
3
Ø
5.26
10.60
8.50
Ø 8.00
1.27
LED
+
ZENER
2.00
1.30
1
5.08
2
0.81
5.25
Notes:
1. All dimensions are in millimeters.
2. Tolerance is ±0.1 mm unless otherwise specified.
3. Metal slug is connected to anode for electrically non-isolated option.
Figure 1. ASMT-Mxx5 / ASMT-Mxx6 package outline
drawing.
2
Part
Numbering
System
A SM T – M x
1
x
2
x
3
– N x
4
x
5
x
6
x
7
Packaging Option
Color
Bin Selection
Max Flux Bin
Min Flux Bin
Heat Sink
5 – Electrically Non-isolated
6 – Electrically Isolated
Silicone Type
0 – Non-diffused
B – Diffused
Color
W – Cool White
Y – Warm White
Note:
1. Please refer to Page 7 for selection details.
Device Selection Guide (T
J
=
25°C)
Luminous
Flux,
Φ
v[1,2]
(lm)
Part
Number
ASMT-MW05-NLM00
ASMT-MW06-NLM00
ASMT-MY05-NKM00
ASMT-MY06-NKM00
ASMT-MWB6-NLM00
ASMT-MYB6-NKM00
Cool White Diffused
Warm White Diffused
73.0
56.0
70.0
65.0
124.0
124.0
350
350
InGaN
InGaN
Warm White
56.0
73.0
124.0
350
InGaN
Color
Cool White
Min.
73.0
Typ.
80.0
Max.
124.0
Test
Current
(mA)
350
Dice
Technology
InGaN
Electrically
Isolated Metal
Slug
No
Yes
No
Yes
Yes
Yes
Notes:
1.
Φ
V
is the total luminous flux output as measured with an integrating sphere at 25ms mono pulse condition.
2. Flux tolerance is ±10%.
3
Absolute Maximum
Ratings
Parameter
DC Forward Current
[1]
Peak Pulsing Current
[2]
Power Dissipation
LED Junction Temperature
Operating Metal Slug Temperature Range at 350 mA
Storage Temperature Range
Soldering Temperature
Reverse Voltage
[3]
Note:
1. Derate linearly based on Figure 8.
2. Pulse condition: duty factor = 10%, Frequency = 1 kHz.
3. Not designed for reverse bias operation.
ASMT-Mxx5 / ASMT-Mxx6
500
1000
2000
125
-40 to +110
-40 to +120
Refer to Figure 12
Not recommended
Units
mA
mA
mW
°C
°C
°C
Optical
Characteristics
at
350
mA (T
J
=
25°C)
Correlated Color
Temperature,
CCT
(Kelvin)
Part
Number
ASMT-MW05-NLM00
ASMT-MW06-NLM00
ASMT-MY05-NKM00
ASMT-MY06-NKM00
ASMT-MWB6-NLM00
ASMT-MYB6-NKM00
Cool White Diffused
Warm White Diffused
4000
2600
10000
4000
110
110
56
52
Warm White
2600
4000
110
58
Viewing Angle,
2θ
½ [2]
(°)
Typ.
110
Luminous
Efficiency
(lm/W)
Typ.
63
Color
Cool White
Min.
4000
Max.
10000
Notes:
1.
θ
½
is the off-axis angle where the luminous intensity is ½ the peak intensity.
Electrical Characteristic
at
350
mA (T
J
=
25°C)
Forward Voltage,
V
F
(Volts)
Dice Type
InGaN
Thermal
Resistance,
Rθ
j-ms
(°C/W)
[1]
Typ.
3.6
Min.
3.0
Max.
4.0
Typ.
10
Note:
1. Rθ
j-ms
is Thermal Resistance from LED junction to metal slug.
4
1.0
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0.0
380
430
480
530 580 630
WAVELENGTH - nm
1.4
RELATIVE LUMINOUS
FLUX
(NORMALIZED AT
350
mA)
RELATIVE
INTENSITY
WARM WHITE
COOL
WHITE
1.2
1
0.8
0.6
0.4
0.2
0
680
730
780
0
50
100 150
200 250 300 350
400 450 500
DC FORWARD
CURRENT
- mA
Figure
2. Relative
Intensity vs. Wavelength.
Figure
3. Relative Luminous
Flux vs. Mono Pulse
Current.
500
450
400
350
300
250
200
150
100
50
0
1
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0
FORWARD
CURRENT
- mA
NORMALIZED
INTENSITY
0
0.5
1
1.5
2
2.5
FORWARD VOLTAGE - V
3
3.5
4
-90
-60
-30
0
30
60
ANGULAR DISPLACEMENT - DEGREES
90
Figure 4. Forward
Current
vs. Forward Voltage.
Figure 5.
Radiation
Pattern.
1.4
1.2
PULSE
CURRENT,
I
P
- A
1.0
0.8
0.6
0.4
0.2
D=
t
p
T
t
p
I
F
T
10
100
D=
0.05
0.10
0.25
0.50
1.00
1.4
1.2
PULSE
CURRENT,
I
P
- A
1.0
0.8
0.6
0.4
0.2
t
D=
p
T
t
p
I
F
T
D=
0.05
0.10
0.25
0.50
1.00
0.0
0.00001 0.0001 0.001 0.01
0.1
1
- sec
PULSE DURATION, t
p
0.0
0.00001 0.0001 0.001 0.01
0.1
1
PULSE DURATION, t
p
- sec
10
100
Figure 6. Maximum pulse current vs. ambient temperature. Derated based
on T
A
=
25°C, Rθ
J-A
=
30°C/W.
Figure
7.
Maximum pulse current vs. ambient temperature. Derated based
on T
A
=
85°C, Rθ
J-A
=
30°C/W.
5
FPGA/CPLD
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