Bus Driver, BCT/FBT Series, 2-Func, 4-Bit, Inverted Output, BICMOS, CDFP20, CERPACK-20
| 参数名称 | 属性值 |
| 是否Rohs认证 | 不符合 |
| 厂商名称 | IDT (Integrated Device Technology) |
| 零件包装代码 | DFP |
| 包装说明 | DFP, FL20,.3 |
| 针数 | 20 |
| Reach Compliance Code | not_compliant |
| 控制类型 | ENABLE LOW |
| 系列 | BCT/FBT |
| JESD-30 代码 | R-GDFP-F20 |
| JESD-609代码 | e0 |
| 负载电容（CL） | 50 pF |
| 逻辑集成电路类型 | BUS DRIVER |
| 最大I（ol） | 0.001 A |
| 位数 | 4 |
| 功能数量 | 2 |
| 端口数量 | 2 |
| 端子数量 | 20 |
| 最高工作温度 | 70 °C |
| 最低工作温度 | |
| 输出特性 | 3-STATE WITH SERIES RESISTOR |
| 输出极性 | INVERTED |
| 封装主体材料 | CERAMIC, GLASS-SEALED |
| 封装代码 | DFP |
| 封装等效代码 | FL20,.3 |
| 封装形状 | RECTANGULAR |
| 封装形式 | FLATPACK |
| 电源 | 5 V |
| 最大电源电流（ICC） | 1.5 mA |
| 认证状态 | Not Qualified |
| 座面最大高度 | 2.337 mm |
| 最大供电电压 (Vsup) | 5.5 V |
| 最小供电电压 (Vsup) | 4.5 V |
| 标称供电电压 (Vsup) | 5 V |
| 表面贴装 | YES |
| 技术 | BICMOS |
| 温度等级 | COMMERCIAL |
| 端子面层 | Tin/Lead (Sn/Pb) |
| 端子形式 | FLAT |
| 端子节距 | 1.27 mm |
| 端子位置 | DUAL |
| 宽度 | 6.9215 mm |
| IDT74FBT2240CE | IDT74FBT2240CSO | IDT54FBT2240CEB | IDT54FBT2240CDB | IDT54FBT2240CLB | IDT74FBT2240CD | IDT74FBT2240CL | IDT74FBT2240CP | |
|---|---|---|---|---|---|---|---|---|
| 描述 | Bus Driver, BCT/FBT Series, 2-Func, 4-Bit, Inverted Output, BICMOS, CDFP20, CERPACK-20 | Bus Driver, BCT/FBT Series, 2-Func, 4-Bit, Inverted Output, BICMOS, PDSO20, 0.300 INCH, SOIC-20 | Bus Driver, BCT/FBT Series, 2-Func, 4-Bit, Inverted Output, BICMOS, CDFP20, CERPACK-20 | Bus Driver, BCT/FBT Series, 2-Func, 4-Bit, Inverted Output, BICMOS, CDIP20, 0.300 INCH, CERDIP-20 | Bus Driver, BCT/FBT Series, 2-Func, 4-Bit, Inverted Output, BICMOS, CQCC20, LCC-20 | Bus Driver, BCT/FBT Series, 2-Func, 4-Bit, Inverted Output, BICMOS, CDIP20, 0.300 INCH, CERDIP-20 | Bus Driver, BCT/FBT Series, 2-Func, 4-Bit, Inverted Output, BICMOS, CQCC20, LCC-20 | Bus Driver, BCT/FBT Series, 2-Func, 4-Bit, Inverted Output, BICMOS, PDIP20, 0.300 INCH, PLASTIC, DIP-20 |
| 是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 |
| 零件包装代码 | DFP | SOIC | DFP | DIP | QLCC | DIP | QLCC | DIP |
| 包装说明 | DFP, FL20,.3 | SOP, SOP20,.4 | DFP, FL20,.3 | DIP, DIP20,.3 | QCCN, LCC20,.35SQ | DIP, DIP20,.3 | QCCN, LCC20,.35SQ | DIP, DIP20,.3 |
| 针数 | 20 | 20 | 20 | 20 | 20 | 20 | 20 | 20 |
| Reach Compliance Code | not_compliant | not_compliant | not_compliant | not_compliant | not_compliant | not_compliant | not_compliant | not_compliant |
| 控制类型 | ENABLE LOW | ENABLE LOW | ENABLE LOW | ENABLE LOW | ENABLE LOW | ENABLE LOW | ENABLE LOW | ENABLE LOW |
| 系列 | BCT/FBT | BCT/FBT | BCT/FBT | BCT/FBT | BCT/FBT | BCT/FBT | BCT/FBT | BCT/FBT |
| JESD-30 代码 | R-GDFP-F20 | R-PDSO-G20 | R-GDFP-F20 | R-GDIP-T20 | S-CQCC-N20 | R-GDIP-T20 | S-CQCC-N20 | R-PDIP-T20 |
| JESD-609代码 | e0 | e0 | e0 | e0 | e0 | e0 | e0 | e0 |
| 负载电容（CL） | 50 pF | 50 pF | 50 pF | 50 pF | 50 pF | 50 pF | 50 pF | 50 pF |
| 逻辑集成电路类型 | BUS DRIVER | BUS DRIVER | BUS DRIVER | BUS DRIVER | BUS DRIVER | BUS DRIVER | BUS DRIVER | BUS DRIVER |
| 最大I（ol） | 0.001 A | 0.001 A | 0.012 A | 0.012 A | 0.032 A | 0.001 A | 0.001 A | 0.001 A |
| 位数 | 4 | 4 | 4 | 4 | 4 | 4 | 4 | 4 |
| 功能数量 | 2 | 2 | 2 | 2 | 2 | 2 | 2 | 2 |
| 端口数量 | 2 | 2 | 2 | 2 | 2 | 2 | 2 | 2 |
| 端子数量 | 20 | 20 | 20 | 20 | 20 | 20 | 20 | 20 |
| 最高工作温度 | 70 °C | 70 °C | 125 °C | 125 °C | 125 °C | 70 °C | 70 °C | 70 °C |
| 输出特性 | 3-STATE WITH SERIES RESISTOR | 3-STATE WITH SERIES RESISTOR | 3-STATE WITH SERIES RESISTOR | 3-STATE WITH SERIES RESISTOR | 3-STATE WITH SERIES RESISTOR | 3-STATE WITH SERIES RESISTOR | 3-STATE WITH SERIES RESISTOR | 3-STATE WITH SERIES RESISTOR |
| 输出极性 | INVERTED | INVERTED | INVERTED | INVERTED | INVERTED | INVERTED | INVERTED | INVERTED |
| 封装主体材料 | CERAMIC, GLASS-SEALED | PLASTIC/EPOXY | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, GLASS-SEALED | CERAMIC, METAL-SEALED COFIRED | PLASTIC/EPOXY |
| 封装代码 | DFP | SOP | DFP | DIP | QCCN | DIP | QCCN | DIP |
| 封装等效代码 | FL20,.3 | SOP20,.4 | FL20,.3 | DIP20,.3 | LCC20,.35SQ | DIP20,.3 | LCC20,.35SQ | DIP20,.3 |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | SQUARE | RECTANGULAR | SQUARE | RECTANGULAR |
| 封装形式 | FLATPACK | SMALL OUTLINE | FLATPACK | IN-LINE | CHIP CARRIER | IN-LINE | CHIP CARRIER | IN-LINE |
| 电源 | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| 最大电源电流（ICC） | 1.5 mA | 1.5 mA | 1.5 mA | 1.5 mA | 1.5 mA | 1.5 mA | 1.5 mA | 1.5 mA |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 座面最大高度 | 2.337 mm | 2.65 mm | 2.337 mm | 4.445 mm | 2.54 mm | 4.445 mm | 2.54 mm | 4.191 mm |
| 最大供电电压 (Vsup) | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
| 最小供电电压 (Vsup) | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V |
| 标称供电电压 (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| 表面贴装 | YES | YES | YES | NO | YES | NO | YES | NO |
| 技术 | BICMOS | BICMOS | BICMOS | BICMOS | BICMOS | BICMOS | BICMOS | BICMOS |
| 温度等级 | COMMERCIAL | COMMERCIAL | MILITARY | MILITARY | MILITARY | COMMERCIAL | COMMERCIAL | COMMERCIAL |
| 端子面层 | Tin/Lead (Sn/Pb) | Tin/Lead (Sn85Pb15) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn85Pb15) |
| 端子形式 | FLAT | GULL WING | FLAT | THROUGH-HOLE | NO LEAD | THROUGH-HOLE | NO LEAD | THROUGH-HOLE |
| 端子节距 | 1.27 mm | 1.27 mm | 1.27 mm | 2.54 mm | 1.27 mm | 2.54 mm | 1.27 mm | 2.54 mm |
| 端子位置 | DUAL | DUAL | DUAL | DUAL | QUAD | DUAL | QUAD | DUAL |
| 宽度 | 6.9215 mm | 7.5 mm | 6.9215 mm | 7.62 mm | 8.89 mm | 7.62 mm | 8.89 mm | 7.62 mm |
| 厂商名称 | IDT (Integrated Device Technology) | - | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) |
| 长度 | - | 12.8 mm | - | 25.3365 mm | 8.89 mm | 25.3365 mm | 8.89 mm | 26.1874 mm |
微控制器 MCU
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stm32/stm8
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