8-BIT, UVPROM, 2.1MHz, MICROCONTROLLER, CDIP42, WINDOWED, CERAMIC, SDIP-42
| 参数名称 | 属性值 |
| 厂商名称 | NXP(恩智浦) |
| 零件包装代码 | DIP |
| 包装说明 | WSDIP, |
| 针数 | 42 |
| Reach Compliance Code | unknown |
| 具有ADC | YES |
| 地址总线宽度 | |
| 位大小 | 8 |
| 最大时钟频率 | 4.2 MHz |
| DAC 通道 | NO |
| DMA 通道 | NO |
| 外部数据总线宽度 | |
| JESD-30 代码 | R-CDIP-T42 |
| 长度 | 36.83 mm |
| I/O 线路数量 | 13 |
| 端子数量 | 42 |
| 最高工作温度 | 70 °C |
| 最低工作温度 | |
| PWM 通道 | NO |
| 封装主体材料 | CERAMIC, METAL-SEALED COFIRED |
| 封装代码 | WSDIP |
| 封装形状 | RECTANGULAR |
| 封装形式 | IN-LINE, WINDOW, SHRINK PITCH |
| 认证状态 | Not Qualified |
| ROM可编程性 | UVPROM |
| 座面最大高度 | 5.08 mm |
| 速度 | 2.1 MHz |
| 最大供电电压 | 5.5 V |
| 最小供电电压 | 4.5 V |
| 标称供电电压 | 5 V |
| 表面贴装 | NO |
| 技术 | HCMOS |
| 温度等级 | COMMERCIAL |
| 端子形式 | THROUGH-HOLE |
| 端子节距 | 1.778 mm |
| 端子位置 | DUAL |
| 宽度 | 15.24 mm |
| uPs/uCs/外围集成电路类型 | MICROCONTROLLER |
| MC68HC705L2K | MC68HC05L2B | MC68HC05L2CB | MC68HC705L2CB | MC68HC705L2B | |
|---|---|---|---|---|---|
| 描述 | 8-BIT, UVPROM, 2.1MHz, MICROCONTROLLER, CDIP42, WINDOWED, CERAMIC, SDIP-42 | 8-BIT, MROM, 2.1MHz, MICROCONTROLLER, PDIP42, SHRINK, PLASTIC, DIP-42 | IC,MICROCONTROLLER,8-BIT,6805 CPU,CMOS,SDIP,42PIN,PLASTIC | 8-BIT, OTPROM, 2.1MHz, MICROCONTROLLER, PDIP42, SHRINK, PLASTIC, DIP-42 | 8-BIT, OTPROM, 2.1MHz, MICROCONTROLLER, PDIP42, SHRINK, PLASTIC, DIP-42 |
| 零件包装代码 | DIP | DIP | DIP | DIP | DIP |
| 包装说明 | WSDIP, | SDIP, | SDIP, | SDIP, | SDIP, |
| 针数 | 42 | 42 | 42 | 42 | 42 |
| Reach Compliance Code | unknown | unknown | unknown | unknown | unknown |
| 具有ADC | YES | YES | YES | YES | YES |
| 位大小 | 8 | 8 | 8 | 8 | 8 |
| 最大时钟频率 | 4.2 MHz | 4.2 MHz | 4.2 MHz | 4.2 MHz | 4.2 MHz |
| DAC 通道 | NO | NO | NO | NO | NO |
| DMA 通道 | NO | NO | NO | NO | NO |
| JESD-30 代码 | R-CDIP-T42 | R-PDIP-T42 | R-PDIP-T42 | R-PDIP-T42 | R-PDIP-T42 |
| 长度 | 36.83 mm | 36.83 mm | 36.83 mm | 36.83 mm | 36.83 mm |
| I/O 线路数量 | 13 | 13 | 13 | 13 | 13 |
| 端子数量 | 42 | 42 | 42 | 42 | 42 |
| 最高工作温度 | 70 °C | 70 °C | 85 °C | 85 °C | 70 °C |
| PWM 通道 | NO | NO | NO | NO | NO |
| 封装主体材料 | CERAMIC, METAL-SEALED COFIRED | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | WSDIP | SDIP | SDIP | SDIP | SDIP |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | IN-LINE, WINDOW, SHRINK PITCH | IN-LINE, SHRINK PITCH | IN-LINE, SHRINK PITCH | IN-LINE, SHRINK PITCH | IN-LINE, SHRINK PITCH |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| ROM可编程性 | UVPROM | MROM | MROM | OTPROM | OTPROM |
| 座面最大高度 | 5.08 mm | 5.08 mm | 5.08 mm | 5.08 mm | 5.08 mm |
| 速度 | 2.1 MHz | 2.1 MHz | 2.1 MHz | 2.1 MHz | 2.1 MHz |
| 最大供电电压 | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
| 最小供电电压 | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V |
| 标称供电电压 | 5 V | 5 V | 5 V | 5 V | 5 V |
| 表面贴装 | NO | NO | NO | NO | NO |
| 技术 | HCMOS | HCMOS | HCMOS | HCMOS | HCMOS |
| 温度等级 | COMMERCIAL | COMMERCIAL | INDUSTRIAL | INDUSTRIAL | COMMERCIAL |
| 端子形式 | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE |
| 端子节距 | 1.778 mm | 1.778 mm | 1.778 mm | 1.778 mm | 1.778 mm |
| 端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL |
| 宽度 | 15.24 mm | 15.24 mm | 15.24 mm | 15.24 mm | 15.24 mm |
| uPs/uCs/外围集成电路类型 | MICROCONTROLLER | MICROCONTROLLER | MICROCONTROLLER | MICROCONTROLLER | MICROCONTROLLER |
| 厂商名称 | NXP(恩智浦) | - | NXP(恩智浦) | NXP(恩智浦) | NXP(恩智浦) |
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